Bonded hardware rapid cure system
Embodiments of systems and methods for adhering hardware to a substrate, wherein the method comprises coupling the hardware with a rigid tube or an elastomeric tube, applying adhesive onto a bonding surface of the hardware, inserting the rigid tube or the elastomeric tube through an aperture of the substrate until a surface of the substrate contacts the bonding surface having adhesive applied thereon, and adhering the hardware to the substrate by applying localized heat through a heating component disposed within the rigid tube or the elastomeric tube.
1. A method of adhering hardware to a substrate comprising:
coupling the hardware with a rigid tube or an elastomeric tube;
applying adhesive onto a bonding surface of the hardware;
inserting the rigid tube or the elastomeric tube through an aperture of the substrate until a surface of the substrate contacts the bonding surface having adhesive applied thereon;
adhering the hardware to the substrate by applying localized heat through a heating component disposed within the rigid tube or the elastomeric tube; and
removing the rigid tube or the elastomeric tube from the hardware.
2. The method of claim 1 , wherein the hardware is selected from nutplates, bushings, threaded inserts, sleeves, mounts, and brackets.
3. The method of claim 1 , wherein the substrate is a panel comprising glass, ceramic composite, metal, plastic, aluminum, titanium, fiber reinforced polymer matrix composite, ceramic matrix composite, or combinations thereof.
4. The method of claim 1 , wherein the heating component comprises a cartridge heater.
5. The method of claim 1 , wherein the adhesive comprises an epoxy adhesive, an acrylic adhesive, or a polyurethane adhesive.
6. The method of claim 1 , wherein the elastomeric tube comprises one or more components selected from silicone rubber, polyurethane elastomer, fluoroelastomer, and perfluoroelastomer.
7. The method of claim 1 , wherein removal of the rigid tube is achieved by unthreading the rigid tube from the hardware.
8. The method of claim 1 , wherein removal of the elastomeric tube is achieved by applying a pulling force along a longitudinal direction of the elastomeric tube to disengage the elastomeric tube from a friction or compression fit securing the elastomeric tube to the hardware.
9. The method of claim 1 , wherein the heating component is controlled with a heater controller, the heater controller configured to monitor and regulate a heating profile through a feedback mechanism with thermal sensors.
10. The method of claim 1 , wherein the substrate forms a component of on an aircraft, a spacecraft, a watercraft, or an automobile.
11. An adhesive bonded hardware cure system for securing hardware to a substrate comprising at least one aperture, the hardware cure system comprising:
a rigid tube operable to engage the hardware at one end and extend through one aperture of the substrate;
a securing mechanism configured to secure the hardware in contact with the substrate; and
a heating component operable to deliver heat to a bonding surface of the hardware, wherein the heating component is operable to be coaxially disposed within the rigid tube.
12. The system of claim 11 , wherein the securing mechanism comprises an elastomeric tube disposed around the rigid tube.
13. The system of claim 12 , wherein the elastomeric tube comprises one or more components selected from silicone rubber, polyurethane elastomer, fluoroelastomer, and perfluoroelastomer.
14. The system of claim 12 , wherein the elastomeric tube comprises a section having a diameter greater than a corresponding interior diameter of the hardware.
15. The system of claim 11 , wherein the heating component comprises a cartridge heater.
16. The system of claim 11 , wherein the hardware is selected from nutplates, bushings, threaded inserts, sleeves, mounts, and brackets.
17. The system of claim 11 , wherein the substrate is a panel comprising glass, ceramic composite, metal, plastic, aluminum, titanium, fiber reinforced polymer matrix composite, ceramic matrix composite, or combinations thereof.
18. The system of claim 11 , wherein the hardware cure system further comprises an adhesive, the adhesive comprising one or more of an epoxy adhesive, an acrylic adhesive, a polyurethane adhesive.
19. The system of claim 11 , wherein the hardware cure system further comprises a heater controller, the heater controller configured to control the heating component and monitor and regulate a heating profile through a feedback mechanism with thermal sensors.
20. The system of claim 11 , wherein the substrate forms a component of on an aircraft, a spacecraft, a watercraft, or an automobile.