Semiconductor device and power conversion apparatus
Provided is a semiconductor device in which, in a case where a metallic plate (a conductive member) is bonded by being sintered to a semiconductor chip having an IGBT gate structure, an excess stress is less likely to be generated in a gate wiring section of the semiconductor chip even when pressure is applied in a sinter bonding process, so that a characteristic failure is reduced. The semiconductor device according to the present invention is characterized by: being provided with a semiconductor chip having a gate structure represented by an IGBT; including first gate wiring and second gate wiring formed on the surface of the semiconductor chip; and including an emitter electrode disposed so as to cover the first gate wiring and a sintered layer disposed above the emitter electrode, wherein a multilayer structure formed by including at least the emitter electrode and the sintered layer on the surface of the semiconductor chip continuously exists over a range including an emitter electrode connecting contact and gate wiring regions.
1. A semiconductor device comprising:
a semiconductor chip;
a first gate wiring and a second gate wiring formed on a front surface of the semiconductor chip;
an emitter electrode arranged so as to cover the first gate wiring; and
a sintered layer arranged above the emitter electrode,
wherein a multilayer structure consisting of at least the emitter electrode and the sintered layer is continuously present over a range including an emitter electrode connecting contact and a gate wiring region on the front surface of the semiconductor chip.
2. The semiconductor device according to claim 1 , wherein
the semiconductor chip is joined to a collector wiring on a common ceramic substrate together with a diode chip by another sintered layer separated from the sintered layer.
3. The semiconductor device according to claim 1 , wherein
the multilayer structure is configured to include an electrode layer, which contains nickel (Ni) as a component, between the emitter electrode and the sintered layer.
4. The semiconductor device according to claim 3 , wherein
the semiconductor chip is joined to a collector wiring on a common ceramic substrate together with a diode chip by another sintered layer separated from the sintered layer.
5. The semiconductor device according to claim 1 , wherein
the semiconductor chip is configured to include a gate having a side gate structure.
6. The semiconductor device according to claim 5 , wherein
the semiconductor chip is joined to a collector wiring on a common ceramic substrate together with a diode chip by another sintered layer separated from the sintered layer.
7. The semiconductor device according to claim 5 , wherein
the side gate structure is a trench gate structure in which the gate is a trench gate.
8. The semiconductor device according to claim 7 , wherein
the semiconductor chip is joined to a collector wiring on a common ceramic substrate together with a diode chip by another sintered layer separated from the sintered layer.
9. The semiconductor device according to claim 7 , wherein
the first gate wiring is a trench-buried type gate wiring which is connected to the trench gate.
10. The semiconductor device according to claim 9 , wherein
the semiconductor chip is joined to a collector wiring on a common ceramic substrate together with a diode chip by another sintered layer separated from the sintered layer.
11. The semiconductor device according to claim 5 , wherein
the side gate structure is a sidewall gate structure in which the gate is a sidewall gate.
12. The semiconductor device according to claim 11 , wherein
the semiconductor chip is joined to a collector wiring on a common ceramic substrate together with a diode chip by another sintered layer separated from the sintered layer.
13. The semiconductor device according to claim 11 , wherein
the first gate wiring is a buried sidewall-type gate wiring which is connected to the sidewall gate.
14. The semiconductor device according to claim 13 , wherein
the semiconductor chip is joined to a collector wiring on a common ceramic substrate together with a diode chip by another sintered layer separated from the sintered layer.
15. A power conversion apparatus, which receives DC power from an outside as an input, converts the input DC power into AC power, and outputs the AC power, the power conversion apparatus comprising:
a pair of DC terminals configured to receive the DC power as the input; and
AC terminals configured to output the AC power, the AC terminals as many as a number of AC phases related to the AC power,
for each of the AC terminals provided as many as the number of phases, the power conversion apparatus further being configured such that a series circuit having a configuration in which two parallel circuits each of which is obtained by connecting a switching element and a diode having a polarity opposite to a polarity of the switching element to each other in parallel are connected in series is connected between one of the pair of DC terminals and the other, and an interconnection point of the two parallel circuits forming the series circuit is connected to the AC terminal of a phase corresponding to the series circuit,
wherein the parallel circuit is configured using the semiconductor device according to claim 1 .
16. The power conversion apparatus according to claim 15 , wherein
the multilayer structure is configured to include an electrode layer, which contains nickel (Ni) as a component, between the emitter electrode and the sintered layer.
17. The power conversion apparatus according to claim 15 , wherein
the semiconductor chip is configured to include a gate having a side gate structure.
18. The power conversion apparatus according to claim 15 , wherein
the switching element is configured using the semiconductor chip, and
the diode is configured using a diode chip joined to a collector wiring on a common ceramic substrate together with the semiconductor chip by another sintered layer separated from the sintered layer.
19. The power conversion apparatus according to claim 18 , wherein
the multilayer structure is configured to include an electrode layer, which contains nickel (Ni) as a component, between the emitter electrode and the sintered layer.
20. The power conversion apparatus according to claim 18 , wherein
the semiconductor chip is configured to include a gate having a side gate structure.