Engineering reversible elasticity in ductile or brittle thin films and products resulting from said engineering
The present disclosure relates to how to engineer reversible elasticity in thin films and/or layers and/or substrates, using a repeated Y-shaped motif, which is cut out through the film and/or layer and/or substrate. As an example, using a 75 μm thick polyimide (PI) foil, macroscopic dog-bone shaped structures with a range of geometrical parameters of the Y shape have been prepared according to an embodiment of the present disclosure. The tensile strain response of the film at its point of fracture was then recorded. The structures were also confirmed using finite element modeling. Upon stretching, the PI ligaments locally deflect out of plane, allowing the foil to macroscopically stretch.
1. A multilayer substrate comprising:
at least a bottom layer of electrically isolating, intrinsically non-elastic material and, on said bottom layer, a top layer of electrically conductive, intrinsically non-elastic material, said bottom and top layers forming opposite exposed main surfaces of the multilayer substrate;
a plurality of through cuts each extending through a thickness of each of said bottom and top layers, the plurality of through cuts in an unstretched state forming a pattern of open surface areas in the opposite exposed main surfaces of the multilayer substrate;
wherein each of said through cuts has projections on the opposite exposed main surfaces of said multilayer substrate, and the projections are shaped so as to comprise at least three branches extending from a common portion, each branch having a length and a width that form said open surface areas.
2. The multilayer substrate as claimed in claim 1 , wherein, on said opposite exposed main surfaces of said multilayer substrate, at least two of the branches of at least one of said through cuts are of equal length.
3. The multilayer substrate as claimed in claim 1 , wherein, on said opposite exposed main surfaces of said multilayer substrate, at least two of the branches of at least one of said through cuts have equal width.
4. The multilayer substrate as claimed in claim 1 , wherein, on said opposite exposed main surfaces of said multilayer substrate, each of the branches of at least one of said through cuts has a width between 100 nm and 1 cm.
5. The multilayer substrate as claimed in claim 1 , wherein said multilayer substrate extends along a length direction (X) and a width direction (Y) substantially perpendicular to said length direction (X), and wherein, on said opposite exposed main surfaces of said multilayer substrate, for at least two of said through cuts, two respective branches extend along a direction which is parallel to one of said directions (X) or (Y).
6. The multilayer substrate as claimed in claim 1 , wherein, on said opposite exposed main surfaces of said multilayer substrate, the plurality of through cuts includes N through cuts/cm 2 , with N ranging from 2 to 100,000,000.
7. The multilayer substrate as claimed in claim 1 , wherein the thickness of said bottom layer is comprised between 1 nm and 500 μm.
8. The multilayer substrate as claimed in claim 1 , wherein said top layer is formed of a conductive metal oxide.
9. The multilayer substrate as claimed in claim 1 , wherein the thickness of said top layer is comprised between 1 nm and 500 μm.
10. The multilayer substrate as claimed in claim 1 , wherein the multilayer substrate forms a stretchable electrode.
11. The multilayer substrate as claimed in claim 1 , wherein a transparency of the opposite exposed main surfaces of the multilayer substrate, which is a ratio between the open surface areas over a total surface area, ranges from 25% to 90%.
12. A method for engineering elasticity, said method comprising:
providing a multilayer substrate comprising at least a bottom layer of electrically isolating, intrinsically non-elastic material and, on said bottom layer, a top layer of electrically conductive, intrinsically non-elastic material, said bottom and top layers forming opposite exposed main surfaces of the multilayer substrate;
forming a plurality of through cuts in said multilayer substrate, each through cut extending through a thickness of each of said bottom and top layers, the plurality of through cuts in an unstretched state forming a pattern of open surface areas in the opposite exposed main surfaces of the multilayer substrate;
wherein each of said through cuts has projections on the opposite exposed main surfaces of said multilayer substrate and the projections are shaped so as to comprise at least three branches extending from a common portion, each branch having a length and a width that form said open surface areas.
13. The method as claimed in claim 12 , wherein forming said plurality of through cuts includes forming at least one through cut having, on said opposite exposed main surfaces of said multilayer substrate, at least two branches of equal length.
14. The method as claimed claim 12 , wherein forming said plurality of through cuts includes forming at least one through cut having, on said opposite exposed main surfaces of said multilayer substrate, at least two branches of equal width.
15. The method as claimed in claim 12 , wherein said multilayer substrate extends along a length direction (X) and a width direction (Y) substantially perpendicular to said length direction (X), and wherein forming said plurality of through cuts includes forming, on said opposite exposed main surfaces of said multilayer substrate, for at least two of said through cuts, two respective branches extending along a direction which is parallel to one of said directions (X) or (Y).
16. The method as claimed in claim 12 , wherein forming the plurality of through cuts includes forming, on said opposite exposed main surfaces of said multilayer substrate, N through cuts/cm 2 , with N ranging from 2 to 100,000,000.
17. The method as claimed in claim 12 , wherein the thickness of said bottom layer is comprised between 1 nm and 500 μm.
18. The method as claimed in claim 12 , wherein said top layer is formed of a conductive metal oxide.
19. The method as claimed in claim 12 , wherein the thickness of said top layer is comprised between 1 nm and 500 μm.
20. The method as claimed in claim 12 , wherein the multilayer substrate forms a stretchable electrode.