Apparatus and method for injection molding encapsulation

1. An injection mold for encapsulating a substrate, the injection mold comprising:

a lower mold component;

an upper mold component adapted to form an encapsulation mold cavity at an edge of the substrate when the upper mold component engages the lower mold component, wherein the lower mold component comprises a substrate support and wherein the upper mold component comprises a recess;

a tiltable insert sized and shaped to slide within the recess and having a substrate-contacting surface defining an area of the substrate contacted by the insert, the insert adapted to tilt within the recess relative to the upper and lower mold components to tiltably cooperate with the upper mold component to form a seal for the encapsulation mold cavity; and

a plurality of pressure-exerting actuators each comprising a pressure coupling member to contact the insert and each actuator being configured to independently apply pressure on the substrate via the insert, wherein the plurality of pressure-exerting actuators are adapted to equilibrate a total predetermined pressure exerted by the insert substantially evenly across the area of the substrate-contacting surface in response to local variations in thickness of the substrate thereby providing a tilting positional adjustment of the insert to compensate said variations.

2. The injection mold of claim 1 , wherein the insert comprises a lower portion having a side surface defining a compensation space with a recess wall, said surface having a height such that its top edge is displaced by a lateral distance equal to or less than the compensation space when the insert is tilted.

3. The injection mold of claim 2 , wherein the insert further comprises an upper portion, said upper portion having a width smaller than said lower portion.

4. The injection mold of claim 1 , wherein the pressure coupling member is tiltable in response to tilting of the insert.

5. The injection mold of claim 1 , wherein the insert further comprises an upper portion, said upper portion having a width smaller than said lower portion.

6. The injection mold of claim 1 , wherein the pressure-exerting actuators are configured to be flexibly coupled to the tiltable insert to retain their functionality when the tiltable insert is tilted.

7. The injection mold of claim 1 , wherein the injection mold further comprises a lock mechanism for locking the pressure-exerting actuators when the predetermined total pressure is reached.

8. The injection mold of claim 1 , wherein the substrate is a glass panel.

9. The injection mold of claim 1 , wherein the plurality of pressure-exerting actuators are coupled to a pressure-generating system adapted to automatically and dynamically adjust a pressure exerted by each of the pressure-exerting actuators.

10. The injection mold of claim 9 , wherein the pressure-generating system comprises a plurality of pressure sensors to measure pressures exerted on the substrate.

11. The injection mold of claim 10 , wherein the pressure sensors are connected to the pressure-exerting actuators.

12. The injection mold of claim 10 , wherein the pressure sensors are in the lower mold component.

13. A method of encapsulating a substrate comprising:

positioning the substrate on a support defined by a lower mold component within an injection mold;

closing the mold by bringing an upper mold component into engagement with the lower mold component to form an encapsulation mold cavity around an edge of the substrate;

applying a predetermined total pressure on a predetermined area of the substrate with a tiltable insert using a plurality of pressure-exerting actuators to seal the encapsulation mold cavity and prevent displacement of the substrate during injection, wherein the tiltable insert comprises a lower portion having a sealing surface defining a compensation space with a recess wall, said sealing surface having a height such that its top edge is displaced by a lateral distance equal to or less than the compensation space when the insert is tilted, and wherein the pressure-exerting actuators automatically and dynamically adjust the pressure on the substrate via the insert as a function of a thickness of the substrate thereby causing the tiltable insert to tilt slightly relative to the upper and lower mold components in response to local pressure resistance buildup as a result of an imperfection in the substrate until the predetermined total pressure is distributed substantially evenly across the predetermined area;

injecting an encapsulation material into the encapsulation mold cavity; and releasing the substrate.

14. The method of claim 13 , wherein applying the pressure is accomplished by applying pressure via the pressure-exerting actuators to an upper portion of the insert having a width smaller than said lower portion of the insert.

15. The method of claim 13 , wherein the plurality of pressure-exerting actuators are controlled by a pressure-generating system adapted to automatically and dynamically adjust a pressure exerted by each of the pressure-exerting actuators.

16. The method of claim 15 , wherein the method further comprises measuring pressures exerted on the substrate using a plurality of pressure sensors.

17. The method of claim 16 , wherein the pressure sensors are connected to the pressure-exerting actuators.

18. The method of claim 16 , wherein the pressure sensors are in the lower mold component.

19. The method of claim 13 , wherein the method further comprises locking the pressure-exerting actuators when the predetermined total pressure is reached.

20. The method of claim 13 , wherein the substrate is a glass panel.