IP Library Granted Patent US 11,514,215
Granted Patent B2
US 11,514,215 · App. 16/469,832 · Granted Nov 29, 2022

Systems and methods for constructing a compact wall model

Inventors: James William VanGilder (Pepperell, MA); Zachary M. Pardey (Waltham, MA); Christopher M. Healey (Tewksbury, MA)
Assignee: SCHNEIDER ELECTRIC IT CORPORATION
G06F30/28G06F2111/10G06F2119/08
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Quick Facts
Patent No.
US 11,514,215
App. No.
16/469,832
Granted
Nov 29, 2022
Kind
B2
Abstract

Systems and methods for a compact wall model are provided. According to one aspect, embodiments herein provide a method that comprises receiving input data related to an enclosure, the input data including solar intensity data on an exterior of a wall of the enclosure, generating, by a processor, a thermal model of a wall of the enclosure based at least in part on the input data, the wall modeled as having a plurality of layers and the thermal model including a plurality of nodes such that each layer of the plurality of layers is associated with at least one node of the plurality of nodes and each node of the plurality of nodes is thermally coupled to an adjacent node by a thermal resistance, solving, by the processor, an energy balance equation for the at least one node to determine a predicted temperature for the at least one node, and output the predicted temperature to a display device.

Claims (52)

1. A method, comprising:

receiving input data related to an enclosure, the input data including solar intensity data on an exterior of a wall of the enclosure;

generating, by a processor, a thermal model of a wall of the enclosure based at least in part on the input data, the wall modeled as having a plurality of layers and the thermal model including a plurality of nodes having three-dimensional positions, each layer of the plurality of layers being associated with at least one node of the plurality of nodes and each node of the plurality of nodes being thermally coupled to an adjacent node by a thermal resistance;

mapping, by the processor, the three-dimensional positions of the plurality of nodes to two-dimensional positions;

assigning a weighting parameter to at least one node of the plurality of nodes, the weighting parameter determining a proximity of the at least one node of the plurality of nodes to a different node of the plurality of nodes;

solving, by the processor, an energy balance equation corresponding to the two- dimensional positions of the plurality of nodes to determine a predicted temperature for at least one node, the two dimensional positions of at least two nodes of the plurality of nodes being determined based on the proximity of the at least one node of the plurality of nodes to the different node of the plurality of nodes; and

output the predicted temperature to a display device.

2. The method of claim 1 , wherein generating the thermal model includes

identifying the plurality of layers of the wall as an inner surface layer thermally coupled to an interior volume of the enclosure, an outer surface layer including the exterior of the wall and thermally coupled to an ambient environment, and a center layer thermally coupled to the inner surface layer and the outer surface layer, and

identifying an overall thermal resistance between a node associated with the inner surface layer and a node associated with the outer surface layer.

3. The method of claim 2 , wherein the thermal resistance is configured to account for thermal conductivity such that a first node associated with the center layer is conductively coupled to the node associated with the inner surface layer, the node associated with the outer surface layer, and to a second, third, fourth, and fifth adjacent node associated with the center layer.

4. The method of claim 3 , wherein the weighting parameter is assigned to the first node.

5. The method of claim 4 , further comprising applying the weighting parameter to the overall thermal resistance to determine a first thermal resistance between the first node and the node associated with the inner surface layer and to determine a second thermal resistance between the first node and the node associated with the outer surface layer.

6. The method of claim 1 , wherein solving the energy balance equation includes solving the energy balance equation corresponding to the two-dimensional positions of the plurality of nodes at a plurality of time steps to determine a predicted temperature change at the at least one node over time.

7. The method of claim 1 , wherein solving the energy balance equation includes compensating for solar load based on the solar intensity data.

8. The method of claim 1 , wherein generating the thermal model includes defining the wall as a physical domain represented by the three-dimensional positions of the plurality of nodes.

9. The method of claim 8 wherein the enclosure includes two adjacent exterior walls that lie on planes that intersect along a straight line defined by an edge of the two adjacent exterior walls, and the two-dimensional plane includes the edge.

10. The method of claim 1 , further comprising incorporating the thermal model with a CFD model of an interior volume of the enclosure.

11. The method of claim 10 , wherein the CFD model of the interior volume is represented by a grid that forms a plurality of cells, the plurality of cells including a plurality of interior cells that are adjacent to an inner layer of the plurality of layers.

12. The method of claim 10 , further comprising implementing a design of the interior volume based on the CFD model.

13. The method of claim 1 , further comprising using, by the processor, the predicted temperature to adjust an operating parameter of equipment in the interior volume.

14. The system of claim 13 , wherein the controller is configured to incorporate the thermal model with a CFD model of an interior volume of the enclosure.

15. The system of claim 14 , wherein the CFD model of the interior volume is represented by a grid that forms a plurality of cells, the plurality of cells including a plurality of interior cells that are adjacent to an inner layer of the plurality of layers.

16. A system comprising:

a storage device;

a display device;

a controller coupled to the storage device and the display device and configured to:

receive input data from the storage device related to an enclosure, the input data including solar intensity data on an exterior of a wall of the enclosure;

generate a thermal model of a wall of the enclosure based at least in part on the input data, the wall modeled as having a plurality of layers and the thermal model including a plurality of nodes having three-dimensional positions, each layer of the plurality of layers being associated with at least one node of the plurality of nodes and each node of the plurality of nodes being thermally coupled to an adjacent node by a thermal resistance;

assign a weighting parameter to at least one node of the plurality of nodes, the weighting parameter determining a proximity of the at least one node of the plurality of nodes to a different node of the plurality of nodes;

map the three-dimensional positions of the plurality of nodes to two-dimensional positions;

solve an energy balance equation corresponding to the two-dimensional positions of the plurality of nodes to determine a predicted temperature for at least one node, the two dimensional positions of at least two nodes of the plurality of nodes being determined based on the proximity of the at least one node of the plurality of nodes to the different node of the plurality of nodes; and

output the predicted temperature to the display device.

17. The system of claim 16 , wherein generating the thermal model includes

identifying the plurality of layers of the wall as an inner surface layer thermally coupled to an interior volume of the enclosure, an outer surface layer including the exterior of the wall and thermally coupled to an ambient environment, and a center layer thermally coupled to the inner surface layer and the outer surface layer, and

identifying an overall thermal resistance between a node associated with the inner surface layer and a node associated with the outer surface layer.

18. The system of claim 17 , wherein the thermal resistance is configured to account for thermal conductivity such that a first node associated with the center layer is conductively coupled to the node associated with the inner surface layer, the node associated with the outer surface layer, and to a second, third, fourth, and fifth adjacent node associated with the center layer.

19. The system of claim 18 , wherein the controller is further configured to apply the weighting parameter to the first node.

20. The system of claim 19 , wherein the controller is further configured to apply the weighting parameter to the overall thermal resistance to determine a first thermal resistance between the first node and the node associated with the inner surface layer, and determine a second thermal resistance between the first node and the node associated with the outer surface layer.

21. The system of claim 16 , wherein solving the energy balance equation includes solving the energy balance equation corresponding to the two- dimensional positions of the plurality of nodes at a plurality of time steps to determine a predicted temperature change at the at least one node over time.

22. The system of claim 16 , further comprising at least one sensor coupled to the storage device and configured to measure the solar intensity data.

23. The system of claim 22 , wherein solving the energy balance equation includes compensating for solar load based on the solar intensity data.

24. The system of claim 16 , wherein generating the thermal model includes defining the wall as a physical domain represented by the three-dimensional positions of the plurality of nodes.

25. The system of claim 24 , wherein the enclosure includes two adjacent exterior walls that lie on planes that intersect along a straight line defined by an edge of the two adjacent exterior walls, and the two-dimensional plane includes the edge.

26. The system of claim 16 , wherein the controller is further configured to adjust an operating parameter of equipment in the enclosure using the predicted temperature.

27. A non-transitory computer-readable medium containing thereon computer- executable instructions instructing at least one processor to:

process input data including solar intensity data;

generate a thermal model of a wall of an enclosure based at least in part on the input data, the wall being modeled as a plurality of layers and the thermal model including a plurality of nodes having three-dimensional positions, each layer of the plurality of layers being associated with at least one node of the plurality of nodes and each node of the plurality of nodes being thermally coupled to an adjacent node by a thermal resistance;

map the three-dimensional positions of the plurality of nodes to two-dimensional positions;

assign a weighting parameter to at least one node of the plurality of nodes, the weighting parameter determining a proximity of the at least one node of the plurality of nodes to a different node of the plurality of nodes;

solve an energy balance equation corresponding to the two-dimensional positions of the plurality of nodes to determine a predicted temperature for at least one node, the two dimensional positions of at least two nodes of the plurality of nodes being determined based on the proximity of the at least one node of the plurality of nodes to the different node of the plurality of nodes; and

output the predicted temperature.

Assignments (3)
CHANGE OF NAME Recorded Mar 12, 2021
From: AMERICAN POWER CONVERSION CORPORATION
To: SCHNEIDER ELECTRIC IT CORPORATION
Reel/Frame 055658/0364 →
EMPLOYMENT AGREEMENT Recorded Mar 2, 2021
From: PARDEY, ZACHARY M.
To: AMERICAN POWER CONVERSION CORPORATION
Reel/Frame 055555/0304 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 15, 2021
From: VANGILDER, JAMES WILLIAM; HEALEY, CHRISTOPHER M.
To: SCHNEIDER ELECTRIC IT CORPORATION
Reel/Frame 055011/0173 →
Continuity (2)
Provisional Application 62435324 · Dec 16, 2016
Related Publication 20200257838A1 · Aug 13, 2020