IP Library › Granted Patent US 10,872,916
Granted Patent B2
US 10,872,916 · App. 16/470,080 · Granted Dec 22, 2020

Optical element, image sensor package, imaging device and electronic device

Inventor: Yusuke Suzuki (Miyagi, JP)
Assignee: Sony Corporation
H01L27/1462G02B1/118H01L27/14618H01L27/14627
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Quick Facts
Patent No.
US 10,872,916
App. No.
16/470,080
Granted
Dec 22, 2020
Kind
B2
Abstract

An optical element includes: a base; and an uneven structure layer that is disposed on at least one face of the base, and suppresses reflectance, the optical element having a reflectance of 1% or smaller, in a wavelength region of 400 nm or longer and 700 nm or shorter, a transmittance of 90% or larger, in a wavelength region of 470 nm or longer and 550 nm or shorter, and a variation of transmittance of 1% or smaller, between before and after a high-temperature environmental test conducted at 150° C. for 250 h.

Claims (61)

1. An optical element comprising:

a base; and

an uneven structure layer that is disposed on one face of the base, and suppresses reflectance,

the optical element having

a reflectance of 1% or smaller, in a wavelength region of 400 nm or longer and 700 nm or shorter,

a transmittance of 90% or larger, in a wavelength region of 470 nm or longer and 550 nm or shorter, and

a variation of transmittance of 1% or smaller, between before and after a high-temperature environmental test conducted at 150° C. for 250 h.

2. The optical element according to claim 1 , having a variation of transmittance of 1% or smaller, between before and after a high-temperature environmental test conducted at 150° C. for 1000 h.

3. The optical element according to claim 1 , having a variation of transmittance of 1% or smaller, between before and after a heat resistance test conducted at 245° C. for 5 min.

4. An optical element comprising:

a base; and

an uneven structure layer that is disposed on one face of the base, and suppresses reflectance,

the optical element having

a reflectance of 1% or smaller, in a wavelength region of 400 nm or longer and 700 nm or shorter,

a transmittance of 90% or larger, in a wavelength region of 420 nm or longer and 600 nm or shorter, and

a variation of transmittance of 1% or smaller, between before and after a high-temperature environmental test conducted at 150° C. for 250 h.

5. The optical element according to claim 1 ,

wherein the uneven structure layer contains an organic resin, and

the base contains at least one of glass, crystallized glass, or crystal.

6. The optical element according to claim 5 ,

wherein the organic resin is a cured article of a UV curable resin composition.

7. The optical element according to claim 6 ,

wherein the UV curable resin composition is at least one of a first composition that contains a first compound having vinyl group and a second compound having (meth)acryloyl group; or a second composition that contains a third compound having vinyl group and (meth)acryloyl group.

8. The optical element according to claim 6 ,

wherein the UV curable resin composition is of solventless type.

9. The optical element according to claim 1 ,

wherein the uneven structure layer contains a plurality of structures, and

each structure has an aspect ratio of 1 or larger.

10. The optical element according to claim 1 , further comprising a multilayered film that is disposed on the other face of the base, and suppresses reflectance.

11. The optical element according to claim 1 , further comprising a multilayered film that is disposed on the other face of the base, and has a function for cutting light in a specified wavelength region.

12. The optical element according to claim 1 , further comprising an uneven structure layer that is disposed on the other face of the base, and suppresses reflectance.

13. The optical element according to claim 1 ,

wherein the uneven structure layer contains a light absorber.

14. The optical element according to claim 13 ,

wherein the light absorber contains phthalocyanine-nickel complex.

15. The optical element according to claim 1 , having a silane coupling agent applied between the base and the uneven structure layer.

16. The optical element according to claim 1 ,

wherein adhesiveness between the base and the uneven structure layer is denoted by any one of classifications 0 to 2, in a cross-cut test in compliance with JIS K5600-5-6.

17. The optical element according to claim 1 , being intended for an image sensor package.

18. An image sensor package comprising:

a package including the optical element according to claim 1 ; and

an image sensor housed in the package.

19. The image sensor package according to claim 18 ,

wherein the uneven structure layer is opposed to the image sensor.

20. The image sensor package according to claim 18 , further comprising a multilayered film that is disposed on the other face of the base, and has a function for cutting light in a specified wavelength region,

wherein the uneven structure layer contains a light absorber.

21. The image sensor package according to claim 20 ,

wherein the image sensor has, on a surface, a microlens.

22. An imaging device comprising the image sensor package according to claim 18 .

23. An electronic device comprising the image sensor package according to claim 18 .

24. An image sensor package comprising:

a package including the optical element according to claim 4 ; and

an image sensor housed in the package.

25. The image sensor package according to claim 24 ,

wherein the uneven structure layer is opposed to the image sensor.

26. The image sensor package according to claim 24 , further comprising a multilayered film that is disposed on the other face of the base, and has a function for cutting light in a specified wavelength region,

wherein the uneven structure layer contains a light absorber.

27. The image sensor package according to claim 26 ,

wherein the image sensor has, on a surface, a microlens.

28. An imaging device comprising the image sensor package according to claim 24 .

29. An electronic device comprising the image sensor package according to claim 24 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 23, 2019
From: SUZUKI, YUSUKE
To: SONY CORPORATION
Reel/Frame 049840/0998 →
Priority Claims (1)
JP 2016-244747 · Dec 16, 2016 · national
Continuity (1)
Related Publication 20190319053A1 · Oct 17, 2019