Array camera module having height difference, circuit board assembly and manufacturing method therefor, and electronic device
An array camera module having a height difference, a circuit board assembly and a manufacturing method therefor, and an electronic device. The array camera module comprises a first camera module unit and a second camera module unit, wherein the first camera module unit comprises at least one first photosensitive assembly and at least one first lens; the first lens is located on a photosensitive path of the first photosensitive assembly; the first photosensitive assembly comprises at least one extension portion; the extension portion at least partially extends towards the direction away from the first photosensitive assembly; and the second camera module unit is fixedly connected to a second extension portion, so that the ends of the two camera module units are consistent.
1. An array camera module, characterized in that it comprises:
at least two camera module units, the two camera module units being a first camera module unit and a second camera module unit, respectively, wherein the first camera module unit includes at least one first photosensitive assembly and at least a first lens, the first lens is located in a photosensitive path of the first photosensitive assembly, the first photosensitive assembly includes at least one connection portion, the connection portion at least partially extends towards a direction away from the first photosensitive assembly to form a height difference, and the second camera module unit is fixed and supported on the connection portion, so that the first camera module unit and the second camera module unit are stably fixed,
wherein the first photosensitive assembly includes a first circuit board, a first photosensitive element and a first base, and wherein the first base includes a first base body and an extension portion, the first base body is integrally molded on the first circuit board to form a first light window, providing a light path for the first photosensitive element, the extension portion at least partially integrally extends outwardly from the first base body to form the connection portion, a top surface of the extension portion forms the height difference relative to a bottom surface of the first circuit board, and the first photosensitive element is electrically connected to the first circuit board.
2. The array camera module according to claim 1 , wherein the extension portion has a support surface, the support surface extending flatly towards a direction away from the first camera module unit, and the second camera module includes a second photosensitive assembly and a second lens, the second lens being located in a photosensitive path of the second photosensitive assembly, and the second photosensitive assembly being supported and fixed to the support surface of the extension portion.
3. The array camera module according to claim 2 , wherein the second photosensitive assembly is mounted and fixed to the support surface of the extension portion.
4. The array camera module according to claim 2 , wherein the second photosensitive assembly includes a second circuit board, a second photosensitive element and a second base, the second photosensitive element being electrically connected to the second circuit board, the second base being integrally molded on the second circuit board to form a second light window, providing a light path for the second photosensitive element, the second circuit board being supported and fixed on the second support surface of the extension portion, and a bottom surface of the second circuit board forming the height difference relative to the bottom surface of the first circuit board.
5. The array camera module according to claim 1 , wherein the first photosensitive assembly includes a first circuit board, a first photosensitive element, a first base and a support plate, the first base being integrally molded on the first circuit board to form a first light window, providing a light path for the first photosensitive element, the support plate being disposed on the first base body, with at least partially extending outwardly from the first base body to form the connection portion, a top surface of the support plate forming the height difference relative to a bottom surface of the first circuit board, and the first photosensitive element being electrically connected to the first circuit board.
6. The array camera module according to claim 5 , wherein the support plate is fixed to the first base.
7. The array camera module according to claim 5 , wherein the support plate has a through hole, and the through hole communicates with the first light window, for providing a light path for the photosensitive element.
8. The array camera module according to claim 5 , wherein the second photosensitive assembly includes a second circuit board, a second photosensitive element and a second base, the second photosensitive element being electrically connected to the second circuit board, the second base being integrally molded on the second circuit board to form a second light window, the second circuit board being supported and fixed on a top surface of the support plate, and a bottom surface of the second circuit board forming the height difference relative to the bottom surface of the first circuit board.
9. The array camera module according to claim 5 , wherein the second camera module unit includes a mount, the mount being mounted to a mounting slot of the second base for providing a mounting position.
10. The array camera module according to claim 1 , wherein the first photosensitive element is mounted to the first circuit board, and the first base is located at a periphery of the first photosensitive element.
11. The array camera module according to claim 1 , wherein the first photosensitive element is mounted to the first circuit board, and the first base is integrally molded on at least a part of the first photosensitive element.
12. The array camera module according to claim 11 , wherein the first photosensitive element is electrically connected to the first circuit board by at least one first electrical connection element, and the first base covers the first electrical connection element.
13. The array camera module according to claim 1 , wherein the second photosensitive element is mounted to the second circuit board, and the second base is located at a periphery of the second photosensitive element.
14. The array camera module according to claim 1 , wherein the second photosensitive element is mounted to the second circuit board, and the second base is integrally molded on at least a part of the second photosensitive element.
15. The array camera module according to claim 1 , wherein the second circuit board has a sinking hole, the second photosensitive element being disposed in the sinking hole.
16. The array camera module according to claim 8 , wherein the second camera module unit includes a mount, the mount being mounted to a mounting slot of the second base for providing a mounting position.
17. The array camera module according to claim 2 , wherein the first photosensitive element is mounted to the first circuit board, and the first base is located at a periphery of the first photosensitive element.
18. The array camera module according to claim 3 , wherein the first photosensitive element is mounted to the first circuit board, and the first base is located at a periphery of the first photosensitive element.
19. The array camera module according to claim 4 , wherein the first photosensitive element is mounted to the first circuit board, and the first base is located at a periphery of the first photosensitive element.