Electronic component and camera module
To more securely hold reliability of an electronic component. There is provided an electronic component including a base material having a main face, at least one wiring formed on the main face of the base material, at least one pad provided at each end of the at least one wiring on the main face of the base material, a resist part formed to cover the at least one wiring on the main face of the base material, and a chip flip-chip mounted on the main face of the base material and connected to the base material via a bump bonded to the at least one pad, in which the resist part has a pad opening configured to expose the at least one pad bonded with the bump, and a circulation groove formed to be connected to the pad opening at one end as a connection end to the pad opening.
1. An electronic component, comprising:
a base material having a main face;
at least one wiring on the main face of the base material;
at least one pad at one end of the at least one wiring;
a resist part that covers the at least one wiring; and
a chip flip-chip mounted on the main face of the base material, wherein
the chip is connected to the base material via a bump bonded to the at least one pad, and
the resist part has:
a pad opening configured to expose the at least one pad bonded with the bump; and
a circulation groove connected to one end of the pad opening as a connection end to the pad opening, wherein the main face of the base material is exposed at a bottom side of the circulation groove.
2. The electronic component according to claim 1 , wherein
the at least one wiring is in a first region of the main face of the base material,
the circulation groove is in a second region of the main face of the base material, and
the first region is different from the second region.
3. The electronic component according to claim 1 , wherein an end of the circulation groove opposite to the connection end to the pad opening is outside the chip on the resist part.
4. The electronic component according to claim 1 , further comprising a plurality of pads in a line on the main face of the base material, wherein
the plurality of pads includes the at least one pad, and
the pad opening has a groove shape that transversely exposes the plurality of pads.
5. The electronic component according to claim 4 , wherein the circulation groove extends in a direction orthogonal to a direction of the pad opening.
6. The electronic component according to claim 1 , further comprising a plurality of pads in a plurality of lines on the main face of the base material, wherein
the plurality of pads includes the at least one pad, and
the pad opening has a groove shape that transversely exposes the plurality of pads.
7. The electronic component according to claim 1 ,
wherein a first groove width of the circulation groove at the connection end to the pad opening is larger than a second groove width of the circulation groove at a part other than the connection end to the pad opening.
8. The electronic component according to claim 1 , further comprising:
a translucent member which opposes an opposite face of the main face of the base material, wherein
the translucent member is optically transparent,
the chip includes an imaging device having a light receiving face on a side opposite to the translucent member,
the base material has a first main opening, and
the resist part has a second main opening.
9. The electronic component according to claim 8 , further comprising:
a dam part along an opening peripheral end of the second main opening of the resist part,
wherein the dam part protrudes from an upper surface of the resist part.
10. The electronic component according to claim 9 , wherein the dam part covers an opening peripheral end of the first main opening of the base material.
11. The electronic component according to claim 9 , wherein the dam part is made of absorbent resin.
12. The electronic component according to claim 1 , wherein
the resist part further comprises a groove-shaped trap part in a direction along an opening peripheral end of a main opening of the resist part, and
the groove-shaped trap part is configured to control flow of encapsulation resin in the electronic component.
13. The electronic component according to claim 1 , wherein
the resist part further comprises a groove-shaped trap part in a direction along a boundary of a region corresponding to the chip, and
the groove-shaped trap part is configured to control a filling process of encapsulation resin in the electronic component.
14. The electronic component according to claim 1 , further comprising:
encapsulation resin between a circuit board and the chip, wherein
the circuit board includes the base material, the at least one wiring, and the resist part, and
the encapsulation resin covers an entire side peripheral face of the bump.
15. A camera module, comprising:
a base material having a first face and a second face opposite to the first face;
at least one wiring on the first face of the base material;
at least one pad at one end of the at least one wiring;
a resist part that covers the at least one wiring;
a translucent member opposite to the second face of the base material, wherein the translucent member is optically transparent;
an imaging device flip-chip mounted on the first face of the base material, wherein
the imaging device has a light receiving face on a side opposite to the translucent member, and
the imaging device is connected to the base material via a bump bonded to the at least one pad; and
a lens unit opposite to a side of the translucent member that opposes the base material, wherein
the light receiving face is configured to receive light from the lens unit, and
the resist part has:
a pad opening configured to expose the at least one pad bonded with the bump; and
a circulation groove connected to one end of the pad opening as a connection end to the pad opening, wherein the first face of the base material is exposed at a bottom side of the circulation groove.