Low dielectric glass composition, fibers, and article
Glass compositions and glass fibers having low dielectric constants and low dissipation factors that may be suitable for use in electronic applications and articles are disclosed. The glass fibers and compositions of the present invention may include between 45.0 to 58.0 weight percent SiO 2 ; greater than 18.0 weight percent B 2 O 3 and no more than 26.0 weight percent B 2 O 3 ; greater than 16.0 weight percent Al 2 O 3 and no more than 23.0 weight percent Al 2 O 3 ; between 0.25 to 12.0 weight percent P 2 O 5 ; greater than 0.25 weight percent CaO and less than 5.00 weight percent CaO; less than 4.50 weight percent MgO; greater than 0.25 weight percent CaO+MgO and less than 5.00 weight percent CaO+MgO; less than 0.80 weight percent Fe 2 O 3 ; and less than 0.50 weight percent TiO 2 . Further, the glass composition has a glass viscosity of 1000 poise at a temperature greater than 1350 degrees Celsius.
1. A glass composition comprising:
between 45.0 to 58.0 weight percent SiO 2 ;
greater than 18.0 weight percent B 2 O 3 and no more than 26.0 weight percent B 2 O 3 ;
greater than 16.0 weight percent Al 2 O 3 and no more than 23.0 weight percent Al 2 O 3 ;
between 0.25 to 12.0 weight percent P 2 O 5 ;
greater than 0.25 weight percent CaO and less than 5.00 weight percent CaO;
less than 4.50 weight percent MgO;
greater than 0.25 weight percent CaO+MgO and less than 5.00 weight percent CaO+MgO;
less than 0.80 weight percent Fe 2 O 3 ; and
less than 0.50 weight percent TiO 2 ;
wherein the composition has a glass viscosity of 1000 poise at a temperature greater than 1350° C.
2. The glass composition of claim 1 , wherein the class composition further comprises:
between 45.5 to 57.5 weight percent SiO 2 ;
between 18.5 to 25.0 weight percent B 2 O 3 ;
greater than 16.0 weight percent Al 2 O 3 and no more than 22.50 weight percent Al 2 O 3 ;
between 0.25 to 11.0 weight percent P 2 O 5 ;
greater than 0.25 weight percent CaO and less than 4.5 weight percent CaO;
less than 4.25 weight percent MgO;
greater than 0.25 weight percent CaO+MgO and less than 4.5 weight percent CaO+MgO;
less than 0.70 weight percent Fe 2 O 3 ; and
less than 0.45 weight percent TiO 2 .
3. The glass composition of claim 1 wherein the class composition further comprises:
between 46.0 to 57.0 weight percent SiO 2 ;
between 19.0 to 24.0 weight percent B 2 O 3 ;
greater than 16.0 weight percent Al 2 O 3 and no more than 22.0 weight percent Al 2 O 3 ;
between 0.25 to 10.0 weight percent P 2 O 5 ;
greater than 0.25 weight percent CaO and less than 4.0 weight percent CaO;
less than 3.75 weight percent MgO;
greater than 0.25 weight percent CaO+MgO and less than 4.0 weight percent CaO+MgO;
less than 0.60 weight percent Fe 2 O 3 ; and
less than 0.40 weight percent TiO 2 .
4. The glass composition of claim 1 , wherein the composition further comprises one or more of:
no less than 45.5 weight percent SiO 2 ;
no more than 57.5 weight percent SiO 2 ;
no less than 18.5 weight percent B 2 O 3 ;
no more than 25.0 weight percent B 2 O 3 ;
no more than 22.50 weight percent Al 2 O 3 ;
no more than 11.0 weight percent P 2 O 5 ;
less than 4.5 weight percent CaO;
less than 4.25 weight percent MgO;
less than 4.5 weight percent CaO+MgO;
no more than 0.70 weight percent Fe 2 O 3 ; and/or
no more than 0.45 weight percent TiO 2 .
5. The glass composition of claim 1 , wherein the composition further comprises one or more of:
no less than 46.0 weight percent SiO 2 ;
no more than 57.0 weight percent SiO 2 ;
no less than 19.0 weight percent B 2 O 3 ;
no more than 24.0 weight percent B 2 O 3 ;
no more than 22.0 weight percent Al 2 O 3 ;
no more than 10.0 weight percent P 2 O 5 ;
less than 4.0 weight percent CaO;
less than 3.75 weight percent MgO;
less than 4.0 weight percent CaO+MgO;
no more than 0.60 weight percent Fe 2 O 3 ; and/or
no more than 0.4 weight percent TiO 2 .
6. The glass composition of claim 1 wherein the composition has a liquidus temperature greater than 1100° C.
7. The glass composition of claim 1 wherein the composition has a glass viscosity of 1000 poise at a temperature greater than 1355° C.
8. The glass composition of claim 1 wherein the composition has a glass viscosity of 1000 poise at a temperature greater than 1360° C.
9. A process for providing continuous, manufacturable low dielectric glass fibers, the process comprising the steps of:
providing the glass composition of claim 1 to a melting zone of a glass melter;
heating the composition to a forming temperature in excess of the liquidus temperature; and
continuously fiberizing said molten glass whereby a low dielectric constant and low dissipation factor glass fiber is produced.
10. A glass fiber comprising the glass composition of claim 1 .
11. The glass fiber of claim 10 , wherein the glass fiber has a dielectric constant less than or equal to 6 and/or a dissipation factor less than or equal to 38×10 −4 at a frequency of 10 GHz at room temperature.
12. A fiberglass reinforced article comprising glass fibers of claim 10 .
13. The fiberglass reinforced article of claim 12 , wherein the article is a printed circuit board.
14. A low dielectric glass fiber formed from a glass composition comprising:
between 45.0 to 58.0 weight percent SiO 2 ;
greater than 18.0 weight percent B 2 O 3 and no more than 26.0 weight percent B 2 O 3 ;
greater than 16.0 weight percent Al 2 O 3 and no more than 23.0 weight percent Al 2 O 3 ;
between 0.25 to 12.0 weight percent P 2 O 5 ;
greater than 0.25 weight percent CaO and less than 5.00 weight percent CaO;
less than 4.50 weight percent MgO;
greater than 0.25 weight percent CaO+MgO and less than 5.00 weight percent CaO+MgO;
less than 0.80 weight percent Fe 2 O 3 ; and
less than 0.50 weight percent TiO 2 ;
wherein the composition has a glass viscosity of 1000 poise at a temperature greater than 1350° C.
15. The low dielectric glass fiber of claim 14 , wherein the glass composition further comprises:
between 45.5 to 57.5 weight percent SiO 2 ;
between 18.5 to 25.0 weight percent B 2 O 3 ;
greater than 16.0 weight percent Al 2 O 3 and no more than 22.50 weight percent Al 2 O 3 ;
between 0.25 to 11.0 weight percent P 2 O 5 ;
greater than 0.25 weight percent CaO and less than 4.5 weight percent CaO;
less than 4.25 weight percent MgO;
greater than 0.25 weight percent CaO+MgO and less than 4.5 weight percent CaO+MgO;
less than 0.70 weight percent Fe 2 O 3 ; and
less than 0.45 weight percent TiO 2 .
16. The low dielectric glass fiber of claim 14 , wherein the glass composition further comprises:
between 46.0 to 57.0 weight percent SiO 2 ;
between 19.0 to 24.0 weight percent B 2 O 3 ;
greater than 16.0 weight percent Al 2 O 3 and no more than 22.0 weight percent Al 2 O 3 ;
between 0.25 to 10.0 weight percent P 2 O 5 ;
greater than 0.25 weight percent CaO and less than 4.0 weight percent CaO;
less than 3.75 weight percent MgO;
greater than 0.25 weight percent CaO+MgO and less than 4.0 weight percent CaO+MgO;
less than 0.60 weight percent Fe 2 O 3 ; and
less than 0.40 weight percent TiO 2 .
17. The low dielectric glass fiber of claim 14 , wherein the glass composition further comprises one or more of:
no less than 45.5 weight percent SiO 2 ;
no more than 57.5 weight percent SiO 2 ;
no less than 18.5 weight percent B 2 O 3 ;
no more than 25.0 weight percent B 2 O 3 ;
no more than 22.50 weight percent Al 2 O 3 ;
no more than 11.0 weight percent P 2 O 5 ;
less than 4.5 weight percent CaO;
less than 4.25 weight percent MgO;
less than 4.5 weight percent CaO+MgO;
no more than 0.70 weight percent Fe 2 O 3 ; and/or
no more than 0.45 weight percent TiO 2 .
18. The low dielectric glass fiber of claim 14 , wherein the glass composition further comprises one or more of:
no less than 46.0 weight percent SiO 2 ;
no more than 57.0 weight percent SiO 2 ;
no less than 19.0 weight percent B 2 O 3 ;
no more than 24.0 weight percent B 2 O 3 ;
no more than 22.0 weight percent Al 2 O 3 ;
no more than 10.0 weight percent P 2 O 5 ;
less than 4.0 weight percent CaO;
less than 3.75 weight percent MgO;
less than 4.0 weight percent CaO+MgO;
no more than 0.60 weight percent Fe 2 O 3 ; and/or
no more than 0.4 weight percent TiO 2 .
19. The glass fiber of claim 14 wherein the glass composition has a liquidus temperature greater than 1100° C.
20. The glass fiber of claim 14 wherein the glass composition has a glass viscosity of 1000 poise at a temperature greater than 1355° C.
21. The glass fiber of claim 14 wherein the glass composition has a glass viscosity of 1000 poise at a temperature greater than 1360° C.
22. The glass fiber of claim 14 , wherein the glass fiber has a dielectric constant less than or equal to 6 and/or a dissipation factor less than or equal to 38×10 −4 at a frequency of 10 GHz at room temperature.
23. A product comprising the glass fiber according to claim 14 , the product being selected from the group consisting of a printed circuit board, a woven fabric, a non-woven fabric, a unidirectional fabric, a chopped strand, a chopped strand mat, a composite material, and a communication signal transport medium.