IP Library › Granted Patent US 10,729,008
Granted Patent B2
US 10,729,008 · App. 16/474,727 · Granted Jul 28, 2020

Flexible printed circuit board

Inventors: Hiroshi Ueda (Koka, JP); Kousuke Miura (Koka, JP); Kou Noguchi (Koka, JP)
Assignee: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
H05K1/028H05K1/0245H05K1/0271H05K2201/09254H05K2201/09272
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,729,008
App. No.
16/474,727
Granted
Jul 28, 2020
Kind
B2
Abstract

A flexible printed circuit board according to an embodiment of the present invention includes an insulative base film; and a conductive pattern provided on at least one surface of the base film and including a wiring line including a bent portion having an angle of greater than or equal to 60° or a branched portion having an angle of greater than or equal to 60° in plan view. The wiring line is provided with a relaxation structure that relaxes stress concentration at the bent portion or the branched portion. The relaxation structure is structured such that the wiring line constitutes a wide wiring line or a dense wiring line group in a region in which a distance from the bent portion or the branched portion is less than or equal to 5 times a minimum width of the wiring line. The wide wiring line has a wiring line width that is greater than or equal to twice the minimum width of the wiring line. A ratio of a wiring line width to a wiring line interval of the dense wiring line group is greater than or equal to 1.5, and a total width of the dense wiring line group is greater than or equal to twice the minimum width of the wiring line.

Claims (9)

1. A flexible printed circuit board comprising:

an insulative base film; and

a conductive pattern provided on at least one surface of the insulative base film and including at least one wiring line including a bent portion having an angle of greater than or equal to 60° or a branched portion having an angle of greater than or equal to 60° in plan view,

wherein the at least one wiring line is provided with a relaxation structure that relaxes stress concentration at the bent portion or the branched portion,

wherein the relaxation structure is structured such that the at least one wiring line includes a dense wiring line group, including a plurality of wiring lines, in a surrounding region including the bent portion or the branch portion, the surrounding region extending such that a distance from a centerline of the bent portion or the branched portion of each wiring line of the dense wiring line group to respective end portions of each wiring line of the dense wiring line group is greater than or equal to 5 times a minimum width of a wiring line of the at least one wiring line outside of the relaxation structure and less than or equal to 30 times the minimum width of the wiring line of the at least one wiring line outside of the relaxation structure,

wherein a ratio of a wiring line width to a wiring line interval of each wiring line of the dense wiring line group is greater than a ratio of a wiring line width to a wiring line interval of each wiring line outside of the relaxation structure, and

wherein the ratio of the wiring line width to the wiring line interval of each wiring line of the dense wiring line group is greater than or equal to 2.5 and less than or equal to 10, and a total width of the dense wiring line group is greater than or equal to 3 times the minimum width of the wiring line of the at least one wiring line outside of the relaxation structure and less than or equal to 10 times the minimum width of the wiring line of the at least one wiring line outside of the relaxation structure, the total width of the dense wiring line group being a sum of wiring line widths of each wiring line of the plurality of wiring lines of the dense wiring line group.

2. The flexible printed circuit board according to claim 1 , wherein the plurality of wiring lines of the dense wiring line group includes a dummy wiring line that is not connected to a circuit.

3. The flexible printed circuit board according to claim 1 , wherein the wiring line interval of the dense wiring line group is less than or equal to 20 μm.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 28, 2019
From: UEDA, HIROSHI; MIURA, KOUSUKE; NOGUCHI, KOU
To: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
Reel/Frame 049622/0797 →
Priority Claims (1)
JP 2017-000602 · Jan 5, 2017 · national
Continuity (1)
Related Publication 20200037434A1 · Jan 30, 2020