IP Library Granted Patent US 11,054,225
Granted Patent B2
US 11,054,225 · App. 16/474,957 · Granted Jul 6, 2021

Ignitor for electronic detonator

Inventors: Efrem Fesshaie (Norwich, GB); Dong Liu (Jiangsu, CN); Paulius Kabisius (Kaunas, LT)
Assignee: Hamlin Electronics (Suzhou) Ltd.
F42B3/124F42B3/121F42B3/122F42B3/198
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Quick Facts
Patent No.
US 11,054,225
App. No.
16/474,957
Granted
Jul 6, 2021
Kind
B2
Abstract

An ignitor for an electronic detonator, the ignitor including a microcontroller and a capacitor mounted on a printed circuit board (PCB) and electrically connected to one another, the microcontroller configured to discharge the capacitor in response to an actuation signal received by the microcontroller, a pair of conductive traces extending from the capacitor, a resistive element extending between the conductive traces and configured to radiate heat in response to current flowing therethrough, and a shroud disposed over the resistive element, the shroud containing a pyrotechnic composition that at least partially covers the resistive element.

Claims (9)

1. A method of manufacturing an ignitor for an electronic detonator, the method comprising:

mounting a microcontroller and a capacitor on a printed circuit board (PCB) in electrical communication with one another, with a pair of conductive traces extending from the capacitor, the microcontroller configured to discharge the capacitor upon receiving an actuation signal;

connecting the conductive traces to one another with a resistive element adapted to radiate heat in response to current flowing therethrough;

placing a shroud over the resistive element, the shroud disposed within, and separate from, a tubular shell of the electronic detonator, the shroud disposed over the resistive element and having an open end directed away from the PCB; and

filling the shroud with a pyrotechnic composition that at least partially covers the resistive element by disposing a predetermined quantity of the pyrotechnic composition in a liquid or semi-liquid state in the shroud using an automated process.

2. The method of claim 1 , wherein the resistive element is mounted on a peninsular portion of the PCB that extends from a relatively wider main portion of the PCB upon which the microcontroller and the capacitor are mounted, and wherein placing the shroud over the resistive element comprises crimping a first end of the shroud into notches formed in sides of the peninsular portion with a second, open end of the shroud oriented to direct heat radiated by the pyrotechnic composition in a predetermined direction.

3. The method of claim 1 , wherein connecting the conductive traces to one another with the resistive element comprises installing a surface mount resistor on the PCB using a surface mount technology (SMT) process.

4. The method of claim 1 , wherein connecting the conductive traces to one another with the resistive element comprises soldering a bridge wire to the conductive traces.

5. The method of claim 1 , further comprising allowing the pyrotechnic composition to cure or dry into a solid mass that at least partially envelopes the resistive element.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 14, 2021
From: HAMLIN ELECTRONICS (SUZHOU) LTD.
To: SUZHOU LITTELFUSE OVS CO., LTD.
Reel/Frame 056851/0283 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 2, 2020
From: FESSHAIE, EFREM; LIU, DONG; KABISIUS, PAULIUS
To: HAMLIN ELECTRONICS (SUZHOU) LTD.
Reel/Frame 051401/0801 →
Continuity (1)
Related Publication 20190346243A1 · Nov 14, 2019