Scanned antenna and method of manufacturing scanned antenna
A scanning antenna includes a TFT substrate including a plurality of TFTs supported by a first dielectric substrate and a plurality of patch electrodes, a slot substrate including a slot electrode supported by a second dielectric substrate, a liquid crystal layer provided between the TFT substrate and the slot substrate, and a reflective conductive plate disposed opposing the second dielectric substrate across a dielectric layer. The slot electrode includes a plurality of slots disposed corresponding to the plurality of patch electrodes, each patch electrode is connected to a drain of the corresponding TFT, the slot electrode includes Cu layers, and lower metal layers and/or an upper metal layer, and the lower metal layer and/or the upper metal layer decrease about a half or more of a tensile stress of the Cu layer.
1. A scanning antenna including a plurality of antenna units arranged in the scanning antenna, the scanning antenna comprising:
a (Thin Film Transistor (TFT) substrate including a first dielectric substrate, a plurality of TFTs supported by the first dielectric substrate, a plurality of gate bus lines, a plurality of source bus lines, and a plurality of patch electrodes;
a slot substrate including a second dielectric substrate and a slot electrode supported by a first main surface of the second dielectric substrate;
a liquid crystal layer provided between the TFT substrate and the slot substrate; and
a reflective conductive plate disposed opposing a second main surface of the second dielectric substrate, the second main surface being on a side opposite to the first main surface, across a dielectric layer,
wherein the slot electrode includes a plurality of slots disposed corresponding to the plurality of patch electrodes,
each of the plurality of patch electrodes is connected to a drain of the corresponding TFT,
the slot electrode includes a copper (Cu) layer, a lower metal layer formed in the Cu layer on a side closer to the second dielectric substrate and/or an upper metal layer formed in the Cu layer closer to the liquid crystal layer, and the lower metal layer and/or the upper metal layer decrease about a half or more of a tensile stress of the Cu layer.
2. The scanning antenna according to claim 1 ,
wherein the Cu layer has a thickness of greater than or equal to about 2 μm and less than or equal to about 6 μm,
the lower metal layer and the upper metal layer are a lower Titanium (Ti) layer and a upper Ti layer, respectively, and
a thickness of at least one of the lower Ti layer and the upper Ti layer, or a total of the thicknesses of the lower Ti layer and the upper Ti layer is about one-third or more of the thickness of the Cu layer.
3. The scanning antenna according to claim 2 ,
wherein the thickness of the lower Ti layer is about 50 nm or less.
4. The scanning antenna according to claim 2 ,
wherein the upper Ti layer has the thickness of about one-third or more of the thickness of the Cu layer, and includes openings each opening a range at a distance of at least 300 μm from an end of each of the plurality of slots.
5. The scanning antenna according to claim 4 , comprising:
a plurality of columnar spacers disposed within the opening in the upper Ti layer.
6. The scanning antenna according to claim 5 ,
wherein the opening has a shape point-symmetric about a center of the corresponding slot.
7. The scanning antenna according to claim 4 , comprising:
a plurality of columnar spacers disposed around the opening in the upper Ti layer.
8. The scanning antenna according to claim 5 ,
wherein the plurality of columnar spacers are disposed to be line-symmetric about an axis passing through a center of the corresponding slot and parallel to a length direction.
9. A scanning antenna including a plurality of antenna units arranged in the scanning antenna, the scanning antenna comprising:
a TFT substrate including a first dielectric substrate, a plurality of TFTs supported by the first dielectric substrate, a plurality of gate bus lines, a plurality of source bus lines, and a plurality of patch electrodes;
a slot substrate including a second dielectric substrate and a slot electrode supported by a first main surface of the second dielectric substrate;
a liquid crystal layer provided between the TFT substrate and the slot substrate; and
a reflective conductive plate disposed opposing a second main surface of the second dielectric substrate, the second main surface being on a side opposite to the first main surface, across a dielectric layer,
wherein the slot electrode includes a plurality of slots disposed corresponding to the plurality of patch electrodes,
each of the plurality of patch electrodes is connected to a drain of the corresponding TFT, and
the slot electrode includes a Cu layer having a thickness of greater than or equal to about 2 μm and less than or equal to about 6 μm, the Cu layer includes an electroless plating layer formed on a side closer to the second dielectric substrate and an electrolytic plating layer formed on the electroless plating, and a thickness of the electrolytic plating layer is more than four times a thickness of the electroless plating layer.
10. The scanning antenna according to claim 9 , further comprising:
an underlayer Ti layer formed on the second dielectric substrate and having a thickness not exceeding about 50 nm; and
an underlayer Cu layer formed on the underlayer Ti layer and having a thickness not exceeding about 300 nm,
wherein the electroless plating layer is formed on the underlayer Cu layer.
11. A scanning antenna including a plurality of antenna units arranged in the scanning antenna, the scanning antenna comprising:
a TFT substrate including a first dielectric substrate, a plurality of TFTs supported by the first dielectric substrate, a plurality of gate bus lines, a plurality of source bus lines, and a plurality of patch electrodes;
a slot substrate including a second dielectric substrate and a slot electrode supported by a first main surface of the second dielectric substrate;
a liquid crystal layer provided between the TFT substrate and the slot substrate; and
a reflective conductive plate disposed opposing a second main surface of the second dielectric substrate, the second main surface being on a side opposite to the first main surface, across a dielectric layer,
wherein the slot electrode includes a plurality of slots disposed corresponding to the plurality of patch electrodes,
each of the plurality of patch electrodes is connected to a drain of the corresponding TFT, and
the slot electrode includes an underlayer Ti layer formed on the second dielectric substrate and having a thickness not exceeding about 50 nm, an underlayer Cu layer formed on the underlayer Ti layer and having a thickness not exceeding about 300 nm, and an electrolytic plating Cu layer having a thickness of greater than or equal to about 2 μm and less than or equal to about 6 μm.
12. A manufacturing method of the scanning antenna according to claim 11 , the method comprising:
a method of forming the slot electrode including,
forming a Ti film and an underlayer Cu film on the second dielectric substrate by sputtering,
patterning the Ti film and the underlayer Cu film to obtain the underlayer Ti layer and the underlayer Cu layer, and
forming the electrolytic plating Cu layer on the underlayer Cu layer by electrolytic plating.