IP Library Granted Patent US 11,238,579
Granted Patent B2
US 11,238,579 · App. 16/479,138 · Granted Feb 1, 2022

Defect pattern grouping method and system

Inventors: Wei Fang (San Jose, CA); Haili Zhang (San Jose, CA); Zhichao Chen (San Jose, CA); Shengcheng Jin (San Jose, CA)
Assignee: ASML Netherlands B.V.
G06T7/001G03F7/7065G05B19/406G05B2219/32222G06T2207/30148
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,238,579
App. No.
16/479,138
Granted
Feb 1, 2022
Kind
B2
Abstract

A defect pattern grouping method is disclosed. The defect pattern grouping method comprises obtaining a first polygon that represents a first defect from an image of a sample, comparing the first polygon with a set of one or more representative polygons of a defect-pattern collection, and grouping the first polygon with any one or more representative polygons identified based on the comparison.

Claims (65)

1. A defect pattern grouping method comprising:

identifying a first polygon that represents a first defect and a second polygon that represents a second defect based on an image of a sample;

comparing the first polygon and the second polygon with a set of one or more representative polygons of a defect-pattern collection; and

grouping the first polygon and the second polygon based on the comparison, the grouping further comprising:

in response to the comparison indicating that the first polygon is similar to any one of the set of one or more representative polygons,

comparing neighboring polygon information of the first polygon and the set of one or more representative polygons;

grouping the first polygon and the set of one or more representative polygons into different secondary groups in response to the neighboring polygon information of the first polygon and the set of one or more representative polygons being different; and

grouping the first polygon into a same group of defects represented by the set of one or more representative polygons in response to the neighboring polygon information of the first polygon and the set of one or more representative polygons being the same; and

in response to the comparison indicating that the second polygon is different from any one of the set of one or more representative polygons, grouping the second polygon into a new group of defects represented by the second polygon.

2. The defect pattern grouping method of claim 1 , further comprising:

acquiring the set of one or more representative polygons, wherein polygons of the set of one or more representative polygons have a polygon pattern that is similar to a pattern of the first polygon.

3. The defect pattern grouping method of claim 2 , further comprising:

designating the first polygon and the acquired set of one or more representative polygons as central polygons.

4. The defect pattern grouping method of claim 2 , further comprising:

acquiring the set of one or more representative polygons, wherein polygons of the set of one or more representative polygons have one or more topological characteristics that are similar to one or more topological characteristics of the first polygon.

5. The defect pattern grouping method of claim 2 , wherein comparing the first polygon with a set of one or more representative polygons of a defect-pattern collection further comprises determining a similarity between the first polygon and the set of one or more representative polygons of a defect-pattern collection.

6. The defect pattern grouping method of claim 5 , wherein determining the similarity between the first polygon and the set of one or more representative polygons of a defect-pattern collection further comprises:

aligning a polygon pattern of the first polygon representing the first defect with a polygon pattern of one of the set of one or more representative polygons of a defect-pattern collection; and

determining the similarity based on the alignment.

7. The defect pattern grouping method of claim 6 , further comprising:

grouping the first polygon with the one or more acquired representative polygons, in response to the similarity being greater than a preset similarity threshold.

8. The defect pattern grouping method of claim 1 , wherein comparing the second polygon with a set of one or more representative polygons of a defect-pattern collection further comprises:

determining a similarity between the second polygon and the set of one or more representative polygons of a defect-pattern collection, the determining further comprising:

aligning a polygon pattern of the second defect with a polygon pattern of one of the set of one or more representative polygons of a defect-pattern collection; and

determining the similarity based on the alignment; and

grouping the second polygon into the new group of defects and identifying the second polygon as a representative polygon of a defect pattern of the new group of defects, in response to the similarity not being greater than a preset similarity threshold.

9. A defect pattern grouping system comprising:

a memory configured to store a set of instructions; and,

one or more processors configured to execute the set of instructions to cause the defect pattern grouping system to:

identify a first polygon that represents a first defect and a second polygon that represents a second defect based on an image of a sample;

compare the first polygon and the second polygon with a set of one or more representative polygons of a defect-pattern collection; and

group the first polygon and the second polygon based on the comparison, wherein the one or more processors are configured to execute the set of instructions to further cause the defect pattern grouping system to:

in response to the comparison indicating that the first polygon is similar to any one of the set of one or more representative polygons,

compare neighboring polygon information of the first polygon and the set of one or more representative polygons;

group the first polygon and the set of one or more representative polygons into different secondary groups in response to the neighboring polygon information of the first polygon and the set of one or more representative polygons being different; and

group the first polygon into a same group of defects represented by the set of one or more representative polygons in response to the neighboring polygon information of the first polygon and the set of one or more representative polygons being the same; and

group the second polygon into a new group of defects represented by the second polygon in response to the comparison indicating that the second polygon is different from any one of the set of one or more representative polygons.

10. The defect pattern grouping system of claim 9 , wherein the one or more processors are configured to execute the set of instructions to further cause the defect pattern grouping system to:

acquire the set of one or more representative polygons, wherein polygons of the set of one or more representative polygons have a polygon pattern that is similar to a pattern of the first polygon; and

designate the first polygon and the acquired set of one or more representative polygons as central polygons.

11. The defect pattern grouping system of claim 10 , wherein the one or more processors are configured to execute the set of instructions to further cause the defect pattern grouping system to:

acquire the set of one or more representative polygons, wherein polygons of the set of one or more representative polygons have one or more topological characteristics that are similar to one or more topological characteristics of the first polygon.

12. The defect pattern grouping system of claim 10 , wherein the one or more processors are configured to execute the set of instructions to further cause the defect pattern grouping system to:

determine a similarity between the first polygon and the set of one or more representative polygons of a defect-pattern collection.

13. The defect pattern grouping system of claim 12 , wherein the one or more processors are configured to execute the set of instructions to further cause the defect pattern grouping system to:

group the first polygon with the one or more acquired representative polygons, in response to the similarity being greater than a preset similarity threshold.

14. The defect pattern grouping method of claim 3 , wherein the neighboring polygon information includes topological characteristics of one or more neighboring polygon patterns surrounding the central polygons.

15. The defect pattern grouping system of claim 12 , wherein the one or more processors are configured to execute the set of instructions to further cause the defect pattern grouping system to:

align a polygon pattern of the first polygon representing the first defect with a polygon pattern of one of the set of one or more representative polygons of a defect-pattern collection; and

determine the similarity based on the alignment.

16. The defect pattern grouping system of claim 10 , wherein the neighboring polygon information includes topological characteristics of one or more neighboring polygon patterns surrounding the central polygons.

17. The defect pattern grouping system of claim 10 , wherein the one or more processors are configured to execute the set of instructions to further cause the defect pattern grouping system to:

determine a similarity between the second polygon and the set of one or more representative polygons of a defect-pattern collection, wherein the one or more processors are configured to execute the set of instructions to further cause the defect pattern grouping system to:

align a polygon pattern of the second defect with a polygon pattern of one of the set of one or more representative polygons of a defect-pattern collection; and

determine the similarity based on the alignment; and

group the second polygon into the new group of defects and identifying the second polygon as a representative polygon of a defect pattern of the new group of defects, in response to the similarity not being greater than a preset similarity threshold.

18. A non-transitory computer readable medium that stores a set of instructions that is executable by one or more processors of a computing device to cause the computing device to perform a defect pattern grouping method, the method comprising:

identifying a first polygon that represents a first defect and a second polygon that represents a second defect based on an image of a sample;

comparing the first polygon and the second polygon with a set of one or more representative polygons of a defect-pattern collection; and

grouping the first polygon and the second polygon based on the comparison, the grouping further comprising:

in response to the comparison indicating that the first polygon is similar to any one of the set of one or more representative polygons,

comparing neighboring polygon information of the first polygon and the set of one or more representative polygons;

grouping the first polygon and the set of one or more representative polygons into different secondary groups in response to the neighboring polygon information of the first polygon and the set of one or more representative polygons being different; and

grouping the first polygon into a same group of defects represented by the set of one or more representative polygons in response to the neighboring polygon information of the first polygon and the set of one or more representative polygons being the same; and

in response to the comparison indicating that the second polygon is different from any one of the set of one or more representative polygons, grouping the second polygon into a new group of defects represented by the second polygon.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 2, 2019
From: FANG, WEI; ZHANG, HAILI; CHEN, ZHICHAO; JIN, SHENGCHENG
To: HERMES MICROVISION, INC.
Reel/Frame 049947/0004 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 2, 2019
From: HERMES MICROVISION, INC.
To: HERMES MICROVISION INCORPORATED B.V.
Reel/Frame 049947/0219 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 2, 2019
From: HERMES MICROVISION INCORPORATED B.V.
To: ASML NETHERLANDS B.V.
Reel/Frame 049947/0391 →
Continuity (3)
Provisional Application 62616420 · Jan 11, 2018
Provisional Application 62447581 · Jan 18, 2017
Related Publication 20190333205A1 · Oct 31, 2019