Methods for fast and reversible dry adhesion tuning between composite structures and substrates using dynamically tunable stiffness
Disclosed herein are embodiments of methods that utilize dry adhesion tuning of a composite structure to adhere substrates. In some embodiments, the disclosed methods utilize dry adhesion between a composite structure and a substrate and further dynamically control the resulting dry adhesion strength through a heating step, which facilitates rigidity tuning of a core component of the composite structure and/or facilitates thermal control of the interface between the substrate and the composite structure. Also disclosed herein are array devices and other products comprising the disclosed composite structures.
1. A product, comprising:
a substrate; and
a composite structure including a shell component comprising
a flexible elastomer material;
a core component comprising a rigidity tunable material or structure;
one or more conductive wires; and
a heater component, comprising an elastomer configured with one or more channels comprising a low melting point alloy,
wherein the substrate is adhered to the composite structure by dry adhesion and wherein the heater component is attached to a portion of the composite structure that is in contact with the substrate.
2. The product of claim 1 , wherein the substrate is a substrate comprising a flat, rigid, smooth surface.
3. The product of claim 1 , wherein the substrate is a semiconductor wafer, display, glass sheet, or smooth metal components.
4. The product of claim 1 , wherein the rigidity tunable material is a conductive propylene-based elastomer, a low melting point alloy, or a combination thereof; a magnetorheological elastomer; or an electrorheological elastomer.