Wire saw, wire guide roll and method for simultaneously cutting a multiplicity of wafers from an ingot

1. A method for simultaneously cutting a multiplicity of wafers from an ingot, comprising:

moving the ingot through a wire web of a structured sawing wire having a longitudinal direction and consisting of a single strand of a plain core wire having a round cross-section and a multiplicity of indentations and protrusions of the plain core wire perpendicular to the longitudinal direction of the plain core wire, the outer radial extent of the indentations and protrusions defining a cross-sectional envelope of the structured sawing wire,

wherein the structured sawing wire is spanned between two co-rotating wire guide rolls having grooves, and an abrasive slurry is applied to the wire web, and

wherein the grooves of the two co-rotating wire guide rolls have groove bottoms, and wherein the bottom of each groove on which the structured sawing wire bears is curved with a radius of curvature is equal to or up to 1.5 times as large as the radius of the cross-sectional envelope the structured sawing wire which is in the respective groove.

2. The method of claim 1 , wherein the indentations and protrusions point on average over the longitudinal direction of the structured sawing wire in all planes perpendicular to the longitudinal direction and are formed by means of structuring of the plain core wire in a plane perpendicular to the longitudinal direction and torsioning of the structured sawing wire about the longitudinal axis of the structured sawing wire, so that a twisted structured sawing wire thus formed has the shape of a helix.

3. The method of claim 1 , wherein the structured sawing wire is guided spirally under a tension acting perpendicularly to a bottom surface of the cross-sectional envelope in the grooves around the wire guide rolls, such that a plane web of sections of the structured sawing wire extending parallel to one another is formed between the two wire guide rolls.

4. The method of claim 1 , wherein the plain core wire has a diameter of from 130 μm to 175 μm.

5. The method of claim 4 , wherein the diameter of the cross-sectional envelope of the structured sawing wire is from 1.02 to 1.25 times the diameter of the core wire.

6. The method of claim 1 , wherein the cross-sectional envelope of the structured sawing wire has a diameter of from 1.02 to 1.25 times the diameter of the plain core wire.

7. The method of claim 1 , wherein the shortest distance of each individual groove from the axis of the wire guide roll is selected such that all points of the cross-sectional envelope of the structured sawing wire with the greatest distance from the axis of the wire guide roll in each groove have the same distance from the axis of the wire guide roll.

8. The method of claim 1 , wherein the envelope of the structured sawing wire is reduced when tension of the structured sawing wire is increased.

9. The method of claim 1 , wherein the indentations and protrusions of the structured sawing wire exhibit a spacing in the longitudinal direction defining a wavelength, and the wavelength is different along at least two lengths of the structured sawing wire.

10. The method of claim 1 , wherein the indentations and protrusions have an amplitude from a longitudinal axis of the structured sawing wire and the amplitude changes at least once in the longitudinal direction.

11. The method of claim 1 , wherein sides of the grooves extending from the bottom of the outwards from an axis of the wire guide rolls define a V shape with an included angle of 60° to 130°.