IP Library Granted Patent US 11,131,009
Granted Patent B2
US 11,131,009 · App. 16/488,028 · Granted Sep 28, 2021

High-strength free-cutting copper alloy and method for producing high-strength free-cutting copper alloy

Inventors: Keiichiro Oishi (Osaka, JP); Kouichi Suzaki (Osaka, JP); Hiroki Goto (Osaka, JP)
Assignee: Mitsubishi Materials Corporation
C22C9/04C22F1/002C22F1/08
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Quick Facts
Patent No.
US 11,131,009
App. No.
16/488,028
Granted
Sep 28, 2021
Kind
B2
Abstract

This high-strength free-cutting copper alloy comprises 75.4-78.0% Cu, 3.05-3.55% Si, 0.05-0.13% P and 0.005-0.070% Pb, with the remainder comprising Zn and inevitable impurities, wherein the amount of Sn existing as inevitable impurities is at most 0.05%, the amount of Al is at most 0.05%, and the total amount of Sn and Al is at most 0.06%. The composition satisfies the following relations: 78.0≤f1=Cu+0.8×Si+P+Pb≤80.8; and 60.2≤f2=Cu−4.7×Si−P+0.5×Pb≤61.5. The area percentage (%) of respective constituent phases satisfies the following relations: 29≤κ≤60; 0≤γ≤0.3; β=0; 0≤μ≤1.0; 98.6≤f3=α+κ; 99.7≤f4=α+κ+γ+μ; 0≤f5=γ+μ≤1.2; and 30≤f6=κ+6×γ 1/2 +0.5×μ≤62. The long side of the γ phase is at most 25 μm, the long side of the μ phase is at most 20 μm, and the κ phase is present within the α phase.

Claims (79)

1. A free-cutting copper alloy comprising:

75.4 mass % to 78.0 mass % of Cu;

3.05 mass % to 3.55 mass % of Si;

0.05 mass % to 0.13 mass % of P;

0.005 mass % to 0.070 mass % of Pb; and

a balance including Zn and inevitable impurities,

wherein a total amount of Fe, Mn, Co, and Cr as the inevitable impurities is lower than 0.08 mass %,

a content of Sn present as inevitable impurity is 0.05 mass % or lower,

a content of Al present as inevitable impurity is 0.05 mass % or lower,

a total content of Sn and Al present as inevitable impurity is 0.06 mass % or lower,

when a Cu content is represented by [Cu] mass %, a Si content is represented by [Si] mass %, a Pb content is represented by [Pb] mass %, and a P content is represented by [P] mass %, the relations of

78.0≤ f 1=[ Cu ]+0.8×[ Si ]+[ P ]+[ Pb ]≤80.8 and

60.2≤ f 2=[ Cu ]−4.7×[ Si ]−[ P ]+0.5×[ Pb ]≤61.5

are satisfied,

in constituent phases of metallographic structure, when an area ratio of a phase is represented by (α)%, an area ratio of p phase is represented by (β)%, an area ratio of γ phase is represented by (γ)%, an area ratio of K phase is represented by (κ)%, and an area ratio of phase is represented by (μ)%, the relations of

29≤(κ)≤60,

0≤(γ)≤0.3,

(β)=0,

0≤(μ)≤1.0,

98.6≤ f 3=(α)+(κ),

99.7≤ f 4=(α)+(κ)+(γ)+(μ),

0≤ f 5=(γ)+(μ)≤1.2, and

30≤ f 6=(κ)+6×(γ) 1/2 +0.5×(μ)≤62

are satisfied,

the length of the long side of γ phase is 25 μm or less,

the length of the long side of μ phase is 20 μm or less, and

acicular κ phase is present in α phase,

wherein the acicular κ phase is present in α phase in an amount such that when micrographs of arbitrarily selected five visual fields of a cross-section of the copper alloy are taken at a magnification of 500-fold using a metallographic microscope, and the micrograph of each of the visual fields is presented as an image of dimensions of 70 mm in length and 90 mm in width for a visual field size of 220 μm in length and 276 μm in width, an average number of the acicular κ phases counted in the images of the five visual fields is 20 or more.

2. The free-cutting copper alloy according to claim 1 ,

wherein a Charpy impact test value when a U-notched specimen is used is 12 J/cm 2 to 50 J/cm 2 ,

a tensile strength at normal temperature is 550 N/mm 2 or higher, and

a creep strain after holding the copper alloy at 150° C. for 100 hours in a state where a load corresponding to 0.2% proof stress at room temperature is applied is 0.3% or lower.

3. The free-cutting copper alloy according to claim 1 ,

wherein the free-cutting copper alloy is a hot worked material,

a tensile strength S (N/mm 2 ) is 550 N/mm 2 or higher,

an elongation E (%) is 12% or higher,

a Charpy impact test value I (J/cm 2 ) when a U-notched specimen is used is 12 J/cm 2 or higher, and

675≤f8=S×{(E+100)/100} 1/2 or 700≤f9=S×{(E+100)/100} 1/2 +I is satisfied.

4. The free-cutting copper alloy according to claim 1 , that is for use in a water supply device, an industrial plumbing component, a device that comes in contact with liquid or gas, a pressure vessel, a fitting, an automobile component, or an electric appliance component.

5. The free-cutting copper alloy according to claim 1 , further comprising:

one or more element(s) selected from the group consisting of 0.01 mass % to 0.07 mass % of Sb, 0.02 mass % to 0.07 mass % of As, and 0.005 mass % to 0.10 mass % of Bi.

6. The free-cutting copper alloy according to claim 5 ,

wherein a Charpy impact test value when a U-notched specimen is used is 12 J/cm 2 to 50 J/cm 2 ,

a tensile strength at normal temperature is 550 N/mm 2 or higher, and

a creep strain after holding the copper alloy at 150° C. for 100 hours in a state where a load corresponding to 0.2% proof stress at room temperature is applied is 0.3% or lower.

7. The free-cutting copper alloy according to claim 5 ,

wherein the free-cutting copper alloy is a hot worked material,

a tensile strength S (N/mm 2 ) is 550 N/mm 2 or higher,

an elongation E (%) is 12% or higher,

a Charpy impact test value I (J/cm 2 ) when a U-notched specimen is used is 12 J/cm 2 or higher, and

675≤f8=S×{(E+100)/100} 1/2 or 700≤f9=S×{(E+100)/100} 1/2 +I is satisfied.

8. The free-cutting copper alloy according to claim 5 , that is for use in a water supply device, an industrial plumbing component, a device that comes in contact with liquid or gas, a pressure vessel, a fitting, an automobile component, or an electric appliance component.

9. A free-cutting copper alloy comprising:

75.6 mass % to 77.8 mass % of Cu;

3.15 mass % to 3.5 mass % of Si;

0.06 mass % to 0.12 mass % of P;

0.006 mass % to 0.045 mass % of Pb; and

a balance including Zn and inevitable impurities, wherein a total amount of Fe, Mn, Co, and Cr as the inevitable impurities is lower than 0.08 mass %,

a content of Sn present as inevitable impurity is 0.03 mass % or lower,

a content of Al present as inevitable impurity is 0.03 mass % or lower,

a total content of Sn and Al present as inevitable impurity is 0.04 mass % or lower,

when a Cu content is represented by [Cu] mass %, a Si content is represented by [Si] mass %, a Pb content is represented by [Pb] mass %, and a P content is represented by [P] mass %, the relations of

78.5≤ f 1=[ Cu ]+0.8×[ Si ]+[ P ]+[ Pb ]≤80.5 and

60.4≤ f 2=[ Cu ]−4.7×[ Si ]−[ P ]+0.5×[ Pb ]≤61.3

are satisfied,

in constituent phases of metallographic structure, when an area ratio of α phase is represented by (α)%, an area ratio of β phase is represented by (β)%, an area ratio of γ phase is represented by (γ)%, an area ratio of κ phase is represented by (κ)%, and an area ratio of μ phase is represented by (μ)%, the relations of

33≤(κ)≤58,

(γ)=0,

(β)=0,

0≤(μ)≤0.5,

99.3≤ f 3=(α)+(κ),

99.8≤ f 4=(α)+(κ)+(γ)+(μ),

0≤ f 5=(γ)+(μ)≤0.5, and

33≤ f 6=(κ)+6×(γ) 1/2 +0.5×(μ)≤58

are satisfied,

acicular κ phase is present in α phase, and the length of the long side of μ phase is 15 μm or less.

10. The free-cutting copper alloy according to claim 9 , further comprising:

one or more element(s) selected from the group consisting of 0.012 mass % to 0.05 mass % of Sb, 0.025 mass % to 0.05 mass % of As, and 0.006 mass % to 0.05 mass % of Bi,

wherein a total content of Sb, As, and Bi is 0.09 mass % or lower.

Assignments (2)
MERGER Recorded Jul 13, 2021
From: MITSUBISHI SHINDOH CO., LTD.
To: MITSUBISHI MATERIALS CORPORATION
Reel/Frame 056860/0853 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 22, 2019
From: OISHI, KEIICHIRO; SUZAKI, KOUICHI; GOTO, HIROKI
To: MITSUBISHI SHINDOH CO., LTD.
Reel/Frame 050134/0293 →
Priority Claims (5)
WO PCT/JP2017/029369 · Aug 15, 2017 · international
WO PCT/JP2017/029371 · Aug 15, 2017 · international
WO PCT/JP2017/029373 · Aug 15, 2017 · international
WO PCT/JP2017/029374 · Aug 15, 2017 · international
WO PCT/JP2017/029376 · Aug 15, 2017 · international
Continuity (1)
Related Publication 20200181739A1 · Jun 11, 2020