IP Library Granted Patent US 11,518,852
Granted Patent B2
US 11,518,852 · App. 16/489,401 · Granted Dec 6, 2022

Polyamideimide resin and use thereof

Inventor: Yasuyuki Saito (Hitachi, JP)
Assignee: SHOWA DENKO MATERIALS CO., LTD.
C08G73/10C08G18/80C08G73/14C08L79/08
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Quick Facts
Patent No.
US 11,518,852
App. No.
16/489,401
Granted
Dec 6, 2022
Kind
B2
Abstract

A polyamideimide resin having an isocyanate group blocked with a compound selected from the group consisting of alcohols, oximes and lactams, and having a carboxyl group blocked with a vinyl ether group-containing compound.

Claims (19)

1. A method for producing a polyamideimide resin comprising:

reacting a polyvalent isocyanate and a tribasic acid anhydride and/or tribasic acid halide in an N-formyl group-containing solvent at a temperature of 70 to 80° C. to obtain a polyamideimide resin having an isocyanate group and a carboxyl group,

blocking the isocyanate group of the polyamideimide resin with a compound selected from the group consisting of alcohols, oximes and lactams, and blocking the carboxyl group with a vinyl ether group-containing compound,

wherein the reaction between the polyvalent isocyanate and the tribasic acid anhydride and/or tribasic acid halide is performed by using at least one catalyst selected from the group consisting of tertiary amines, and the reaction temperature does not exceed 80° C.

2. A method for producing a polyamideimide resin comprising:

reacting a polyvalent isocyanate having an isocyanate group that has been blocked with a compound selected from the group consisting of alcohols, oximes and lactams, with a tribasic acid anhydride and/or tribasic acid halide having a carboxyl group that has been blocked with a vinyl ether group-containing compound, in an N-formyl group-containing solvent at a temperature of 70 to 80° C. to obtain a polyamideimide resin,

wherein the reaction between the polyvalent isocyanate and the tribasic acid anhydride and/or tribasic acid halide is performed by using at least one catalyst selected from the group consisting of tertiary amines, and the reaction temperature does not exceed 80° C.

3. The method for producing a polyamideimide resin according to claim 1 , wherein the compound for blocking the isocyanate group comprises a ketoxime represented by:

CRR′═N—OH,  (Formula 1)

wherein each of R and R′ independently represents an alkyl group of 1 to 6 carbon atoms.

4. The method for producing a polyamideimide resin according to claim 1 , wherein the vinyl ether group-containing compound comprises an alkyl vinyl ether represented by:

CH 2 ═CH—O—R,  (Formula 2)

wherein R represents an alkyl group of 1 to 10 carbon atoms.

5. The method for producing a polyamideimide resin according to claim 2 , wherein the compound for blocking the isocyanate group comprises a ketoxime represented by:

CRR′═N—OH,  (Formula 1)

wherein each of R and R′ independently represents an alkyl group of 1 to 6 carbon atoms.

6. The method for producing a polyamideimide resin according to claim 2 , wherein the vinyl ether group-containing compound comprises an alkyl vinyl ether represented by:

CH 2 ═CH—O—R,  (Formula 2)

wherein R represents an alkyl group of 1 to 10 carbon atoms.

Assignments (4)
CHANGE OF ADDRESS Recorded Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
CHANGE OF NAME Recorded Mar 10, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063040/0001 →
CHANGE OF NAME Recorded Sep 16, 2022
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 061452/0891 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 28, 2019
From: SAITO, YASUYUKI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 050199/0740 →