Patent Assignment
Reel/Frame 063040/0001
Change of Name
Recorded: 2023-03-10
Pages: 12
Assignor
SHOWA DENKO MATERIALS CO., LTD.
Executed: 2023-01-01
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU,, TOKYO, 105-8518, JAPAN
Covered Properties
(11)
Polyamideimide Resin Composition and Flourine-Based Coating Material
Polyamideimide Resin and Use Thereof
Semiconductor Device Manufacturing Method, Curable Resin Composition for Temporary Fixation Material, Film for Temporary Fixation Material, and Laminated Film for Temporary Fixation Material
Friction Member, Friction Material Composition for Lower Layer Material, Lower Layer Material, Disc Brake Pad, and Vehicle
Application:
17/260,138 →
Publication:
US US20210293291A1
Hinge
Resin Molded Article
Application:
17/766,011 →
Publication:
US US20220339833A1
Foam-Molded Product, Method for Manufacturing Foam-Molded Product, and Method for Suppressing Appearance Defect of Foam-Molded Product
Injection Molded Product
Solder Bump Forming Member, Method for Manufacturing Solder Bump Forming Member, and Method for Manufacturing Electrode Substrate Provided with Solder Bump
Connection Structure and Manufacturing Method Therefor
Polyamideimide Resin Composition and Fluorine-Containing Coating Material
Application:
17/981,060 →
Publication:
US US20230066239A1
Related Assignments
(15)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 15, 2019
From: TAKAHASHI, ATSUSHI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 050065/0546 →
Assignment of Assignor's Interest
Aug 28, 2019
From: SAITO, YASUYUKI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 050199/0740 →
Assignment of Assignor's Interest
Jul 29, 2020
From: MIYAZAWA, EMI; HAYASAKA, TSUYOSHI; KAWAMORI, TAKASHI; SUKATA, SHINICHIRO
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 053339/0878 →
Assignment of Assignor's Interest
Jan 13, 2021
From: TAKAHASHI, YOSHIHISA; UNNO, MITSUO
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 054909/0529 →
Assignment of Assignor's Interest
Apr 1, 2022
From: YAMADA, KOUJI; NAKANO, SHINGO; MITSUISHI, NAOKO; MORISHITA, SEIGO
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 059474/0320 →
Assignment of Assignor's Interest
Apr 4, 2022
From: MITSUISHI, NAOKO; NAKANO, SHINGO; YAMADA, KOUJI; FUJINO, HIROAKI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 059493/0109 →
Assignment of Assignor's Interest
Apr 5, 2022
From: FUNATSU, TAKESHI; NAKANO, SHINGO; MITSUISHI, NAOKO; YAMADA, KOUJI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 059506/0562 →
Assignment of Assignor's Interest
Aug 3, 2022
From: AKAI, KUNIHIKO; MIYAJI, MASAYUKI; KAKEHATA, JUNICHI; EJIRI, YOSHINORI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 060706/0681 →
Assignment of Assignor's Interest
Aug 4, 2022
From: AKAI, KUNIHIKO; MIYAJI, MASAYUKI; KAKEHATA, JUNICHI; EJIRI, YOSHINORI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 061148/0538 →
Change of Name
Sep 16, 2022
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 061452/0891 →
Change of Name
Oct 5, 2022
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 061610/0889 →
Change of Name
Nov 10, 2022
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 061915/0221 →
Change of Name
Mar 9, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 063024/0352 →
Change of Address
Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →