IP Library › Assignment 059474/0320
Patent Assignment
Reel/Frame 059474/0320

Assignment of Assignor's Interest

Recorded: 2022-04-01 Pages: 5
Assignors
YAMADA, KOUJI
Executed: 2022-02-25
NAKANO, SHINGO
Executed: 2022-02-25
MITSUISHI, NAOKO
Executed: 2022-02-25
MORISHITA, SEIGO
Executed: 2022-02-25
ANDO, HIROYUKI
Executed: 2022-02-25
HIRAI, YOJI
Executed: 2022-02-25
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 1006606, JAPAN
Covered Property (1)
Resin Molded Article
Application: 17/766,011 →
Publication: US 2022/0339833
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 10, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063040/0001 →
Change of Address Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →