Assignment of Assignor's Interest

Recorded: 2022-04-04 Pages: 5

Assignors

MITSUISHI, NAOKO

Executed: 2022-02-17

NAKANO, SHINGO

Executed: 2022-02-17

YAMADA, KOUJI

Executed: 2022-02-17

FUJINO, HIROAKI

Executed: 2022-02-17

SHIOKAWA, HIROFUMI

Executed: 2022-02-17

HIRAI, YOJI

Executed: 2022-02-17

Assignee

SHOWA DENKO MATERIALS CO., LTD.

9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 1006606, JAPAN

Covered Property (1)

Foam-Molded Product, Method for Manufacturing Foam-Molded Product, and Method for Suppressing Appearance Defect of Foam-Molded Product

Application: 17/766,448 →

Publication: US 2023/0025703

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.