Patent Assignment
Reel/Frame 063024/0352
Change of Name
Recorded: 2023-03-09
Pages: 26
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2020-10-01
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 1006606, JAPAN
Covered Properties
(2)
Polyamideimide Resin Composition and Flourine-Based Coating Material
Semiconductor Device Manufacturing Method, Curable Resin Composition for Temporary Fixation Material, Film for Temporary Fixation Material, and Laminated Film for Temporary Fixation Material
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 15, 2019
From: TAKAHASHI, ATSUSHI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 050065/0546 →
Assignment of Assignor's Interest
Jul 29, 2020
From: MIYAZAWA, EMI; HAYASAKA, TSUYOSHI; KAWAMORI, TAKASHI; SUKATA, SHINICHIRO
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 053339/0878 →
Change of Name
Mar 10, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063040/0001 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →