Patent Assignment
Reel/Frame 053339/0878
Assignment of Assignor's Interest
Recorded: 2020-07-29
Pages: 4
Assignors
MIYAZAWA, EMI
Executed: 2020-06-09
HAYASAKA, TSUYOSHI
Executed: 2020-06-08
KAWAMORI, TAKASHI
Executed: 2020-06-09
SUKATA, SHINICHIRO
Executed: 2020-06-09
INABA, YOSHIHITO
Executed: 2020-06-17
NISHIDO, KEISUKE
Executed: 2020-06-17
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 1006606, JAPAN
Covered Property
(1)
Semiconductor Device Manufacturing Method, Curable Resin Composition for Temporary Fixation Material, Film for Temporary Fixation Material, and Laminated Film for Temporary Fixation Material
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 9, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 063024/0352 →
Change of Name
Mar 10, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063040/0001 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →