Polyamideimide resin composition and flourine-based coating material
Disclosed are a polyamideimide resin composition comprising (A) a polyamideimide resin, (B) a 3-alkoxy-N,N-dimethylpropanamide, and (C) water; and a fluorine-based coating material comprising the polyamideimide resin composition and a fluororesin.
1. A polyamideimide resin composition comprising: (A) a polyamideimide resin, (B) a 3-alkoxy-N,N-dimethylpropanamide, (C) water, and a basic compound,
wherein the polyamideimide resin composition excludes N-formylmorpholine,
an acid value of the polyamideimide resin (A), composed of a combination of carboxyl groups and other carboxyl groups formed as a result of ring-opening of acid anhydride groups, is within a range from 10 to 80 mgKOH/g, and
the basic compound is included in an amount of 2.5 to 10 equivalents, relative to the acid value of the polyamideimide resin (A).
2. The polyamideimide resin composition according to claim 1 , wherein a number average molecular weight of the polyamideimide resin (A) is within a range from 5,000 to 50,000.
3. The polyamideimide resin composition according to claim 1 , wherein an amount of the water (C) is at least 10% by mass of the composition.