Patent Assignment
Reel/Frame 061148/0538
Assignment of Assignor's Interest
Recorded: 2022-08-04
Pages: 3
Assignors
AKAI, KUNIHIKO
Executed: 2022-06-30
MIYAJI, MASAYUKI
Executed: 2022-07-04
KAKEHATA, JUNICHI
Executed: 2022-06-29
EJIRI, YOSHINORI
Executed: 2022-07-11
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Solder Bump Forming Member, Method for Manufacturing Solder Bump Forming Member, and Method for Manufacturing Electrode Substrate Provided with Solder Bump
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.