IP Library Assignment 059506/0562
Patent Assignment
Reel/Frame 059506/0562

Assignment of Assignor's Interest

Recorded: 2022-04-05 Pages: 5
Assignors
FUNATSU, TAKESHI
Executed: 2022-03-01
NAKANO, SHINGO
Executed: 2022-03-01
MITSUISHI, NAOKO
Executed: 2022-03-01
YAMADA, KOUJI
Executed: 2022-03-01
FUJINO, HIROAKI
Executed: 2022-03-01
SHIOKAWA, HIROFUMI
Executed: 2022-03-01
HIRAI, YOJI
Executed: 2022-03-02
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 1006606, JAPAN
Covered Property (1)
Injection Molded Product
Application: 17/766,659 →
Publication: US 2023/0025993
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 10, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063040/0001 →
Change of Address Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →