Method and structure for layout and routing of PCB
View Patent ↗Disclosed are a method and a structure for layout and routing of a PCB. The method includes: arranging signal lines, a power plane and a ground plane of the PCB in combination, where a portion of a reference plane for the signal lines is configured as a ground plane for providing a reference plane and return paths for the signal lines, to save routing spates. Layout of regions for the power supply, the ground and signal lines is appropriately designed, thereby improving the design density of a board, reducing the number of layers of the PCB, and saving cost.
1. A method for layout and routing of a PCB, comprising:
arranging signal lines, a power plane and a ground plane of the PCB in combination, wherein
a portion of a reference plane for the signal lines is configured as a ground plane for providing a reference plane and return paths for the signal lines, the layout of the PCB comprises: a region for arranging a platform controller hub (PCH) and peripheral component interconnect express (PCIE) slots, a region for arranging dual-inline-memory-module (DIMM) slots and CPU, and a region for quick path interconnect (QPI) wiring, and the method comprises:
providing a PCB comprises 10 stacked layers,
arranging PCIE slots and a double data rate synchronous dynamic random access memory (DDR) memory on an L1 layer,
arranging a ground plane on an L2 layer,
arranging a DDR memory, high-speed lines, and other lines on an L3 layer,
arranging a power plane and a ground plane on an L4 layer,
arranging QPI wiring and a power plane on an L5 layer,
arranging QPI wiring, a ground plane, high-speed lines, and other lines on an L6 layer,
arranging a power plane and a ground plane on an L7 layer,
arranging a DDR memory, high-speed lines, and other lines on an L8 layer,
arranging a ground plane on an L9 layer,
arranging PCIE slots and a DDR memory on an L10 layer,
configuring a region of the L4 layer corresponding to the region for QPI wiring and the region for arranging DIMM slots and CPU for the ground plane, and configuring a remaining region of the L4 layer for the power plane, and
configuring a region of the L5 layer corresponds to the region for QPI wiring for arranging QPI signal lines, with the ground plane on the L4 layer being a reference plane corresponding to the QPI signal lines, and configuring a remaining region of the L5 layer for the power plane.
2. The method for layout and routing of a PCB according to claim 1 , comprising:
configuring a region of the L6 layer corresponding to the region for QPI wiring for arranging QPI signal lines, configuring a region of the L6 layer corresponding to the region for arranging a PCH and PCIE slots for arranging high-speed lines and other lines, and configuring a region of the L6 layer corresponding to the region for arranging DIM NI slots and CPU for a ground plane; and
configuring a region of the L7 layer corresponding to the region of the L6 layer configured for arranging QPI signal lines and the region of the L6 layer configured for arranging high-speed lines and other lines for a ground plane, for providing reference for the QPI signal lines and the high-speed lines on the L6 layer, and configuring a remaining region of the L7 layer for power supply.
3. A structure for layout and routing of a PCB, comprising:
signal lines, a power plane and a ground plane, wherein
a portion of a reference plane for signal lines is configured as a ground plane for providing a reference plane and return paths for the signal lines, the layout of the PCB comprises: a region for arranging a platform controller hub (PCH) and peripheral component interconnect express (PCIE) slots, a region for arranging dual-inline-memory-module (DIMM) slots and CPU, and a region for quick path interconnect (QPI) wiring, and,
the PCB comprising 10 stacked layers, wherein
PCIE slots and a double data rate synchronous dynamic random access memory (DDR) memory are arranged on an L1 layer,
a ground plane is arranged on an L2 layer,
a DDR memory, high-speed lines, and other lines are arranged on an L3 layer,
a power plane and a ground plane are arranged on an L4 layer,
QPI wiring and a power plane are arranged on an L5 layer,
QPI wiring, a ground plane, high-speed lines, and other lines are arranged on an L6 layer,
a power plane and a ground plane are arranged on an L7 layer,
a DDR memory, high-speed lines, and other lines are arranged on an L8 layer,
a ground plane is arranged on an L9 layer,
PCIE slots and a DDR memory are arranged on an L10 layer,
a region of the L4 layer corresponding to the region for QPI wiring and the region for arranging DIMM slots and CPU is configured for the ground plane, and a remaining region of the L4 layer is configured for the power plane, and
a region of the L5 layer corresponds to the region for QPI wiring is configured for arranging QPI signal lines, with the ground plane on the L4 layer being a reference plane corresponding to the QPI signal lines, and a remaining region of the L5 layer is configured for the power plane.
4. The structure for layout and routing of a PCB according to claim 3 , wherein
a region of the L6 layer corresponding to the region for QPI wiring is configured for arranging QPI signal lines, a region of the L6 layer corresponding to the region for arranging a PCH and PCIE slots is configured for arranging high-speed lines and other lines, and a region of the L6 layer corresponding to the region for arranging DIMM slots and CPU is configured for a ground plane; and
a region of the L7 layer corresponding to the region of the L6 layer configured for arranging QPI signal lines and the region of the L6 layer configured for arranging high-speed lines and other lines is configured for a ground plane, for providing reference for the QPI signal lines and the high-speed lines on the L6 layer, and a remaining region of the L7 layer is configured for power supply.