Tungsten target
There is provided a tungsten sputtering target that can provide a film deposition rate with less fluctuation over the target life. A tungsten sputtering target, wherein an area ratio of crystal grains having any of {100}, {110} and {111} planes oriented to a sputtering surface is 30% or less for any of the orientation planes, and an area ratio in total of crystal grains having orientation planes oriented to the sputtering surface other than {100}, {110} and {111} planes is 46% or more, the area ratio being obtained by an analysis of a cross section perpendicular to the sputtering surface with an inverse pole figure mapping using electron backscatter diffraction.
1. A tungsten sputtering target, wherein an area ratio of crystal grains having {100} planes oriented to a sputtering surface is in a range of 7.2 to 13.2%, an area ratio of crystal grains having {110} planes oriented to the sputtering surface is in a range of 20.4 to 23.4%, an area ratio of crystal grains having {111} planes oriented to the sputtering surface is in a range of 10.6 to 16.6%, and an area ratio in total of crystal grains having orientation planes oriented to the sputtering surface other than {100}, {11} and {111} planes is 46.8 to 62.1%, the area ratio being obtained by an analysis of a cross section perpendicular to the sputtering surface with an inverse pole figure mapping using electron backscatter diffraction.
2. The sputtering target according to claim 1 , wherein a relative density is 99.0% or higher.
3. The tungsten sputtering target according to claim 1 , wherein a standard deviation of the area ratio of crystal grains having any of {100}, {110} and {111} planes oriented to the sputtering surface is 3% or smaller.
4. The tungsten sputtering target according to claim 1 , wherein a standard deviation of the area ratio in total of crystal grains having orientation planes oriented to the sputtering surface other than {100}, {110} and {111} planes is 3% or smaller.
5. The tungsten sputtering target according to claim 1 , wherein an average crystal grain size on the sputtering surface is 50 μm or smaller.
6. The tungsten sputtering target according to claim 1 , wherein a standard deviation of an average crystal grain size on the sputtering surface is 3% or smaller.
7. The tungsten sputtering target according to claim 1 , wherein an oxygen content is 50 wtppm or less.