Solid state light emitter die having a heat spreader between a plurality lead frame

1. A solid state light emitter package comprising

a solid state light emitter die,

a first lead frame and a second lead frame being electrically isolated from the first lead frame, said lead frames are for receiving power from an external power source and are arranged to provide received power to the solid state light emitter die, the solid state light emitter die being at least partially provided on the first lead frame,

an electrical insulating material,

a thermal element being arranged in between the first lead frame and the second lead frame and being electrically isolated by the electrical insulating material from the first lead frame and from the second lead frame and the thermal element being at least one of a heat absorber or a heat spreader, the thermal element not being in direct thermal contact with the solid state light emitter die, and

a bridging element bridging the electrical insulating material and the thermal element in between the first lead frame and the second lead frame and the bridging element is for obtaining an electrical connection between the solid state light emitter die and the second lead frame

wherein, seen in a virtual plane that follows top surfaces of the first lead frame and the second lead frame, the thermal element at least partially encloses the first lead frame or the second lead frame to delay heat transfer between the first lead frame and the second lead frame.

2. A solid state light emitter package according to claim 1 , wherein one edge of the first lead frame is arranged opposite to one edge of the second lead frame and all shortest paths from the one edge of the first lead frame to the one edge of the second lead frame intersect with the thermal element.

3. A solid state light emitter package according to claim 1 , wherein the thermal element comprises an U-shape, and the first lead frame or the second lead frame is provided inside the U-shaped thermal element.

4. A solid state light emitter package according claim 1 , wherein, seen in a virtual plane that follows top surfaces of the first lead frame and the second lead frame, the first lead frame or the second lead frame is completely surrounded by the thermal element.

5. A solid state light emitter package according to claim 1 comprising a housing component, the housing component being arranged to support the first lead frame, the second lead frame, the thermal element and optionally the solid state light emitter die, and, optionally, the housing component forming the electrically insulating material in between the first lead frame, the thermal element and the second lead frame.

6. A solid state light emitter package according to claim 1 wherein at least one of:

the thermal element is a thermal mass having a high volumetric heat capacitance,

the thermal element is made of a phase change material,

the thermal element is made of material having a relatively high thermal conductivity coefficient, for example, larger than 200 W/mK,

the thermal element is made of a thermally conductive metal.

7. A solid state light emitter package according to claim 1 , wherein the thermal element has a thermal resistance to the surroundings of the solid state light emitter package that is lower than 40 K/W.

8. A solid state light emitter package according to claim 1 , wherein the bridging element is a first wire bond that is electrically coupled to the second lead frame at one end and is electrically coupled to the solid state light emitter die at the other end.

9. A solid state light emitter package according to claim 8 further comprising a second wire bond that is electrically coupled to the first lead frame at one end and is electrically coupled to the solid state light emitter die at the other end.

10. A solid state light emitter package according to claim 1 , wherein the bridging element is formed by the solid state light emitter die that comprises

a first portion that is provided on the first lead frame for forming an electrical connection to the first lead frame,

a second portion that is provided on the second lead frame for forming an electrical connection to the second lead frame, and

a third portion that bridges the electrical insulating material and the thermal element.

11. A lamp comprising a solid state light emitter package according to claim 1 .

12. A luminaire comprising a solid state light emitter package according to claim 1 .

13. Method of manufacturing a solid state light emitter package comprising

obtaining a first lead frame, a second lead frame, a solid state light emitter die, electrical insulating material and a thermal element, said lead frames being capable of receiving power and conducting the power to the solid state light emitter die, the thermal element being capable of absorbing heat or being capable of spreading heat, the thermal element not being in direct thermal contact with a solid state light emitter die,

optionally, obtaining a bridging element,

arranging the first lead frame, the second lead frame, the thermal element and the electrical insulating material such that the first lead frame and the second lead frame are electrically isolated from each other, such that the thermal element is arranged in between the first lead frame and the thermal element is electrically isolated from the first lead frame and the second lead frame by the electrically insulating material,

arranging the solid state light emitter die in the solid state light emitter package whereby at least a part of the solid state light emitter die is arranged on the first lead frame,

and one of:

arranging the bridging element, seen in a top view, above the thermal element and the electrically insulating material and arranging the bridging element in contact with the second lead frame and the solid state light emitter die for providing an electrical connection between the second lead frame and the solid state light emitter die,

arranging the solid state light emitter die, seen in a top view, above the thermal element and the electrically insulating material and also partially on the second lead frame for an electrical connection between the solid state light emitter die and the second lead frame, wherein the part of the solid state light emitter die that is arranged on the first lead frame is also electrically connected to the first lead frame

wherein, seen in a virtual plane that follows top surfaces of the first lead frame and the second lead frame, the thermal element at least partially encloses the first lead frame or the second lead frame to delay heat transfer between the first lead frame and the second lead frame.