IP Library › Granted Patent US 11,158,823
Granted Patent B2
US 11,158,823 · App. 16/497,839 · Granted Oct 26, 2021

Display device and manufacturing method thereof

Inventors: Daiki Nakamura (Kanagawa, JP); Kazuhiko Fujita (Kanagawa, JP)
Assignee: Semiconductor Energy Laboratory Co., Ltd.
H01L51/0097H01L51/5246
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Quick Facts
Patent No.
US 11,158,823
App. No.
16/497,839
Granted
Oct 26, 2021
Kind
B2
Abstract

When a base film used in a flexible display panel is bonded to a resin member for fixing the base film that is curved, the base film has creases by an environmental change such as temperature due to difference in linear expansion coefficient before and after a thermal shock. A buffer plate that is thin enough to be bent is provided between the base film used in a flexible display panel and the resin member. With the use of heat dissipation effect and heat equalization effect of the buffer plate, a structure around the panel capable of resisting the environmental change can be provided.

Claims (29)

1. A display device comprising:

a printed circuit board including a driver circuit;

an organic light-emitting element over a film comprising a first organic resin material;

a member comprising a second organic resin material having a different linear expansion coefficient from that of the first organic resin material; and

a buffer plate,

wherein the member has a curved surface partly and has regions with different thicknesses,

wherein the printed circuit board is electrically connected to the organic light-emitting element with a flexible printed circuit board provided therebetween,

wherein the buffer plate and the member are provided between the printed circuit board and the film,

wherein the buffer plate is provided on the curved surface of the member, and

wherein the film is provided on the buffer plate.

2. The display device according to claim 1 , wherein the shortest distance between the printed circuit board and the organic light-emitting element is 150 μm or more.

3. The display device according to claim 1 ,

wherein the organic light-emitting element is electrically connected to a transistor, and

wherein a display surface including a plurality of the organic light-emitting elements is curved along the curved surface of the member.

4. The display device according to claim 1 , wherein an area of the buffer plate is larger than an area of a display region including the organic light-emitting element.

5. The display device according to claim 1 , wherein the second organic resin material is any one of acrylic, polypropylene, polyvinyl chloride, polycarbonate, and polyamide.

6. A display device comprising:

an organic light-emitting element over a film comprising an organic resin material;

a terminal electrically connected to the organic light-emitting element;

a flexible printed circuit board in contact with and connected to the terminal; and

a printed circuit board connected to the flexible printed circuit board,

wherein one part of the film overlaps with a member having a flat surface with a buffer plate provided therebetween and is substantially parallel to the printed circuit board,

wherein the other part of the film overlaps with a guide portion,

wherein a flat surface of the guide portion is substantially perpendicular to the flat surface of the member,

wherein the flat surface of the guide portion overlaps with a portion where the flexible printed circuit board is in contact with the terminal, and

wherein a curved surface of the guide portion has a curvature radius of 5 mm or more.

7. The display device according to claim 6 , wherein an area of the buffer plate is larger than an area of a display region including the organic light-emitting element.

8. The display device according to claim 6 , wherein the organic resin material is any one of acrylic, polypropylene, polyvinyl chloride, polycarbonate, and polyamide.

9. The display device according to claim 6 , wherein the shortest distance between the printed circuit board and the organic light-emitting element is 150 μm or more.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 26, 2019
From: NAKAMURA, DAIKI; FUJITA, KAZUHIKO
To: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Reel/Frame 050499/0216 →
Priority Claims (1)
JP JP2017-070206 · Mar 31, 2017 · national
Continuity (1)
Related Publication 20200052231A1 · Feb 13, 2020