Photosensitive CTP flexographic printing original plate
The present invention aims to provide a CTP flexographic printing original plate having such high performances that, even under a severe low-temperature condition of 10° C. or lower, no crack is generated in a heat-sensitive mask layer and further that, even when the heat-sensitive mask layer is formed as a thin film, no unevenness is generated in an optical density in transmission. A photosensitive CTP flexographic printing original plate, characterized in that, it comprise at least a support, a photosensitive resin layer and a heat-sensitive mask layer which are sequentially layered, that the heat-sensitive mask layer contains a methoxymethylated polys side resin (A) and a water-soluble polyamide resin (B) containing a basic nitrogen atom in a molecule, and that a glass transition point of the polyimide resin (A) is 0° C. to 30° C.
1. A photosensitive CTP flexographic printing original plate, characterized in that, it comprises at least a support, a photosensitive resin layer and a heat-sensitive mask layer which are sequentially layered, that the heat-sensitive mask layer contains a methoxymethylated polyamide resin (A) and a water-soluble polyamide resin (B) containing a basic nitrogen atom in a molecule, and that a glass transition point of the polyamide resin (A) is 0° C. to 30° C.
2. The photosensitive CTP flexographic printing original plate according to claim 1 , wherein the methoxymethylated polyamide resin (A) is an aliphatic polyamide resin, and wherein a methoxymethylated rate thereof is 15 to 45 molar % to a total amount of nitrogen atoms in an amide group.
3. The photosensitive CTP flexographic printing original plate according to claim 1 , wherein a rate of the methoxymethylated polyamide resin (A) to the water-soluble polyamide resin (B) in the heat-sensitive mask layer is within a range of from 40/60 to 90/10 in terms of a ratio by mass of [polyamide resin (A)]/[polyamide resin (B)].
4. The photosensitive CTP flexographic printing original plate according to claim 1 , wherein the polyamide resin (B) is a copolymerized polyamide containing a piperazine ring in a molecule, and wherein a glass transition point of the polyamide resin (B) is 30 to 60° C.