IP Library › Patent Application 16500171
Patent Application
App. No. 16/500,171

SOLDER MATERIAL

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Quick Facts
Patent No.
US None
App. No.
16/500,171
Abstract

A solder material including 2.5-3.3 wt % Ag, 0.3-0.5 wt % Cu 5.5-6.4 wt % In, and 0.5-1.4 wt % Sb, the remainder being unavoidable impurities and Sn. Specifically, the solder material is a Pb-free solder not including Pb.

Claims (2)

1 . A solder material including 2.5 to 3.3 wt % Ag, 0.3 to 0.5 wt % Cu, 5.5 to 6.4 wt % In, and 0.5 to 1A wt % Sb, a remainder thereof being unavoidable impurities and Sn, wherein the solder material does not substantively include Bi.

2 - 4 . (canceled)

Assignments (3)
MERGER Recorded Dec 6, 2021
From: KEIHIN CORPORATION
To: HITACHI ASTEMO, LTD.
Reel/Frame 058309/0024 →
CORRECTIVE ASSIGNMENT TO CORRECT THE CORRECT SPELLING OF SECOND ASSIGNOR PREVIOUSLY RECORDED AT REEL: 050601 FRAME: 0704. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Dec 5, 2019
From: HIRAI, YUKIHIKO; OOMORI, KOUKI; ISUMI, MITSUHIRO; TSUCHIYA, AYAKA
To: KEIHIN CORPORATION
Reel/Frame 051205/0849 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 2, 2019
From: HIRAI, YUKIHIKO; COMORI, KOUKI; ISUMI, MITSUHIRO; TSUCHIYA, AYAKA
To: KEIHIN CORPORATION
Reel/Frame 050601/0704 →