Bonding device and method of bonding display device using the same
A bonding device includes an upper chamber a pad with which a display substrate is pressable to a substrate; a stage between a lower chamber and the pad and including an opening through which air is introduced; a molding member between an upper chamber and the pad and surrounding the pad and the opening; and a support member connected to the stage The display substrate disposed on the molding member disposes first and second portions of the display substrate overlapping the planar and bending portions of the substrate, respectively, the molding member presses the first portion to the planar portion, and air introduced through the opening, expands the molding member to press the second portion to the bending portion.
1. A method of bonding a display device, the method comprising:
providing a substrate of the display device, the substrate comprising a planar portion and a bending portion which is bent from the planar portion;
providing a display substrate of the display device, on a stage of a bonding device, the providing the display substrate disposing a pad of the bonding device between the stage and the display substrate;
pressing the pad of the bonding device to the display substrate to bond a first portion of the display substrate to the planar portion of the substrate;
while the pad is pressed to the display substrate, providing air through a stage opening defined in the stage and disposed adjacent to the pad, to expand a molding member of the bonding device which surrounds the pad and is between the pad and the display substrate; and
pressing the molding member which is expanded, to the display substrate, to bond a second portion of the display substrate adjacent to the first portion thereof, to the bending portion of the substrate.
2. The method of claim 1 , wherein
the stage opening is provided in plural and comprises a first stage opening and a second stage opening each open at a top surface of the stage, and
the first stage opening and the second stage opening are spaced apart from each other with the pad therebetween along a first direction.
3. The method of claim 2 , wherein
the bending portion of the substrate comprises a first bending portion and a second bending portion which face each other along the first direction, and
the second portion of the display substrate comprises a first display substrate bending portion bonded to the first bending portion and a second display substrate bending portion bonded to the second bending portion.
4. The method of claim 3 , wherein the bonding of the second portion of the display substrate to the bending portion of the substrate comprises:
pressing the first display substrate bending portion to the first bending portion, by the molding member expanded by air provided from the first stage opening; and
pressing the second display substrate bending portion to the second bending portion, by the molding member expanded by air provided from the second stage opening.
5. The method of claim 3 , wherein the stage opening provided in plural further comprises a third stage opening and a fourth stage opening, each open at the top surface of the stage, and
the third stage opening and the fourth stage opening are spaced apart from each other with the pad therebetween along a second direction crossing the first direction.
6. The method of claim 5 , wherein
the bending portion of the substrate further comprises a third bending portion and a fourth bending portion which face each other along the second direction, and
the second portion of the display substrate further comprises:
a third display substrate bending portion bonded to the third bending portion, by pressing of the third display substrate bending portion to the third bending portion by the molding member expanded by the air provided from the third stage opening; and
a fourth display substrate bending portion bonded to the fourth bending portion, by pressing of the fourth display substrate bending portion to the fourth bending portion by the molding member expanded by the air provided from the fourth stage opening.
7. The method of claim 2 , wherein the bonding of the first portion of the display substrate to the planar portion of the substrate comprises:
moving the stage toward the substrate comprising the planar portion and the bending portion, along a thickness direction of the stage, by actuating a support member of the bonding device which is connected to the stage; and
the actuating of the support member moving the pad and the molding member together with the stage to press the first portion of the display substrate to the planar portion of the substrate.
8. The method of claim 7 , further comprising injecting the air into the first stage opening and the second stage opening, through the support member of the bonding device.
9. The method of claim 8 , wherein the air is simultaneously injected into each of the first stage opening and the second stage opening, through the support member.
10. The method of claim 1 , wherein
the providing the substrate comprising the planar portion and the bending portion comprises providing the substrate in an upper chamber of the bonding device, and
the stage of the bonding device is disposed in a lower chamber of the bonding device which faces the upper chamber,
further comprising coupling the upper chamber having the substrate therein, and the lower chamber having the display substrate disposed on the stage, to each other.