Multiple electron beam irradiation apparatus, multiple electron beam irradiation method, and multiple electron beam inspection apparatus
A multiple-electron-beam irradiation apparatus includes a first electrostatic lens, configured using the substrate used as a bias electrode by being applied with a negative potential, a control electrode to which a control potential is applied and a ground electrode to which a ground potential is applied, configured to provide dynamic focusing of the multiple electron beams onto the substrate, in accordance with change of the height position of the surface of the substrate, by generating an electrostatic field, wherein the control electrode is disposed on an upstream side of a maximum magnetic field of the lens magnetic field of the first electromagnetic lens with respect to a direction of a trajectory central axis of the multiple electron beams, and a ground electrode is disposed on an upstream side of the control electrode with respect to the direction of the trajectory central axis.
1. A multiple electron beam irradiation apparatus comprising:
a stage configured to mount thereon a substrate to be irradiated with multiple electron beams;
a first electromagnetic lens, disposed such that a center of a lens magnetic field is located at a height position of a surface of the substrate, configured to focus the multiple electron beams onto the substrate; and
a first electrostatic lens configured using the substrate used as a bias electrode by being applied with a negative potential, a control electrode to which a control potential is applied and a ground electrode to which a ground potential is applied, the first electrostatic lens configured to provide dynamic focusing of the multiple electron beams onto the substrate, in accordance with change of the height position of the surface of the substrate, by generating an electrostatic field,
wherein the control electrode is disposed on an upstream side of a maximum magnetic field of the lens magnetic field of the first electromagnetic lens with respect to a direction of a trajectory central axis of the multiple electron beams, and a ground electrode is disposed on an upstream side of the control electrode with respect to the direction of the trajectory central axis.
2. The apparatus according to claim 1 , further comprising:
a second electromagnetic lens and a third electromagnetic lens which are disposed on an upstream side of the first electrostatic lens with respect to the direction of the trajectory central axis;
a second electrostatic lens disposed in a lens magnetic field of the second electromagnetic lens; and
a third electrostatic lens disposed in a lens magnetic field of the third electromagnetic lens; wherein
a rotation change and a magnification change of an image of the multiple electron beams, which are generated by the dynamic focusing by the first electrostatic lens, are corrected by the second electrostatic lens and the third electrostatic lens.
3. The apparatus according to claim 2 , wherein one of the second electrostatic lens and the third electrostatic lens, which is located upstream with respect to the direction of the trajectory central axis, is disposed at a position conjugate to an image plane of the multiple electron beams.
4. A multiple electron beam irradiation method comprising:
focusing multiple electron beams, which are to irradiate a substrate placed on a stage, onto the substrate by a first electromagnetic lens disposed such that a center of a lens magnetic field is located at a height position of a surface of the substrate; and
dynamically focusing the multiple electron beams onto the substrate, in accordance with change of the height position of the surface of the substrate, by generating an electrostatic field by a first electrostatic lens including a control electrode which is disposed on an upstream side of a maximum magnetic field of the lens magnetic field of the first electromagnetic lens with respect to a direction of a trajectory central axis of the multiple electron beams and to which a control potential is applied, and a ground electrode which is disposed on an upstream side of the control electrode with respect to the direction of the trajectory central axis and to which a ground potential is applied, and using the substrate as a bias electrode by being applied with a negative potential.
5. A multiple electron beam inspection apparatus comprising:
a stage configured to mount thereon a substrate to be irradiated with multiple electron beams;
a first electromagnetic lens, disposed such that a center of a lens magnetic field is located at a height position of a surface of the substrate, configured to focus the multiple electron beams onto the substrate;
a first electrostatic lens configured using the substrate used as a bias electrode by being applied with a negative potential, a control electrode to which a control potential is applied and a ground electrode to which a ground potential is applied, the first electrostatic lens configured to provide dynamic focusing of the multiple electron beams onto the substrate, in accordance with change of the height position of the surface of the substrate, by generating an electrostatic field, wherein the control electrode is disposed on an upstream side of a maximum magnetic field of the lens magnetic field of the first electromagnetic lens with respect to a direction of a trajectory central axis of the multiple electron beams, and a ground electrode is disposed on an upstream side of the control electrode with respect to the direction of the trajectory central axis; and
a multi-detector that detects multiple secondary electron beams, including reflected electrons, emitted from the substrate because the substrate is irradiated with the multiple electron beams.