Board for stringed instrument, acoustic stringed instrument, and method of manufacturing board for stringed instrument
A manufacturing method for a board for a stringed instrument that is used as a top plate or a back plate of an acoustic stringed instrument such as a violin, where the board has a purfling, includes forming, for instance, a groove with a depth that is 20% or more and less than 60% of a thickness of the board for a stringed instrument, filling the groove with a resin in which, for instance, colored particles having a diameter of 3 μm or more and less than 70 μm are dispersed and which has a degree of elongation of 20% or more, removing the resin that has flowed out of the groove, and curing the resin.
1. A board for a stringed instrument, used for a top plate or a back plate of an acoustic stringed instrument, where the board for the stringed instrument has a purfling, the purfling comprising:
a groove formed in the board; and
a resin filled in the groove,
wherein a depth of the groove is 20% or more and less than 60% of a thickness of the board for the stringed instrument.
2. The board for the stringed instrument according to claim 1 , wherein the resin has a degree of elongation of 20% or more.
3. The board for the stringed instrument according to claim 1 , wherein the resin is a urethane resin or a rubber resin.
4. A board for a stringed instrument, used for a top plate or a back plate of an acoustic stringed instrument, where the board for the stringed instrument has a purfling, the purfling comprising:
a groove formed in the board; and
a resin filled in the groove,
wherein the resin includes colored particles having a diameter of 3 μm or more and less than 70 μm, and
wherein the colored particles are dispersed in the resin.
5. A method of manufacturing a board for a stringed instrument that is used for a top plate or a back plate of an acoustic stringed instrument, where the board for the stringed instrument has a purfling, the method comprising:
forming a groove in the board;
filling the groove with a resin;
curing the resin; and
providing a layer that covers a surface of the groove after the forming of the groove in the board and before the filling of the groove with the resin.
6. The method according to claim 5 , wherein the resin has a degree of elongation of 20% or more.
7. The method according to claim 5 , further comprising removing the resin that has flowed out of the groove after the filling of the groove with the resin and before the curing of the resin.