Form board merge

1. A method comprising:

placing, by a computing system, a first form board design into a merged form board design, wherein the first form board design describes a form board configuration for use in manufacturing a first wire harness;

aligning, by the computing system, a second form board design with the merged form board design based, at least in part, on matches between portions of the second form board design and the first form board design, wherein the second form board design describes a form board configuration for use in manufacturing a second wire harness; and

placing, by the computing system, an unmatched portion of the second form board design in the merged form board design based, at least in part, on the alignment of the second form board design with the merged form board design, wherein the merged form board design describes a form board configuration having an overlapping combination of the first form board design and the second form board design for use in manufacturing both the first wire harness and the second wire harness.

2. The method of claim 1 , wherein aligning the second form board design with the merged form board design further comprises:

matching portions of the second form board design to portions of the first form board design; and

merging the matched portions of the second form board design with the merged form board design.

3. The method of claim 2 , wherein matching the portions of the second form board design to the portions of the first form board design further comprises:

comparing a section of the first form board design to the second form board design;

when, based on the comparison, the section of the first form board design matches a section of the second form board design, comparing adjacent sections of the first form board design and the second form board design to identify an extended matched section of the second form board design; and

utilizing the extended matched section to correlate the second form board design to the merged form board design.

4. The method of claim 1 , wherein placing the first form board design into the merged form board design further comprises populating the merged form board design with wiring information from the first form board design, wherein the wiring information includes at least one of wire ends, wire attributes, or multicore data associated with wires.

5. The method of claim 1 , further comprising displaying, by the computing system in a display window, a presentation that includes the first form board design, the second form board design, and the merged form board design, wherein the presentation visually annunciates portions of the merged form board design that correspond the first form board design and the second form board design.

6. The method of claim 1 , wherein placing the first form board design into the merged form board design further comprises inserting links into the merged form board design to identify a correspondence between the first form board design and the merged form board design.

7. The method of claim 1 , wherein the portions of the first form board design and the portions of the second form board design include at least one of a wire bundle, a connector, a wire, a clip, insulation, a run, a grommet, tape, a fixture, or a splice.

8. A system comprising:

a memory device configured to store machine-readable instructions; and

a computing system including one or more processing devices, in response to executing the machine-readable instructions, configured to:

place a first form board design into a merged form board design, wherein the first form board design describes a form board configuration for use in manufacturing a first wire harness;

align a second form board design with the merged form board design based, at least in part, on matches between portions of the second form board design and the first form board design, wherein the second form board design describes a form board configuration for use in manufacturing a second wire harness; and

place an unmatched portion of the second form board design in the merged form board design based, at least in part, on the alignment of the second form board design with the merged form board design, wherein the merged form board design describes a form board configuration having an overlapping combination of the first form board design and the second form board design for use in manufacturing both the first wire harness and the second wire harness.

9. The system of claim 8 , wherein the one or more processing devices, in response to executing the machine-readable instructions, are configured to align the second form board design with the merged form board design by

matching portions of the second form board design to portions of the first form board design; and

merging the matched portions of the second form board design with the merged form board design.

10. The system of claim 9 , wherein the one or more processing devices, in response to executing the machine-readable instructions, are configured to match the portions of the second form board design to the portions of the first form board design by:

comparing a section of the first form board design to the second form board design;

when, based on the comparison, the section of the first form board design matches a section of the second form board design, comparing adjacent sections of the first form board design and the second form board design to identify an extended matched section of the second form board design; and

utilizing the extended matched section to correlate the second form board design to the merged form board design.

11. The system of claim 8 , wherein the one or more processing devices, in response to executing the machine-readable instructions, are configured to populate the merged form board design with wiring information for the placed portions from the first form board design, wherein the wiring information includes at least one of wire ends, wire attributes, or multicore data associated with wires.

12. The system of claim 8 , wherein the one or more processing devices, in response to executing the machine-readable instructions, are configured to display, in a display window, a presentation that includes the first form board design, the second form board design, and the merged form board design, wherein the presentation visually annunciates portions of the merged form board design that correspond the first form board design and the second form board design.

13. The system of claim 8 , wherein the one or more processing devices, in response to executing the machine-readable instructions, are configured to insert links into the merged form board design to identify a correspondence between the first form board design and the merged form board design.

14. An apparatus including a non-transitory memory device storing instructions configured to cause one or more processing devices to perform operations comprising:

placing a first form board design into a merged form board design, wherein the first form board design describes a form board configuration for use in manufacturing a first wire harness;

aligning a second form board design with the merged form board design based, at least in part, on matches between portions of the second form board design and the first form board design, wherein the second form board design describes a form board configuration for use in manufacturing a second wire harness; and

placing an unmatched portion of the second form board design in the merged form board design based, at least in part, on the alignment of the second form board design with the merged form board design, wherein the merged form board design describes a form board configuration having an overlapping combination of the first form board design and the second form board design for use in manufacturing both the first wire harness and the second wire harness.

15. The apparatus of claim 14 , wherein the instructions are configured to cause one or more processing devices to perform operations further comprising:

matching portions of the second form board design to the portions of the first form board design; and

merging the matched portions of the second form board design with the merged form board design.

16. The apparatus of claim 14 , wherein the instructions are configured to cause one or more processing devices to perform operations further comprising:

comparing a section of the first form board design to the second form board design;

when, based on the comparison, the section of the first form board design matches a section of the second form board design, comparing adjacent sections of the first form board design and the second form board design to identify an extended matched section of the second form board design; and

utilizing the extended matched section to correlate the second form board design to the merged form board design.

17. The apparatus of claim 14 , wherein the instructions are configured to cause one or more processing devices to perform operations further comprising populating the merged form board design with wiring information for the placed portions from the first form board design, wherein the wiring information includes at least one of wire ends, wire attributes, or multicore data associated with wires.

18. The apparatus of claim 14 , wherein the instructions are configured to cause one or more processing devices to perform operations further comprising displaying, in a display window, a presentation that includes the first form board design, the second form board design, and the merged form board design, wherein the presentation visually annunciates portions of the merged form board design that correspond the first form board design and the second form board design.

19. The apparatus of claim 14 , wherein the instructions are configured to cause one or more processing devices to perform operations further comprising inserting links into the merged form board design to identify a correspondence between the first form board design and the merged form board design.

20. The apparatus of claim 14 , wherein the portions of the first form board design and the portions of the second form board design include at least one of a wire bundle, a connector, a wire, a clip, insulation, a run, a grommet, tape, a fixture, or a splice.