Copackaging of asic and silicon photonics
A system and method for packing optical and electronic components. A module includes an electronic integrated circuit and a plurality of photonic integrated circuits, connected to the electronic integrated circuit by wire bonds or by wire bonds and other conductors. A metal cover of the module is in thermal contact with the electronic integrated circuit and facilitates extraction of heat from the electronic integrated circuit. Arrays of optical fibers are connected to the photonic integrated circuits.
1. A module, comprising:
a substrate having a top surface and a bottom surface and comprising a plurality of conductive traces and a first plurality of contacts, each of the contacts being on the top surface of the substrate and electrically connected to a corresponding conductive trace of the plurality of conductive traces;
an electronic complementary metal oxide integrated circuit having a top surface and a bottom surface, and comprising:
a second plurality of contacts on the bottom surface of the electronic integrated circuit;
a first plurality of wire bond pads at a first edge of the bottom surface of the electronic integrated circuit; and
a second plurality of wire bond pads at a second edge, opposite the first edge, of the bottom surface of the electronic integrated circuit,
the second plurality of contacts being between the first plurality of wire bond pads and the second plurality of wire bond pads,
each of the contacts of the second plurality of contacts being vertically aligned with and connected to a corresponding contact of the first plurality of contacts,
wherein:
the substrate covers the second plurality of contacts,
the substrate does not cover the first plurality of wire bond pads, and
the substrate does not cover the second plurality of wire bond pads.
2. The module of claim 1 , wherein:
each contact of the first plurality of contacts is secured to a contact of the second plurality of contacts with solder.
3. The module of claim 1 , wherein the module further comprises:
a first plurality of photonic integrated circuit assemblies, each of the first plurality of photonic integrated circuit assemblies having a wire bond pad adjacent to a wire bond pad of the first plurality of wire bond pads; and
a plurality of wire bonds, each of the wire bonds connecting a wire bond pad of a photonic integrated circuit assembly of the first plurality of photonic integrated circuit assemblies to a wire bond pad of the first plurality of wire bond pads.
4. The module of claim 3 , further comprising:
a second plurality of photonic integrated circuit assemblies, each of the second plurality of photonic integrated circuit assemblies having a wire bond pad adjacent to a wire bond pad of the second plurality of wire bond pads; and
a plurality of wire bonds, each of the wire bonds connecting a wire bond pad of a photonic integrated circuit assembly of the second plurality of photonic integrated circuit assemblies to a wire bond pad of the second plurality of wire bond pads.
5. The module of claim 1 , further comprising:
a plurality of photonic integrated circuit assemblies, each of the plurality of photonic integrated circuit assemblies having a wire bond pad adjacent to a wire bond pad of the first plurality of wire bond pads,
wherein a photonic integrated circuit assembly of the plurality of photonic integrated circuit assemblies comprises:
a photonic integrated circuit; and
a mode converter adjacent to the photonic integrated circuit and configured to convert between an optical mode of the photonic integrated circuit and an optical mode of an optical fiber,
wherein the wire bond pad of the photonic integrated circuit assembly is on the photonic integrated circuit.
6. The module of claim 1 , wherein the substrate is an organic substrate.
7. The module of claim 1 , wherein the substrate has the shape of an H.
8. The module of claim 1 , wherein a contact of the first plurality of contacts is secured to a contact of the second plurality of contacts with a connection selected from the group consisting of a copper pillar and a thermocompression stud bump.
9. The module of claim 1 , further comprising:
a plurality of photonic integrated circuit assemblies, each of the plurality of photonic integrated circuit assemblies having a wire bond pad adjacent to a wire bond pad of the first plurality of wire bond pads,
wherein a photonic integrated circuit assembly of the plurality of photonic integrated circuit assemblies comprises:
a V-groove block having a V-groove securing an optical fiber; and
a photonic integrated circuit comprising the wire bond pad,
wherein the photonic integrated circuit has an optical aperture aligned with the optical fiber, and comprises a mode converter configured to convert between an optical mode of the photonic integrated circuit and an optical mode of the optical fiber.
10. The module of claim 1 , further comprising:
a plurality of photonic integrated circuits, each of the plurality of photonic integrated circuits having a wire bond pad adjacent to a wire bond pad of the first plurality of wire bond pads,
wherein a photonic integrated circuit of the plurality of photonic integrated circuits has a V-groove securing an optical fiber.
11. The module of claim 1 , further comprising an upper cover, and having a thermal path, with a thermal resistance of less than 0.1° C./W, between the bottom surface of the electronic integrated circuit and an exterior surface of the upper cover.
12. The module of claim 11 , wherein the upper cover comprises, on an interior surface of the upper cover, a pedestal, the pedestal being part of the thermal path.
13. The module of claim 11 , further comprising a plurality of photonic integrated circuit assemblies, each of the plurality of photonic integrated circuit assemblies being secured to the upper cover.
14. The module of claim 13 , wherein the photonic integrated circuit assemblies are secured to a carrier, and the carrier is secured to the upper cover.
15. The module of claim 14 , wherein the carrier has a thermal resistance, between any one of the photonic integrated circuit assemblies and the exterior surface of the upper cover, of at least 10° C./W.
16. The module of claim 1 , wherein:
the substrate has an otherwise convex shape with one or more cutouts;
a first cutout of the one or more cutouts is over the first plurality of wire bond pads; and
the first cutout is configured to allow the formation of wire bonds to the first plurality of wire bond pads when the electronic integrated circuit is secured to the substrate.
17. The module of claim 1 , wherein:
the substrate further comprises a fifth plurality of contacts, on the bottom surface of the substrate, opposite the top surface of the substrate; and
the contacts of the fifth plurality of contacts form a land grid array.
18. The module of claim 1 , further comprising:
a plurality of photonic integrated circuit assemblies, each of the plurality of photonic integrated circuit assemblies having a wire bond pad adjacent to a wire bond pad of the first plurality of wire bond pads;
a first heater, in thermal contact with a first photonic integrated circuit of a photonic integrated circuit assembly of the plurality of photonic integrated circuit assemblies; and
a temperature sensor, in thermal contact with the first photonic integrated circuit.
19. The module of claim 1 , further comprising:
a plurality of photonic integrated circuit assemblies, each of the plurality of photonic integrated circuit assemblies having a wire bond pad adjacent to a wire bond pad of the first plurality of wire bond pads;
a first heater, integral with a first photonic integrated circuit of a photonic integrated circuit assembly of the plurality of photonic integrated circuit assemblies; and
a temperature sensor, integral with the first photonic integrated circuit.