IP Library Granted Patent US 10,619,191
Granted Patent B2
US 10,619,191 · App. 16/510,212 · Granted Apr 14, 2020

Systems and methods for thermal actuation of microfluidic devices

Inventors: Karthik Ganesan (Ann Arbor, MI); Kalyan Handique (Ypsilanti, MI)
Assignee: HANDYLAB, INC.
C12Q1/6806B01L3/50273B01L3/502715B01L3/502738B01L7/00B01L7/52G01N1/4077B01L2200/02B01L2200/10B01L2200/14B01L2200/147B01L2300/02B01L2300/0681B01L2300/087B01L2300/0819B01L2300/1827B01L2400/049B01L2400/0442B01L2400/0478B01L2400/0677
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Quick Facts
Patent No.
US 10,619,191
App. No.
16/510,212
Granted
Apr 14, 2020
Kind
B2
Abstract

A microfluidic processing device includes a substrate defining a microfluidic network. The substrate is in thermal communication with a plurality of N independently controllable components and a plurality of input output contacts for connecting the substrate to an external controller. Each component has at least two terminals. Each terminal is in electrical communication with at least one contact. The number of contacts required to independently control the N components is substantially less than the total number of terminals. Upon actuation, the components typically heat a portion of the microfluidic network and/or sense a temperature thereof.

Claims (32)

1. A system, comprising:

a first substrate defining a microfluidic network comprising a reaction chamber configured to receive a polynucleotide-containing sample;

a second substrate defining a plurality of resistive heaters and temperature sensors, wherein in use, the first substrate and the second substrate mate to bring the microfluidic network and the plurality of resistive heaters and temperature sensors into thermal communication;

and

wherein each resistive heater is individually actuatable by supplying electric current to an appropriate pair of contacts of a number of contacts, wherein a total of the number of contacts is reduced by structuring at least one contact of a pair of contacts to serve more than one resistive heater while allowing control of each resistive heater independently of other resistive heaters.

2. The system of claim 1 , further comprising a controller.

3. The system of claim 1 , further comprising a processor.

4. The system of claim 1 , further comprising a heat source driver configured to supply a specified amount of current.

5. The system of claim 1 , further comprising a heat source driver configured to supply a particular voltage.

6. The system of claim 1 , wherein a resistive heater and a temperature sensor of the plurality of resistive heaters and temperature sensors are combined.

7. The system of claim 1 , wherein the first substrate comprises at least a first and a second substrate portion defining the microfluidic network therebetween.

8. A system, comprising:

a first substrate defining a microfluidic network comprising at least one thermally actuated component;

a second substrate defining a plurality of resistive heaters and temperature sensors, wherein in use, the first substrate and the second substrate mate to bring the at least one thermally actuated component and the plurality of resistive heaters and temperature sensors into thermal communication;

and

wherein each resistive heater is individually actuatable by supplying electric current to an appropriate pair of contacts of a number of contacts, wherein a total of the number of contacts required for individual control of the plurality of resistive heaters is reduced by arranging the number of contacts in the form of a logical array, wherein each resistive heater comprises two terminals, wherein the total number of contacts required to individually control the resistive heaters is less than the total number of terminals.

9. The system of claim 8 , further comprising a controller.

10. The system of claim 8 , further comprising a processor.

11. The system of claim 8 , further comprising a heat source driver configured to supply a specified amount of current.

12. The system of claim 8 , further comprising a heat source driver configured to supply a particular voltage.

13. The system of claim 8 , wherein a resistive heater and a temperature sensor of the plurality of resistive heaters and temperature sensors are combined.

14. The system of claim 8 , wherein the first substrate comprises at least a first and a second substrate portion defining the microfluidic network therebetween.

15. The system of claim 8 , wherein the at least one thermally actuated component comprises a valve.

16. The system of claim 8 , wherein the at least one thermally actuated component comprises a reaction chamber.

17. A system, comprising:

a first substrate defining a microfluidic network comprising a plurality of thermally actuated components;

a second substrate defining a plurality of resistive heaters and temperature sensors, wherein in use, the first substrate and the second substrate mate to bring the microfluidic network and the plurality of resistive heaters and temperature sensors into thermal communication;

and

wherein each resistive heater is individually actuatable by supplying electric current to an appropriate pair of contacts of a number of contacts, wherein the total number of contacts is reduced by structuring at least one contact of a pair of contacts to serve more than one resistive heater while allowing control of each thermally actuated component independently of other thermally actuated components.

18. The system of claim 17 , wherein at least one thermally actuated component of the plurality of thermally actuated components comprises a valve.

19. The system of claim 17 , wherein at least one thermally actuated component of the plurality of thermally actuated components comprises a reaction chamber.

20. The system of claim 17 , wherein a resistive heater and a temperature sensor of the plurality of resistive heaters and temperature sensors are combined.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 21, 2020
From: GANESAN, KARTHIK; HANDIQUE, KALYAN
To: HANDYLAB, INC.
Reel/Frame 051886/0819 →
Continuity (14)
Continuation 15619753 · Jun 12, 2017
Division 14550126 · Nov 21, 2014
Continuation 13847415 · Mar 19, 2013
Division 11929877 · Oct 30, 2007
Continuation 10910255 · Aug 2, 2004
Continuation In Part 10489404
Continuation In Part 09949763 · Sep 12, 2001
Continuation In Part 09819105 · Mar 28, 2001
Provisional Application 60491264 · Jul 31, 2003
Provisional Application 60491539 · Aug 1, 2003
Provisional Application 60491269 · Jul 31, 2003
Provisional Application 60551785 · Mar 11, 2004
Provisional Application 60553553 · Mar 17, 2004
Related Publication 20200010872A1 · Jan 9, 2020
Cited By (2)
US 12,397,295 US 12,458,972