Protruding SN substrate features for epoxy flow control
Embodiments disclosed herein include electronic packages with underfill flow control features. In an embodiment, an electronic package comprises a package substrate and a plurality of interconnects on the package substrate. In an embodiment, a die is coupled to the package substrate by the plurality of interconnects and a flow control feature is adjacent on the package substrate. In an embodiment, the flow control feature is electrically isolated from circuitry of the electronic package. In an embodiment, the electronic package further comprises an underfill surrounding the plurality of interconnects and in contact with the flow control feature.
1. An electronic package, comprising:
a package substrate;
a plurality of interconnects on the package substrate;
a die coupled to the package substrate by the plurality of interconnects, the die having a footprint;
a flow control feature on the package substrate, wherein the flow control feature is electrically isolated from circuitry of the electronic package, wherein the flow control feature comprises a plurality of substantially parallel lines, and wherein the flow control feature is continuous from a location within the footprint of the die to a location outside of the footprint of the die; and
an underfill surrounding the plurality of interconnects and in contact with the flow control feature.
2. The electronic package of claim 1 , wherein the plurality of substantially parallel lines run in a direction substantially parallel to a direction of flow of the underfill.
3. The electronic package of claim 1 , wherein the plurality of substantially parallel lines run in a direction substantially orthogonal to a direction of flow of the underfill.
4. The electronic package of claim 1 , wherein the flow control feature comprises first lines and second lines, wherein the first lines are substantially orthogonal to the second lines.
5. The electronic package of claim 1 , wherein a first flow control feature is adjacent to a first edge of the die and a second flow control feature is adjacent to a second edge of the die, wherein the first edge is opposite the second edge.
6. The electronic package of claim 5 , wherein the first flow control feature is substantially similar to the second flow control feature.
7. The electronic package of claim 5 , wherein the first flow control feature is different than the second flow control feature.
8. The electronic package of claim 1 , further comprising:
a second die adjacent to the first die, wherein the flow control feature is positioned between the first die and the second die.
9. The electronic package of claim 1 , further comprising:
an underfill source region on the package substrate, wherein the flow control feature comprises a plurality of substantially parallel lines that extend from the underfill source region to an edge of the die.
10. The electronic package of claim 1 , wherein the flow control feature comprises a ring around a perimeter of the die.
11. The electronic package of claim 10 , wherein the underfill contacts an interior sidewall of the ring.
12. The electronic package of claim 11 , wherein the underfill further contacts a top surface of the ring.
13. The electronic package of claim 1 , wherein the flow control feature comprises a pad and solder over the pad.
14. The electronic package of claim 1 , wherein the flow control feature comprises the same material composition as the plurality of interconnects.
15. A package substrate, comprising:
a plurality of dielectric layers;
a plurality of pads arranged in an array over the plurality of dielectric layers;
a plurality of bumps, wherein each bump is over a different one of the plurality of pads;
a flow control feature over the plurality of dielectric layers, wherein the flow control feature comprises one or more lines, and wherein the flow control feature comprises the same material as the plurality of bumps; and
a die having a footprint, wherein the flow control feature is continuous from a location within the footprint of the die to a location outside of the footprint of the die.
16. The package substrate of claim 15 , wherein the one or more lines of the flow control feature run substantially parallel to an edge of the array.
17. The package substrate of claim 15 , wherein the one or more lines of the flow control feature run substantially orthogonal to an edge of the array.
18. The package substrate of claim 15 , wherein the plurality of pads are arranged in a first array and a second array, and wherein the flow control feature is positioned between the first array and the second array.
19. The package substrate of claim 15 , wherein the plurality of bumps comprise a solder.
20. An electronic system, comprising:
a board;
an electronic package electrically coupled to the board, wherein the electronic package comprises a plurality of interconnects arranged in an array and a flow control feature adjacent to the array, wherein the flow control feature comprises a plurality of lines, and wherein the plurality of lines run substantially parallel to an edge of the array or substantially orthogonal to an edge of the array;
a die electrically coupled to the electronic package by the plurality of interconnects, the die having a footprint, wherein the flow control feature is continuous from a location within the footprint of the die to a location outside of the footprint of the die; and
an underfill material surrounding the plurality of interconnects and in contact with the flow control feature.
21. The electronic system of claim 20 , wherein the flow control feature is electrically isolated from circuitry of the electronic system.
22. The electronic system of claim 20 , wherein the flow control feature comprises a solder.
23. An electronic package, comprising:
a package substrate;
a plurality of interconnects on the package substrate;
a die coupled to the package substrate by the plurality of interconnects, the die having a footprint;
a flow control feature on the package substrate, wherein the flow control feature is electrically isolated from circuitry of the electronic package, wherein the flow control feature is continuous from a location within the footprint of the die to a location outside of the footprint of the die, wherein a first flow control feature is adjacent to a first edge of the die and a second flow control feature is adjacent to a second edge of the die, and wherein the first edge is opposite the second edge; and
an underfill surrounding the plurality of interconnects and in contact with the flow control feature.
24. An electronic package, comprising:
a package substrate;
a plurality of interconnects on the package substrate;
a die coupled to the package substrate by the plurality of interconnects, the die having a footprint;
a flow control feature on the package substrate, wherein the flow control feature is electrically isolated from circuitry of the electronic package, and wherein the flow control feature is continuous from a location within the footprint of the die to a location outside of the footprint of the die;
an underfill surrounding the plurality of interconnects and in contact with the flow control feature; and
an underfill source region on the package substrate, wherein the flow control feature comprises a plurality of substantially parallel lines that extend from the underfill source region to an edge of the die.
25. An electronic package, comprising:
a package substrate;
a plurality of interconnects on the package substrate;
a die coupled to the package substrate by the plurality of interconnects, the die having a footprint;
a flow control feature on the package substrate, wherein the flow control feature is electrically isolated from circuitry of the electronic package, wherein the flow control feature is continuous from a location within the footprint of the die to a location outside of the footprint of the die, and wherein the flow control feature comprises a pad and solder over the pad; and
an underfill surrounding the plurality of interconnects and in contact with the flow control feature.
26. An electronic package, comprising:
a package substrate;
a plurality of interconnects on the package substrate;
a die coupled to the package substrate by the plurality of interconnects, the die having a footprint;
a flow control feature on the package substrate, wherein the flow control feature is electrically isolated from circuitry of the electronic package, and wherein the flow control feature is continuous from a location within the footprint of the die to a location outside of the footprint of the die, wherein the flow control feature comprises the same material composition as the plurality of interconnects; and
an underfill surrounding the plurality of interconnects and in contact with the flow control feature.