Radiation imaging apparatus, manufacturing method thereof, and radiation imaging system
A radiation imaging apparatus includes a sensor base, a sensor array that includes a plurality of sensor chips arranged in an array, and in which three or more sensor chips out of the plurality of sensor chips are arranged in one row of the sensor array, a scintillator positioned on a side opposite to the sensor base with respect to the sensor array, a bonding member that bonds the sensor array and the scintillator, and a plurality of bonding sheets that are separated from each other and bond the sensor base and the plurality of sensor chips. Two adjacent sensor chips out of the three or more sensor chips are bonded to the sensor base using separate bonding sheets out of the plurality of bonding sheets.
1. A radiation imaging apparatus,
comprising:
a sensor base;
a sensor array that includes a plurality of sensor chips arranged in an array, and in which three or more sensor chips of the plurality of sensor chips are arranged in one row of the sensor array;
a scintillator positioned on a side opposite to the sensor base with respect to the sensor array;
a bonding member that bonds the sensor array and the scintillator: and
a plurality of bonding sheets that are separated from each other and bond the sensor base and the plurality of sensor chips wherein
two adjacent sensor chips out of the three or more sensor chips are bonded to the sensor base using separate bonding sheets out of the plurality of bonding sheets,
at least some sensor chips of the plurality of sensor chips have a side on which a wiring member is arranged and
on the side on which the member is arranged, the bonding sheet extends beyond the side to the outside of the sensor chip.
2. The radiation imaging apparatus according to claim 1 , wherein a first sensor chip and a second sensor chip from an end of the sensor array are bonded to the sensor base using separate bonding sheets in each row in the sensor array.
3. The radiation imaging apparatus according to claim 2 , wherein the second sensor chip and a third sensor chip from the end of the sensor array are bonded to the sensor base using separate bonding sheets in each row in the sensor array.
4. The radiation imaging apparatus according to claim 1 , wherein two adjacent sensor chips are bonded to the sensor base using separate bonding sheets in an entire region of the sensor array.
5. The radiation imaging apparatus according to claim 1 , wherein the plurality of sensor chips correspond one-to-one with the plurality of bonding sheets.
6. The radiation imaging apparatus according to claim 1 , wherein each of the plurality of sensor chips is shaped as a rectangle, and
among sides of a sensor chip bonded to the sensor base using a bonding sheet that is separate from a bonding sheet of the adjacent sensor chip, on a side facing an adjacent sensor chip an outer periphery of the bonding sheet is positioned inward of the side facing the adjacent sensor chip.
7. The radiation imaging apparatus according claim 1 , wherein at least some sensor chips of the plurality of sensor chips have a side on which a wiring member is arranged the bonding sheets are tape comprising a cushioning core material with adhesive material applied to two opposing sides, and
among two shorter sides of the sensor chip, the side on which the wiring member is arranged is directed towards the outside of the sensor array.
8. The radiation imaging apparatus according to claim 1 , wherein the bonding member has a property of exhibiting adhesion force when heated.
9. A radiation imaging system, comprising:
the radiation imaging apparatus according to claim 1 ; and
a processing unit configured to process a signal acquired by the radiation imaging apparatus.
10. A method for manufacturing a radiation imaging apparatus, comprising the steps of:
forming a sensor panel by banding a plurality of sensor chips to a sensor base using a plurality of bonding sheets separated from each other, such that three or more sensor chips of the plurality of sensor chips are arranged in one row of a sensor array in which the plurality of sensor chips are arranged in an array; and
bonding, the sensor panel and a scintillator using a bonding member such that the scintillator is positioned on a side opposite to the sensor base with respect to the sensor array, wherein
at least some sensor chips of the plurality of sensor chips have a side on which a wiring is arranged, and
forming the sensor panel includes bonding two adjacent sensor chips out of the three or more sensor chips to the sensor base using separate bonding sheets of the plurality of bonding sheets.
11. The method according to claim 10 , wherein the scintillator and the sensor array are bonded through heat pressure bonding.