Efficient IGBT switching
Embodiments of the invention provide IGBT circuit modules with increased efficiencies. These efficiencies can be realized in a number of ways. In some embodiments, the gate resistance and/or voltage can be minimized. In some embodiments, the IGBT circuit module can be switched using an isolated receiver such as a fiber optic receiver. In some embodiments, a single driver can drive a single IGBT. And in some embodiments, a current bypass circuit can be included. Various other embodiments of the invention are disclosed.
1. A solid-state switch circuit module comprising
a circuit board;
a solid-state switch coupled with the circuit board having a gate, a collector, and an emitter;
a driver that provides current to the gate of the solid-state switch coupled with the circuit board; and
a plurality of traces, wherein a first trace of the plurality of traces electrically couples the gate and the driver, wherein the length of the first trace is less than 1 cm, wherein the circuit module is configured to couple with a load between the emitter and the collector.
2. The solid-state switch circuit module according to claim 1 , wherein the solid-state switch includes a manufacturer-specified current rise time, and wherein the voltage at the gate is brought to a full voltage in a time less than the manufacturer-specified current rise time.
3. The solid-state switch circuit module according to claim 1 , wherein the solid-state switch includes a manufacturer-specified current fall time, and wherein the voltage at the gate is discharged in a time less than the manufacturer-specified current fall time.
4. The solid-state switch circuit module according to claim 1 , wherein the solid-state switch includes a manufacturer-specified current rise time, and wherein the voltage between the collector and the emitter is brought to a minimum voltage in a time less than the manufacturer-specified current rise time.
5. The solid-state switch circuit module according to claim 1 , wherein the solid-state switch circuit module includes an internal circuit module inductance that is greater than 50 nH.
6. The solid-state switch circuit module according to claim 5 , wherein the internal circuit module inductance includes either or both an internal solid-state switch inductance and a stray circuit module inductance.
7. The solid-state switch circuit module according to claim 1 , further comprising a current bypass circuit between the collector and the emitter.
8. The solid-state switch circuit module according to claim 1 , wherein the driver is coupled with a single solid-state switch.
9. The solid-state switch circuit module according to claim 1 , wherein the driver is coupled with a pre-driver.
10. The solid-state switch circuit module according to claim 1 , wherein the first trace directly couples the driver with the gate without an additional component.
11. The solid-state switch circuit module according to claim 1 , wherein the first trace directly couples the driver with the gate without a resistor.
12. The solid-state switch circuit module according to claim 1 , wherein the solid-state switch has a manufacturer-specified switching loss, and the switching loss of the solid-state switch circuit module is less than the manufacturer-specified switching loss.
13. The solid-state switch circuit module according to claim 1 , wherein the solid-state switch has a manufacturer-specified current rise time, and the current rise time of the solid-state switch circuit module is less than the manufacturer-specified current rise time.
14. The solid-state switch circuit module according to claim 1 , wherein the solid-state switch has a manufacturer-specified current fall time, and the current fall time of the solid-state switch circuit module is less than the manufacturer-specified current fall time.
15. The solid-state switch circuit module according to claim 1 , wherein the solid-state switch has a manufacturer specified turn-on delay time, and a turn-on delay time of the solid-state switch circuit module is less than the manufacturer specified turn-on delay time.
16. The solid-state switch circuit module according to claim 1 , wherein the solid-state switch has a manufacturer specified turn-off delay time, and a turn-off delay time of the solid-state switch circuit module is less than the manufacturer specified turn-off delay time.
17. The solid-state switch circuit module according to claim 1 , wherein the solid-state switch has a turn-off delay time that is less than 100 ns.
18. The solid-state switch circuit module according to claim 1 , wherein the solid-state switch has a turn-on delay time is less than 40 ns.
19. The solid-state switch circuit module according to claim 1 , wherein the solid-state switch comprises an IGBT.
20. A solid-state switch circuit module comprising
a circuit board;
an solid-state switch coupled with the circuit board having a gate, a collector, and an emitter;
a driver that provides current to the gate of the solid-state switch coupled with the circuit board; and
a plurality of traces, wherein a first trace of the plurality of traces electrically couples the gate and the driver, wherein the length of the first trace is less than 1 cm, wherein the first trace has an inductance less than 100 nH,
wherein the circuit module is configured to couple with a load between the emitter and the collector.
21. A solid-state switch circuit module comprising
a circuit board;
an solid-state switch coupled with the circuit board having a gate, a collector, and an emitter;
a driver that provides current to the gate of the solid-state switch coupled with the circuit board; and
a plurality of traces, wherein a first trace of the plurality of traces electrically couples the gate and the driver, wherein the first trace has a resistance less than 1 ohm, and the length of the first trace is less than 1 cm,
wherein the circuit module is configured to couple with a load between the emitter and the collector.