IP Library Granted Patent US 10,917,996
Granted Patent B1
US 10,917,996 · App. 16/516,312 · Granted Feb 9, 2021

System and method for device level thermal management and electromagnetic interference management

Inventors: Steven Embleton (Austin, TX); Ben John Sy (Austin, TX); Eric Michael Tunks (Austin, TX)
Assignee: Dell Products L.P.
H05K7/20709H05K7/1488H05K9/0062H04W76/10H05K7/20781
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Quick Facts
Patent No.
US 10,917,996
App. No.
16/516,312
Granted
Feb 9, 2021
Kind
B1
Abstract

A data processing device includes an internal volume divided into isolated portions and a thermal management portion. The data processing device further includes an isolator that electromagnetically isolates a first isolated portion of the isolated portions from a second isolated portion of the isolated portions. The data processing device also include a thermal bus, disposed in the thermal management portion, that thermally manages the first portion.

Claims (34)

1. A data processing device, comprising:

an internal volume divided into isolated portions and a thermal management portion,

wherein the isolated portions are electromagnetically isolated from the thermal management portion by at least 90 decibels;

an isolator adapted to electromagnetically isolate a first isolated portion of the isolated portions from a second isolated portion of the isolated portions; and

a thermal bus, disposed in the thermal management portion, adapted to thermally manage the first isolated portion.

2. The data processing device of claim 1 , wherein the thermal bus is further adapted to thermally manage all of the isolated portions.

3. The data processing device of claim 1 , wherein the thermal bus is adapted to thermally manage the first isolated portion by extracting thermal energy from the first isolated portion into the thermal management portion.

4. The data processing device of claim 3 , wherein the thermal bus is disposed on the first isolated portion, wherein the thermal bus extracts thermal energy from the first isolated portion through conduction.

5. The data processing device of claim 3 , wherein the thermal bus is further adapted to extract the thermal energy from the thermal management portion.

6. The data processing device of claim 1 , wherein the thermal management portion is electromagnetically isolated from an ambient environment surrounding the data processing device by at least 90 decibels.

7. The data processing device of claim 1 , further comprising:

a dissipation wall adapted to receive thermal energy from the thermal bus; and

a thermal management system adapted to dissipate heat from the dissipation wall into an ambient environment surrounding the data processing device.

8. The data processing device of claim 1 , wherein the isolator comprises:

a metallized bag adapted to attach to a wall delineating the internal volume.

9. The data processing device of claim 8 , further comprising:

a connector that traverses the wall for providing power to a device disposed within the first isolated portion.

10. The data processing device of claim 9 , wherein the connector comprises an electromagnetic interference filter adapted to reduce a strength of electromagnetic interference generated by the device disposed in the first isolated portion as the electromagnetic interference propagates through the connector.

11. The data processing device of claim 8 , further comprising:

a wireless system, disposed in the first isolated portion, adapted to operably connect to a device disposed in the first isolated portion using a wireless channel.

12. The data processing device of claim 11 , wherein the wireless system comprises an antenna.

13. The data processing device of claim 1 , further comprising:

a thermal sink, disposed in the thermal management portion, adapted to thermally connect to a device disposed in the first isolated portion.

14. The data processing device of claim 13 , wherein the thermal sink is adapted to extract thermal energy from the first isolated portion.

15. The data processing device of claim 14 , wherein the thermal sink is further adapted to transmit the thermal energy to the thermal bus.

16. The data processing device of claim 1 , wherein the first isolated portion is electromagnetically isolated from the second isolated portion by at least 90 decibels.

17. The data processing device of claim 1 , wherein the internal volume is sealed from an ambient environment surrounding the data processing device.

18. The data processing device of claim 1 , wherein none of the isolated portions are adapted to be cooled using convection.

19. The data processing device of claim 1 , wherein all of the isolated portions are adapted to be cooled using conduction.

20. A data processing device, comprising:

an internal volume divided into isolated portions and a thermal management portion;

an isolator adapted to electromagnetically isolate a first isolated portion of the isolated portions from a second isolated portion of the isolated portions,

wherein the isolator comprises a metallized bag adapted to attach to a wall delineating the internal volume; and

a thermal bus, disposed in the thermal management portion, adapted to thermally manage the first isolated portion.

Assignments (9)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053311/0169) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
Reel/Frame 060438/0742 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (050724/0571) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
Reel/Frame 060436/0088 →
RELEASE OF SECURITY INTEREST AT REEL 050406 FRAME 421 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: EMC CORPORATION; DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 058213/0825 →
SECURITY INTEREST Recorded Jun 5, 2020
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 053311/0169 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Oct 15, 2019
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 050724/0571 →
SECURITY AGREEMENT Recorded Sep 17, 2019
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 050406/0421 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 26, 2019
From: EMBLETON, STEVEN; SY, BEN JOHN; TUNKS, ERIC MICHAEL
To: DELL PRODUCTS L.P.
Reel/Frame 049866/0603 →
Cited By (1)
US 12,317,446