Heat treatment method for managing dummy wafer
Dummy running is carried out which performs preheating treatment using halogen lamps and flash heating treatment using flash lamps on a dummy wafer to control the temperature of in-chamber structures including a susceptor and the like. In this process, a wear-and-tear value is calculated by adding up the amounts of electric power inputted to the halogen lamps or the like each time the preheating treatment or the flash heating treatment is performed. The wear-and-tear value is an indicator indicating the degree of deterioration of the dummy wafer. If the wear-and-tear value of the dummy wafer is not less than a predetermined threshold value, an alarm is issued. This allows an operator of a heat treatment apparatus to recognize that the deterioration of the dummy wafer reaches a limit value and to reliably grasp the dummy wafer suffering advanced deterioration.
1. A method of managing a dummy wafer for a heat treatment process, said method comprising the steps of:
(a) calculating a wear-and-tear value by adding up values obtained by multiplying the temperature of a dummy wafer measured when said dummy wafer is heated by irradiation with light from a continuous lighting lamp by a heating time period; and
(b) issuing an alarm when said wear-and-tear value is not less than a predetermined threshold value.
2. A method of managing a dummy wafer for a heat treatment process, said method comprising the steps of:
(a) calculating a wear-and-tear value by adding up the amounts of electric power inputted to a continuous lighting lamp which are measured when a dummy wafer is heated by irradiation with light from said continuous lighting lamp; and
(b) issuing an alarm when said wear-and-tear value is not less than a predetermined threshold value.
3. A method of managing a dummy wafer for a heat treatment process, said method comprising the steps of:
(a) calculating a wear-and-tear value by adding up discharge voltages of a flash lamp measured when a dummy wafer is heated by irradiation with a flash of light from said flash lamp; and
(b) issuing an alarm when said wear-and-tear value is not less than a predetermined threshold value.
4. A method of managing a dummy wafer for a heat treatment process, said method comprising the steps of:
(a) calculating a wear-and-tear value by adding up values obtained by multiplying the front surface temperature of a dummy wafer measured when said dummy wafer is heated by irradiation with a flash of light from a flash lamp by an irradiation time period; and
(b) issuing an alarm when said wear-and-tear value is not less than a predetermined threshold value.
5. A method of managing a dummy wafer for a heat treatment process, said method comprising the steps of:
(a) calculating a first wear-and-tear value, a second wear-and-tear value, a third wear-and-tear value, and a fourth wear-and-tear value,
said first wear-and-tear value being calculated by adding up values obtained by multiplying the temperature of a dummy wafer measured when said dummy wafer is heated by irradiation with light from a continuous lighting lamp by a heating time period,
said second wear-and-tear value being calculated by adding up the amounts of electric power inputted to said continuous lighting lamp which are measured when said dummy wafer is heated by irradiation with light from said continuous lighting lamp,
said third wear-and-tear value being calculated by adding up discharge voltages of a flash lamp measured when said dummy wafer is heated by irradiation with a flash of light from said flash lamp,
said fourth wear-and-tear value being calculated by adding up values obtained by multiplying the front surface temperature of said dummy wafer measured when said dummy wafer is heated by irradiation with a flash of light from said flash lamp by an irradiation time period; and
(b) issuing an alarm when at least one of said first, second, third, and fourth wear-and-tear values is not less than a predetermined threshold value.