Radiation imaging apparatus
A radiation imaging apparatus comprises a radiation sensor configured to convert incident radiation to an electrical signal and a housing configured to encompass the radiation sensor, wherein a holding portion that is shaped as a recess is formed in a back face of the housing, the back face being on a side opposite to a radiation incident surface of the housing, and a member having a lower heat conductivity than a heat conductivity of the back face is arranged at a position corresponding to the holding portion in the back face.
1. A radiation imaging apparatus, comprising:
a radiation sensor configured to convert incident radiation to an electrical signal;
a housing that encompasses the radiation sensor, said housing having a radiation incident surface and a back face on a side opposite to said radiation incident surface, said back face comprising a holding portion shaped as a recess formed therein; and
a member having a lower heat conductivity than a heat conductivity of the back face arranged in the recess configured as an outer piece of the back face.
2. The radiation imaging apparatus according to claim 1 , wherein the member is arranged in a face that is one of faces forming the recess and opposes a side face of the housing that is closest to the recess.
3. The radiation imaging apparatus according to claim 1 , further comprising an electronic component configured to process the electrical signal obtained by the radiation sensor; and
a heat conduction member provided between the electronic component and the housing.
4. The radiation imaging apparatus according to claim 3 , wherein the holding portion is located on a side face side of the housing that is farthest from the electronic component.
5. The radiation imaging apparatus according to claim 1 , wherein the recess has a depth that is greater than a depth of a centroid position of the radiation imaging apparatus in a thickness direction thereof, or that is at least half a thickness of radiation imaging apparatus.
6. The radiation imaging apparatus according to claim 1 , wherein a portion of the holding portion is located within at least 60 mm from a side face of the housing that is closest to the holding portion.
7. The radiation imaging apparatus according to claim 1 , wherein an angle formed between the back face of the housing and a face that is one of faces forming the recess and is closest to a side face of the housing is 120° or less.
8. The radiation imaging apparatus according to claim 1 , wherein the member extends to a side face of the housing.
9. The radiation imaging apparatus according to claim 1 , wherein the back face of the housing is made of a uniform material.
10. A radiation imaging apparatus, comprising:
a radiation sensor configured to convert incident radiation to an electrical signal;
a housing that encompasses the radiation sensor, said housing having a radiation incident surface and a back face on a side opposite to said radiation incident surface, said back face comprising a holding portion shaped as a recess formed therein; and
a member having, a lower heat conductivity than a heat conductivity of the back face arranged in the back face at a position corresponding to the holding portion, wherein
the member is fixed to the radiation imaging apparatus via a heat insulating member.
11. A radiation imaging apparatus, comprising:
a radiation sensor configured to convert incident radiation to an electrical signal;
a housing that encompasses the radiation sensor, said housing having a radiation incident surface and a back face on a side opposite to said radiation incident surface, said back face comprising a holding portion shaped as a recess formed therein;
a wireless communication antenna provided inside the housing; and
a member having a lower heat conductivity than a heat conductivity of the back face arranged in the back face at a position corresponding to the holding portion, wherein
the member is located near a side face of the housing that is closest to the antenna.
12. A radiation imaging apparatus, comprising:
a radiation sensor configured to convert incident radiation to an electrical signal;
a housing that encompasses the radiation sensor, said housing having a radiation incident surface and a back face on a side opposite to said radiation incident surface, said back face comprising a holding portion shaped as a recess formed therein;
a base provided in the housing that supports the radiation sensor; and
a member having a lower heat conductivity than a heat conductivity of the back face arranged in the back face at a position corresponding to the holding portion, wherein
the housing and the base are fixed via the member.
13. A radiation imaging apparatus, comprising:
a radiation sensor configured to convert incident radiation to an electrical signal;
a housing that encompasses the radiation sensor, said housing having a radiation incident surface and a back face on a side opposite to said radiation incident surface, said back face comprising a holding portion shaped as a recess formed therein; and
a member having a lower heat conductivity than a heat conductivity of the back face arranged in the recess and a peripheral region thereof so as to cover the recess, wherein
the member is fixed to the back face in the peripheral region.
14. The radiation imaging apparatus according to claim 13 , wherein the housing comprises a magnesium alloy, and the member comprises a resin.
15. The radiation imaging apparatus according to claim 13 , further comprising an electronic component configured to process the electrical signal obtained by the radiation sensor, wherein
the member is arranged so as to cover a recess formed on a side face side different from a side face side of the housing that is closest to the electronic component.
16. The radiation imaging apparatus according to claim 15 , wherein the electronic component comprises an integrated circuit configured to perform A/D conversion of a signal from the radiation sensor, and a flexible board connecting the integrated circuit to the radiation sensor.
17. A radiation imaging apparatus, comprising:
a radiation sensor configured to convert incident radiation to an electrical signal;
a housing that encompasses the radiation sensor, said housing having a radiation incident surface and a back face on a side opposite to said radiation incident surface, said back face comprising an open-hole portion; and
a member having a lower heat conductivity than a heat conductivity of the back face arranged in the open-hole portion so as to form a recess as a holding.
18. The radiation imaging apparatus according to claim 17 , wherein the member is arranged in the open-hole portion and a peripheral region thereof so as to cover the open-hole portion, and
the member is fixed to the back face in the peripheral region.
19. The radiation imaging apparatus according to claim 18 , wherein the member is fixed to the back face in the peripheral region using a double-sided tape.