IP Library Granted Patent US 11,075,232
Granted Patent B2
US 11,075,232 · App. 16/522,182 · Granted Jul 27, 2021

Display device, manufacturing method of display device, and electronic device

Inventors: Shunpei Yamazaki (Tokyo, JP); Yoshiharu Hirakata (Kanagawa, JP); Takashi Hamada (Kanagawa, JP); Kohei Yokoyama (Kanagawa, JP); Yasuhiro Jinbo (Kanagawa, JP); Tetsuji Ishitani (Kanagawa, JP); Daisuke Kubota (Kanagawa, JP)
Assignee: Semiconductor Energy Laboratory Co., Ltd.
H01L27/1262G02F1/1339G02F1/1368G02F1/133345G02F1/133512G02F1/136213H01L27/1218H01L27/1225H01L27/1255H01L29/78648H01L51/525H01L51/5246H01L27/322H01L27/323H01L51/0024H01L51/5253H01L2251/303
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,075,232
App. No.
16/522,182
Granted
Jul 27, 2021
Kind
B2
Abstract

A display device in which a peripheral circuit portion has high operation stability is provided. The display device includes a first substrate and a second substrate. A first insulating layer is provided over a first surface of the first substrate. A second insulating layer is provided over a first surface of the second substrate. The first surface of the first substrate and the first surface of the second substrate face each other. An adhesive layer is provided between the first insulating layer and the second insulating layer. A protective film in contact with the first substrate, the first insulating layer, the adhesive layer, the second insulating layer, and the second substrate is formed in the vicinity of a peripheral portion of the first substrate and the second substrate.

Claims (36)

1. A display device comprising:

a first substrate; and

a second substrate,

wherein a first surface of the first substrate is provided with a first insulating layer,

wherein a first surface of the second substrate is provided with a second insulating layer,

wherein the first surface of the first substrate and the first surface of the second substrate face each other,

wherein the first substrate has a second surface opposite to the first surface,

wherein the second substrate has a second surface opposite to the first surface,

wherein an adhesive layer is positioned between the first insulating layer and the second insulating layer,

wherein, in the vicinity of a peripheral portion of the first substrate and the second substrate, a protective film covers the first surface, a side surface and the second surface of the first substrate, a side surface of the adhesive layer, and the first surface of the second substrate, and does not cover a side surface of the second substrate, and

wherein a portion of the protective film that covers the side surface of the first substrate overlaps and extends past the side surface of the second substrate.

2. The display device according to claim 1 ,

wherein the protective film is in contact with the side surface of the first substrate and is not in contact with the side surface of the second substrate.

3. The display device according to claim 1 , wherein a transistor, a capacitor, a display element, a light-blocking layer, a coloring layer, and a spacer are between the first surface of the first substrate and the first surface of the second substrate.

4. The display device according to claim 1 , wherein the protective film comprises any one of oxygen, nitrogen and a metal.

5. The display device according to claim 4 , wherein the protective film comprises one selected from the group consisting of aluminum oxide, hafnium oxide, zirconium oxide, titanium oxide, zinc oxide, indium oxide, tin oxide, indium tin oxide, tantalum oxide, silicon oxide, manganese oxide, nickel oxide, erbium oxide, cobalt oxide, tellurium oxide, barium titanate, titanium nitride, tantalum nitride, aluminum nitride, tungsten nitride, cobalt nitride, manganese nitride, hafnium nitride, ruthenium, platinum, nickel, cobalt, manganese and copper.

6. The display device according to claim 2 ,

wherein the protective film is not in contact with the second surface of the second substrate.

7. The display device according to claim 3 , wherein the display element is a liquid crystal element.

8. The display device according to claim 3 , wherein the display element is an organic EL element.

9. An electronic device comprising:

the display device according to claim 1 ; and

a microphone or a speaker.

10. A method for manufacturing a display device, comprising the steps of:

forming a transistor and a first insulating layer over a first surface of a first substrate;

bonding the first substrate and a second substrate with an adhesive layer in a manner that the first surface of the first substrate and a first surface of the second surface face each other;

forming a groove portion by performing a first cutting treatment on the second substrate after bonding the first substrate and the second substrate; and

forming a protective film in the vicinity of a peripheral portion of the first substrate and the second substrate after forming the groove portion, the protective film being in contact with the first substrate, the adhesive layer and the second substrate in the vicinity of the groove portion.

11. The method for manufacturing a display device according to claim 10 ,

wherein the protective film is in contact with the first surface of the first substrate and a second surface of the first substrate, and

wherein the second surface of the first substrate is an opposite surface of the first substrate to the first surface of the first substrate.

12. The method for manufacturing a display device according to claim 10 , wherein the protective film is formed by an atomic layer deposition method.

13. The method for manufacturing a display device according to claim 10 , wherein the protective film comprises one selected from the group consisting of aluminum oxide, hafnium oxide, zirconium oxide, titanium oxide, zinc oxide, indium oxide, tin oxide, indium tin oxide, tantalum oxide, silicon oxide, manganese oxide, nickel oxide, erbium oxide, cobalt oxide, tellurium oxide, barium titanate, titanium nitride, tantalum nitride, aluminum nitride, tungsten nitride, cobalt nitride, manganese nitride, hafnium nitride, ruthenium, platinum, nickel, cobalt, manganese and copper.

14. The method for manufacturing a display device according to claim 11 ,

wherein the protective film is not in contact with a second surface of the second substrate, and

wherein the second surface of the second substrate is an opposite surface of the second substrate to the first surface of the second substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 25, 2019
From: YAMAZAKI, SHUNPEI; HIRAKATA, YOSHIHARU; HAMADA, TAKASHI; YOKOYAMA, KOHEI; JINBO, YASUHIRO; ISHITANI, TETSUJI; KUBOTA, DAISUKE
To: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Reel/Frame 049872/0200 →
Priority Claims (1)
JP 2014-219635 · Oct 28, 2014 · national
Continuity (2)
Division 14922658 · Oct 26, 2015
Related Publication 20190348448A1 · Nov 14, 2019
Cited By (1)
US 12,598,876