Apparatus for direct transfer of semiconductor device die
A semiconductor device die transfer apparatus includes a first frame to hold a wafer tape having a plurality of semiconductor device die disposed on a side of the wafer tape and a second frame to secure a product substrate having a circuit trace thereon. The second frame is configured to secure the product substrate such that the circuit trace is disposed facing the plurality of semiconductor device die on the wafer tape. Additionally, a rotary transfer collet is disposed between the wafer tape and the product substrate. The rotary transfer collet has a rotational axis allowing rotation from a first position facing the wafer tape to pick a die of the plurality of semiconductor device die to a second position facing the circuit trace on the product substrate to release the die, thereby applying the die directly on the product substrate during a transfer operation.
1. A system for performing a direct transfer of a plurality of semiconductor die from a first substrate to a second substrate, the system comprising:
a first conveyance mechanism to convey the first substrate, the first conveyance mechanism including a frame and a counterframe to maintain the first substrate in a stretched condition, and the first conveyance mechanism being movable in at least two directions that are transverse to each other;
a second conveyance mechanism to convey the second substrate, the second conveyance mechanism including a frame and a counterframe to support the second substrate, and the second conveyance mechanism being movable in at least two directions that are transverse to each other;
a transfer mechanism disposed adjacent to the first conveyance mechanism to effectuate the direct transfer, the transfer mechanism including a rotary transfer collet disposed between the first substrate and the second substrate to transfer, via rotation of the rotary transfer collet along a plane that extends transverse to the first substrate and the second substrate, at least one semiconductor die of the plurality of semiconductor die to the second substrate; and
a controller including one or more processors communicatively coupled with the first conveyance mechanism, the second conveyance mechanism, and the transfer mechanism, the controller having executable instructions, which when executed, cause the one or more processors to perform operations including:
determining positions of the plurality of semiconductor die based at least in part on map data, the map data describing the positions of the plurality of semiconductor die of a semiconductor wafer, and
activating the transfer mechanism to perform the direct transfer of the plurality of semiconductor die.
2. The system of claim 1 , wherein the semiconductor wafer is an unsorted die wafer, which is a semiconductor wafer that has been diced to form a multitude of semiconductor device die that are left in place so as to remain in an unsorted state prior to the direct transfer being performed.
3. The system of claim 1 , wherein the map data includes information regarding quality and location of each semiconductor die on the semiconductor die wafer.
4. The system of claim 1 , wherein the operations further include receiving transfer process data and determining to transfer the plurality of semiconductor die based at least in part on a quality of the semiconductor die.
5. The system of claim 4 , wherein the determining includes retrieving information regarding the quality and a location of the plurality of semiconductor die, respectively.
6. The system of claim 1 , wherein the rotary transfer collet attaches to an arm that rotates on an axis extending through a length thereof to rotate the rotary transfer collet.
7. The system of claim 1 , the rotary transfer collet uses vacuum force to pick the die from the first substrate.
8. The system of claim 1 , further comprising a sensor communicatively coupled with the transfer mechanism, the sensor configured to determine a position of the second substrate with respect to the transfer mechanism.
9. The system of claim 8 , wherein one or more processors further perform an operation of conveying at least one of the first substrate or the second substrate to align the position of the second substrate with the transfer mechanism.
10. A semiconductor device die transfer apparatus comprising:
a first frame to hold a wafer tape having a plurality of semiconductor device die disposed on a side of the wafer tape, the first frame being movable in at least two directions that are transverse to each other;
a second frame to secure a product substrate having a circuit trace thereon, the second frame configured to secure the product substrate such that the circuit trace is disposed facing the plurality of semiconductor device die on the wafer tape, and the second frame being movable in at least two directions that are transverse to each other; and
a rotary transfer collet disposed between the wafer tape and the product substrate, the rotary transfer collet having a rotational axis allowing rotation from a first position facing the wafer tape to pick a die of the plurality of semiconductor device die to a second position facing the circuit trace on the product substrate to release the die, thereby applying the die directly on the product substrate during a transfer operation.
11. The semiconductor device die transfer apparatus according to claim 10 , wherein the rotary transfer collet rotates in a plane that is orthogonal to a surface of the wafer tape and the product substrate.
12. The semiconductor device die transfer apparatus according to claim 10 , wherein the rotary transfer collet is attached to an arm that extends between the first frame and the second frame.
13. The semiconductor device die transfer apparatus according to claim 12 , wherein the arm rotates on an axis extending through a length thereof to rotate the rotary transfer collet.
14. The semiconductor device die transfer apparatus according to claim 10 , wherein the second frame includes a first clamping member and a second clamping member to clamp therebetween the product substrate.
15. The semiconductor device die transfer apparatus according to claim 10 , wherein the rotary transfer collet uses vacuum force to pick the die from the wafer tape.
16. The semiconductor device die transfer apparatus according to claim 10 , wherein the rotary transfer collet pivots 360 degrees.
17. The semiconductor device die transfer apparatus according to claim 10 , wherein the rotary transfer collet is a first rotary transfer collet, and
wherein the semiconductor device die transfer apparatus further comprises a second rotary transfer collet between the wafer tape and the product substrate.
18. A system for performing a direct transfer of a plurality of semiconductor die from a first substrate to a second substrate, the system comprising:
a first conveyance mechanism to convey the first substrate, the first conveyance mechanism including a frame and a counterframe to maintain the first substrate in a stretched condition, and the first conveyance mechanism being movable in at least two directions that are transverse to each other;
a second conveyance mechanism to convey the second substrate, the second conveyance mechanism including a frame and a counterframe to support the second substrate, and the second conveyance mechanism being movable in at least two directions that are transverse to each other;
a rotary transfer collet disposed between the first substrate and the second substrate, the rotary transfer collet having a rotational axis allowing rotation from a first position facing the first substrate to pick a die of the plurality of semiconductor device die to a second position facing the second substrate to release the die, thereby applying the die directly on the second substrate during a transfer operation;
a controller including one or more processors communicatively coupled with the first conveyance mechanism, the second conveyance mechanism, and the rotary transfer collet, the controller having executable instructions, which when executed, cause the one or more processors to perform operations including:
determining positions of the plurality of semiconductor die based at least in part on map data, the map data describing the positions of the plurality of semiconductor die of a semiconductor wafer,
conveying at least one of the first substrate or the second substrate such that the first substrate, the second substrate, and the rotary transfer collet are in a direct transfer position, and
activating the rotary transfer collet to perform the direct transfer of the plurality of semiconductor die.
19. The system of claim 18 , wherein the rotary transfer collet uses vacuum force to pick the die from the first substrate.
20. The system of claim 18 , wherein the rotary transfer collet pivots 360 degrees.