Interposer printed circuit boards for power modules
Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board having a surface, an electrical component mounted on the surface, a pin mounted on the surface, and an interposer printed circuit board mounted on the surface. The electrical component may have a first height orthogonal to the surface. The pin may have a second height orthogonal to the surface, where the second height is greater than the first height. The interposer printed circuit board may comprise a pad and an outer solder bump positioned on the pad. The outer solder bump may have a third height orthogonal to the surface, where the third height is greater than the first height.
1. A direct current (DC) to direct current (DC) power converter comprising:
a printed circuit board having a surface;
an electrical component of a power conversion circuit mounted on the surface;
a pin mounted on the surface and configured to transmit power signals; and
an interposer printed circuit board mounted on the surface, the interposer printed circuit board comprising a pad that is configured to transmit control signals.
2. The DC-to-DC power converter of claim 1 , wherein the pin is a discrete pin with greater thermal and electrical conductivity than a signal path through the interposer circuit board.
3. The DC-to-DC power converter of claim 1 , wherein the pin is gold-plated.
4. The DC-to-DC power converter of claim 1 , wherein:
the electrical component has a first height orthogonal to the surface;
the pin has a second height orthogonal to the surface, the second height being greater than the first height; and
an outer solder bump positioned on the pad at a third height orthogonal to the surface, the third height being greater than the first height.
5. The DC-to-DC power converter of claim 4 , wherein the third height is equal to the second height after a reflow soldering process alters the outer solder bump.
6. The DC-to-DC power converter of claim 4 , further comprising an inner solder bump positioned between the interposer circuit board and the surface of the printed circuit board, wherein the third height is equal to the second height after a reflow soldering process alters the inner and outer solder bumps.
7. A direct current (DC) to direct current (DC) power converter comprising:
a printed circuit board having a surface;
an electrical component mounted on the surface, the electrical component having a first height orthogonal to the surface;
a pin mounted on the surface, the pin having a second height orthogonal to the surface, the second height being greater than the first height; and
an interposer printed circuit board mounted on the surface, the interposer printed circuit board comprising a pad and an outer solder bump positioned on the pad, wherein the outer solder bump is positioned at a third height orthogonal to the surface, the third height being greater than the first height.
8. The DC-to-DC power converter of claim 7 , wherein the third height is equal to the second height after a reflow soldering process alters the outer solder bump.
9. The DC-to-DC power converter of claim 7 , further comprising an inner solder bump positioned between the interposer printed circuit board and the surface of the printed circuit board.
10. The DC-to-DC power converter of claim 9 , wherein the third height is equal to the second height after a reflow soldering process alters the inner and outer solder bumps.
11. The DC-to-DC power converter of claim 7 , wherein the pin is a discrete pin with greater thermal and electrical conductivity than a signal path through the interposer circuit board.
12. The DC-to-DC power converter of claim 11 , wherein the pin is configured to transmit power signals.
13. The DC-to-DC power converter of claim 7 , wherein the pin is gold plated.
14. The DC-to-DC power converter of claim 7 , wherein the pad is configured to transmit control signals.
15. The DC-to-DC power converter of claim 7 , wherein the interposer printed circuit board comprises a plurality of top side pads and a plurality of bottom side pads, each of the plurality of top side pads being aligned with one of the plurality of bottom side pads.
16. The DC-to-DC power converter of claim 7 , wherein the pin is configured to transmit power signals between the printed circuit board and a motherboard without the power signals passing through the interposer printed circuit board.
17. The DC-to-DC power converter of claim 1 , wherein the pin is configured to transmit power signals between the printed circuit board and a motherboard without the power signals passing through the interposer printed circuit board.