Interposer printed circuit boards for power modules
Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board, an electrical component mounted on a surface of the printed circuit board, and an interposer printed circuit board mounted on the surface of the printed circuit board. The interposer printed circuit board may comprise a first signal path to transmit a first electrical signal and a second signal path to transmit a second electrical signal that is different from the first electrical signal. The interposer printed circuit board may be configured to provide a standoff to prevent the electrical component from contacting a motherboard when the printed circuit board assembly is mounted to the motherboard.
1. A direct current (DC) to direct current (DC) power converter comprising:
a power conversion circuit comprising (i) at least one of an inductor and a transformer mounted on a first surface and (ii) an additional electrical component mounted on a second surface opposite the first surface; and
an interposer printed circuit board mounted on the second surface, the interposer printed circuit board comprising:
a plurality of layers;
a first signal conductor comprising a first top pad and a first bottom pad and defining a first signal path extending between the first top pad and the first bottom pad to transmit a first power signal at a first current;
a second signal conductor comprising a second top pad and a second bottom pad and defining a second signal path extending between the second top pad and the second bottom pad to transmit a second power signal at a second current that is different from the first current, wherein the first power signal is converted to the second power signal by the power conversion circuit; and
at least one control signal conductor defining at least one control signal path to transmit control signals between the power conversion circuit and a motherboard when the DC-to-DC power converter is mounted on the motherboard, the at least one control signal conductor comprising a rerouting layer at least partially positioned along at least one layer of the plurality of layers;
wherein the interposer printed circuit board does not contact the additional electrical component and is configured to provide a standoff to prevent the additional electrical component from contacting the motherboard when the DC-to-DC power converter is mounted to the motherboard.
2. The DC-to-DC power converter of claim 1 , wherein:
the first top pad is aligned with the first bottom pad; and
the second top pad is aligned with the second bottom pad.
3. The DC-to-DC power converter of claim 1 , wherein each of the first and second signal paths includes at least two vias per pad to carry a respective current through the interposer printed circuit board.
4. The DC-to-DC power converter of claim 1 , wherein the additional electrical component extends through a cut-out defined in the interposer printed circuit board.
5. The DC-to-DC power converter of claim 1 , wherein the interposer printed circuit board is a first interposer circuit board, wherein the DC-to-DC power converter further comprises a second interposer circuit board, and wherein the additional electrical component extends through a space defined between the first and second interposer printed circuit boards.
6. The DC-to-DC power converter of claim 1 , wherein the second current has a greater magnitude than the first current.
7. The DC-to-DC power converter of claim 6 , wherein the first signal path includes at least one via for conducting the first current, and wherein the second signal path includes at least two vias for conducting the second current, the second signal path having more vias than the first signal path.
8. The DC-to-DC power converter of claim 6 , wherein the first signal path includes a number of vias for conducting the first current, and wherein the second signal path includes a number of vias for conducting the second current, the number of vias of the second signal path being at least twice the number of vias of the first signal path.
9. The DC-to-DC power converter of claim 1 , wherein the interposer printed circuit board does not include discrete pins.
10. The DC-to-DC power converter of claim 1 , wherein the interposer printed circuit board comprises at least one discrete pin coupled to at least one of the first signal conductor, the second signal conductor, or the control signal conductor.
11. A direct current (DC) to direct current (DC) power converter comprising:
a printed circuit board;
an electrical component mounted on a surface of the printed circuit board; and
an interposer printed circuit board mounted on the surface of the printed circuit board, the interposer printed circuit board comprising:
an interposer printed circuit board mounted on the surface of the printed circuit board, the interposer printed circuit board comprising:
a plurality of layers;
a first signal conductor comprising a first top pad and a first bottom pad and defining a first signal path extending between the first top pad and the first bottom pad to transmit a first electrical signal at a first current;
a second signal conductor comprising a second top pad and a second bottom pad and defining a second signal path extending between the second top pad and the second bottom pad to transmit a second electrical signal at a second current that is different from the first current, wherein the first power signal is converted to the second power signal by the power conversion circuit; and
at least one control signal conductor defining at least one control signal path to transmit control signals between the printed circuit board and a motherboard when the DC-to-DC power converter is mounted on the motherboard, the at least one control signal conductor comprising a rerouting layer at least partially positioned along at least one layer of the plurality of layers;
wherein the interposer printed circuit board does not contact the electrical component and is configured to provide a standoff to prevent the electrical component from contacting a motherboard when the DC-to-DC power converter is mounted to the motherboard.
12. The DC-to-DC power converter of claim 11 , wherein:
that the first top pad is aligned with the first bottom pad; and
the second top pad is aligned with the second bottom pad.
13. The DC-to-DC power converter of claim 12 , wherein each of the first and second signal paths includes at least two vias per pad to carry a respective current through the interposer printed circuit board.
14. The DC-to-DC power converter of claim 11 , wherein:
the first bottom pad is not aligned with the first top pad; and
the second bottom pad is aligned with the second top pad.
15. The DC-to-DC power converter of claim 11 , wherein the electrical component extends through a cut-out defined in the interposer printed circuit board.
16. The DC-to-DC power converter of claim 11 , wherein the interposer printed circuit board is a first interposer circuit board, wherein the printed circuit board assembly further comprises a second interposer circuit board, and wherein the electrical component extends through a space defined between the first and second interposer printed circuit boards.
17. The DC-to-DC power converter of claim 11 , further comprising at least one of an inductor and a transformer mounted to the printed circuit board opposite the electrical component.
18. The DC-to-DC power converter of claim 11 , wherein the second current is greater than the first current.
19. The DC-to-DC power converter of claim 18 , wherein the first signal path includes at least one via for conducting the first current, and wherein the second signal path includes at least two vias for conducting the second current, the second signal path having more vias than the first signal path.
20. The DC-to-DC power converter of claim 11 , wherein the interposer printed circuit board does not include discrete pins.