IP Library Granted Patent US 11,603,480
Granted Patent B2
US 11,603,480 · App. 16/528,707 · Granted Mar 14, 2023

Composition for underlayer film formation, underlayer film for directed self-assembled film and forming method thereof, and directed self-assembly lithography process

Inventors: Hiroyuki Komatsu (Tokyo, JP); Motohiro Shiratani (Tokyo, JP); Miki Tamada (Tokyo, JP)
Assignee: JSR CORPORATION
C09D125/14C08F212/08C08F220/14C08L53/00C08L53/02C09D133/14G03F7/11
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Quick Facts
Patent No.
US 11,603,480
App. No.
16/528,707
Granted
Mar 14, 2023
Kind
B2
Abstract

A composition includes a polymer and a solvent. The polymer (A) satisfies at least one of the conditions (i) and (ii): (i) having in one terminal part of a main chain a block of a first structural unit that includes an amino group; and (ii) having a sulfur atom bonding to one end of the main chain, wherein a monovalent group that includes an amino group bonds to the sulfur atom.

Claims (62)

1. A composition, comprising:

a polymer; and

a solvent,

wherein

the polymer comprises a terminal structure represented by formula (1):

wherein, in the formula (1):

R 1 represents a hydrogen atom, a fluorine atom or a monovalent organic group having 1 to 20 carbon atoms;

R 2 represents a single bond, —O—,—COO—or —CONH—;

A 1 represents a monovalent group comprising an amino group;

X represents a hydrogen atom, —SH or —S—A 11 , wherein A 11 represents a monovalent group comprising an amino group;

n is an integer of no less than 2, being number of structural units each represented by (—CH 2 —C(R 1 )(R 2 -A 1 )-); and

* denotes a bonding site to a moiety other than the terminal structure represented by the formula (1) in the main chain of the polymer, and a proportion of the structural units represented by (—CH 2 —C(R 1 )(R 2 -A 1 )-) with respect to total structural units constituting the polymer is greater than 0% and no greater than 30 mol %.

2. The composition according to claim 1 , wherein A 1 and A 11 in the formula (1) are each represented by formula (A):

wherein in the formula (A),

R 3 represents a single bond or a divalent hydrocarbon group having 1 to 20 carbon atoms, and

R 4 and R 5 each independently represent: a hydrogen atom; a monovalent hydrocarbon group having 1 to 20 carbon atoms; or a group having —O—, —CO—, —NH— or a combination thereof between adjacent carbon atoms of the monovalent hydrocarbon group having 1 to 20 carbon atoms, or

at least two of R 3 , R 4 and R 5 taken together represent a part of: an aliphatic heterocyclic structure having 3 to 20 ring atoms; or an aromatic heterocyclic structure having 5 to 20 ring atoms, together with the nitrogen atom to which the at least two of R 3 , R 4 and R 5 bond.

3. The composition according to claim 1 , wherein

the polymer comprises a structural unit derived from a first monomer and a structural unit derived from a second monomer having higher polarity than the first monomer, and

the structural units are in a random arrangement.

4. The composition according to claim 3 , wherein the first monomer is a vinyl aromatic compound.

5. The composition according to claim 3 , wherein the second monomer is (meth)acrylic acid or a (meth)acrylic acid ester.

6. A composition, comprising:

a polymer; and

a solvent,

wherein the polymer comprises a terminal structure represented by formula (2):

*—S—A 2   (2)

wherein, in the formula (2):

A 2 represents a monovalent group comprising an amino group; and

* denotes a bonding site to an end of the main chain of the polymer.

7. The composition according to claim 6 , wherein A 2 in the formula (2) is represented by formula (A):

wherein in the formula (A),

R 3 represents a single bond or a divalent hydrocarbon group having 1 to 20 carbon atoms, and

R 4 and R 5 each independently represent: a hydrogen atom; a monovalent hydrocarbon group having 1 to 20 carbon atoms; or a group having —O—, —CO—, —NH— or a combination thereof between adjacent carbon atoms of the monovalent hydrocarbon group having 1 to 20 carbon atoms, or

at least two of R 3 , R 4 and R 5 taken together represent a part of: an aliphatic heterocyclic structure having 3 to 20 ring atoms; or an aromatic heterocyclic structure having 5 to 20 ring atoms, together with the nitrogen atom to which the at least two of R 3 , R 4 and R 5 bond.

8. The composition according to claim 6 , wherein

the polymer comprises a structural unit derived from a first monomer and a structural unit derived from a second monomer having higher polarity than the first monomer, and

the structural units are in a random arrangement.

9. The composition according to claim 8 , wherein the first monomer is a vinyl aromatic compound.

10. The composition according to claim 8 , wherein the second monomer is (meth)acrylic acid or a (meth)acrylic acid ester.

11. An underlayer film for a directed self-assembled film in a directed self-assembly lithography process, formed from the composition according to claim 1 .

12. The underlayer film according to claim 11 , wherein a static contact angle of pure water on a surface of the underlayer film is no less than 70° and no greater than 90°.

13. A method of forming an underlayer film for a directed self-assembled film in a directed self-assembly lithography process, the method comprising applying the composition according to claim 1 directly or indirectly on a substrate to provide the underlayer film.

14. A directed self-assembly lithography process comprising:

applying the composition according to claim 1 directly or indirectly on an upper face side of a substrate to provide an underlayer film;

applying a composition capable of forming a directed self-assembled film on the upper face side of the underlayer film to form a coating film;

allowing phase separation of the coating film to form the directed self-assembled film having a plurality of phases;

removing at least a part of the plurality of phases of the directed self-assembled film to form a miniaturized pattern; and

etching the substrate using the miniaturized pattern as a mask.

15. The directed self-assembly lithography process according to claim 14 , further comprising, prior to the applying of the composition capable of forming a directed self-assembled film, forming a prepattern having recessed portions on the upper face side of the underlayer film or the substrate, wherein

in the applying of the composition capable of forming a directed self-assembled film, the recessed portions of the prepattern are filled with the composition capable of forming a directed self-assembled film.

16. An underlayer film for a directed self-assembled film in a directed self-assembly lithography process, formed from the composition according to claim 6 .

17. A method of forming an underlayer film for a directed self-assembled film in a directed self-assembly lithography process, the method comprising applying the composition according to claim 6 directly or indirectly on a substrate to provide the underlayer film.

18. A directed self-assembly lithography process comprising:

applying the composition according to claim 6 directly or indirectly on an upper face side of a substrate to provide an underlayer film;

applying a composition capable of forming a directed self-assembled film on the upper face side of the underlayer film to form a coating film;

allowing phase separation of the coating film to form the directed self-assembled film having a plurality of phases;

removing at least a part of the plurality of phases of the directed self-assembled film to form a miniaturized pattern; and

etching the substrate using the miniaturized pattern as a mask.

19. The directed self-assembly lithography process according to claim 18 , further comprising, prior to the applying of the composition capable of forming a directed self-assembled film, forming a prepattern having recessed portions on the upper face side of the underlayer film or the substrate, wherein

in the applying of the composition capable of forming a directed self-assembled film, the recessed portions of the prepattern are filled with the composition capable of forming a directed self-assembled film.

20. The directed self-assembly lithography process according to claim 18 , which is suitable to form a line-and-space pattern or a hole pattern.

Assignments (3)
MERGER Recorded Mar 23, 2026
From: JSR CORPORATION
To: JICC-02, CO., LTD
Reel/Frame 075191/0149 →
CHANGE OF NAME Recorded Mar 23, 2026
From: JICC-02 CO., LTD
To: JSR CORPORATION
Reel/Frame 075192/0023 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 1, 2019
From: KOMATSU, HIROYUKI; SHIRATANI, MOTOHIRO; TAMADA, MIKI
To: JSR CORPORATION
Reel/Frame 049925/0597 →
Priority Claims (1)
JP JP2018-147144 · Aug 3, 2018 · national
Continuity (1)
Related Publication 20200040209A1 · Feb 6, 2020