Method of forming fin-shaped structure
A fin-shaped structure includes a substrate having a first fin-shaped structure located in a first area and a second fin-shaped structure located in a second area, wherein the second fin-shaped structure includes a ladder-shaped cross-sectional profile part. The present invention also provides two methods of forming this fin-shaped structure. In one case, a substrate having a first fin-shaped structure and a second fin-shaped structure is provided. A treatment process is performed to modify an external surface of the top of the second fin-shaped structure, thereby forming a modified part. A removing process is performed to remove the modified part through a high removing selectivity to the first fin-shaped structure and the second fin-shaped structure, and the modified part, thereby the second fin-shaped structure having a ladder-shaped cross-sectional profile part is formed.
1. A method of forming a fin-shaped structure, comprising:
providing a substrate having a first fin-shaped structure located in a first area and a second fin-shaped structure located in a second area;
forming a first gate across the first fin-shaped structure and a second gate across the second fin-shaped structure, wherein the first gate sequentially comprises a first dielectric layer and a first sacrificial gate covering the first fin-shaped structure, and the second gate sequentially comprises a second dielectric layer and a second sacrificial gate covering the second fin-shaped structure;
removing the first sacrificial gate and the second sacrificial gate, thereby exposing the first dielectric layer and the second dielectric layer;
covering a mask in the first area but exposing the second area;
performing a removing process to remove an external surface of a top part of the second fin-shaped structure; and
removing the mask.
2. The method of forming a fin-shaped structure according to claim 1 , further comprising:
forming a dielectric layer covering the first fin-shaped structure and the second fin-shaped structure after the mask is removed.
3. The method of forming a fin-shaped structure according to claim 1 , wherein the external surface of the top part of the second fin-shaped structure and the whole second dielectric layer are removed by the removing process.
4. The method of forming a fin-shaped structure according to claim 1 , further comprising:
removing the first dielectric layer completely after the mask is removed.
5. The method of forming a fin-shaped structure according to claim 1 , further comprising:
removing the first dielectric layer and the second dielectric layer completely before covering the mask.
6. The method of forming a fin-shaped structure according to claim 1 , further comprising:
forming an isolation structure beside the first fin-shaped structure of the first area and beside the second fin-shaped structure of the second area respectively after the substrate is provided, wherein a top part of the isolation structure of the second area is also removed while the removing process is performed.
7. The method of forming a fin-shaped structure according to claim 1 , wherein the removing process has no removing selectivity to the isolation structure and the second fin-shaped structure.