Wireless sensing and control of temperature using magnetic fields
A method and system for sensing and controlling temperature with magnetic fields are provided. The method comprises placing a compound in thermal communication with a number of temperature or heat sources and placing a number of magnets in thermal communication with the compound. A number of magnetic sensors are placed in electromagnetic communication with the number of magnets. Changes in the magnetic field of the magnets are detected by the sensors and used to determine the temperature of the compound according to a model that maps magnetic field characteristics to temperature. The amount of cure of the compound can then be estimated from the temperature. The temperature or heat sources are controlled in response to the temperature measurement and the estimated amount of cure of the compound.
1. A method of sensing and controlling temperature, the method comprising:
placing a compound in thermal communication with a number of temperature or heat sources;
placing a number of magnets in thermal communication with the compound;
placing a number of magnetic sensors in electromagnetic communication with the number of magnets;
detecting, by the magnetic sensors, changes in the magnetic field of the number of magnets;
determining, by a number of processors, a temperature of the compound according to a model that maps magnetic field characteristics to temperature;
estimating, by the number of processors, an amount of cure of the compound according to the temperature; and
controlling, by the number of processors, the temperature or heat sources in response to the temperature and the estimated amount of cure.
2. The method of claim 1 , wherein the compound is an exothermic polymer.
3. The method of claim 1 , wherein the amount of cure is estimated from the temperature inside the compound using an extended Kalman filter.
4. The method of claim 3 , wherein the extended Kalman filter is a continuous-time, discrete-sample extended Kalman filter.
5. The method of claim 1 , wherein the compound comprises a number of layers.
6. The method of claim 5 , wherein the number of magnets are embedded in each layer.
7. The method of claim 1 , wherein the number of magnets comprise permanent magnets.
8. The method of claim 1 , further comprising controlling the temperature or heat sources according to a specified desired internal temperature of the compound.
9. The method of claim 1 , wherein controlling the temperature or heat sources further comprises nonlinear feedback control.
10. The method of claim 9 , wherein an internal temperature trajectory over time is selected to minimize temperature gradients within the compound during curing.
11. The method of claim 9 , wherein an internal temperature trajectory over time is selected to minimize total cure time.
12. The method of claim 9 , wherein an internal temperature trajectory over time is selected to minimize shrinkage or internal stresses.
13. The method of claim 9 , wherein an internal temperature trajectory over time is selected to avoid high peak temperatures that damage the compound.
14. The method of claim 1 , wherein the compound is located:
inside a mold;
on top of a flat horizontal surface; or
between a number of objects;
wherein the mold, flat surface, or objects are coupled to the temperature or heat sources.
15. A system for sensing and controlling temperature, the system comprising:
a number of surfaces configured to hold a compound;
a number of temperature or heat sources coupled to the number of surfaces;
a number of magnets positioned to be in thermal communication with the compound held by the number of surfaces;
a number of magnetic sensors positioned to be in electromagnetic communication with the number of magnets;
a number of processors in communication with the number of magnetic sensors and temperature or heat sources, wherein the number of processors are configured to execute program instructions to:
detect, via the magnetic sensors, changes in the magnetic field of the number of magnets;
determine a temperature of the compound held by the number of surfaces according to a model that maps magnetic field characteristics to temperature;
estimate an amount of cure of the compound according to the temperature; and
control the temperature or heat sources in response to the temperature and the estimated amount of cure.
16. The system of claim 15 , wherein the compound is an exothermic polymer.
17. The system of claim 15 , wherein the amount of cure is estimated from the temperature inside the compound using an extended Kalman filter.
18. The system of claim 17 , wherein the extended Kalman filter is a continuous-time, discrete-sample extended Kalman filter.
19. The system of claim 15 , wherein the compound comprises a number of layers.
20. The system of claim 19 , wherein a number of magnets are embedded in each layer.
21. The system of claim 15 , wherein the number of surfaces holding the compound comprise:
a mold;
a flat horizontal surface; or
a number of objects between which the compound is located.